-
4
-
-
0142211287
-
Mechanical behavior of nanocrystalline metals and alloys
-
Kumar K.S., Van Swygenhoven H., and Suresh S. Mechanical behavior of nanocrystalline metals and alloys. Acta Mater 51 (2003) 5743-5774
-
(2003)
Acta Mater
, vol.51
, pp. 5743-5774
-
-
Kumar, K.S.1
Van Swygenhoven, H.2
Suresh, S.3
-
5
-
-
33748176041
-
Deformation in nanocrystalline metals
-
Van Swygenhoven H., and Weertman J.R. Deformation in nanocrystalline metals. Mater Today 9 5 (2006) 24-31
-
(2006)
Mater Today
, vol.9
, Issue.5
, pp. 24-31
-
-
Van Swygenhoven, H.1
Weertman, J.R.2
-
6
-
-
34249944526
-
Toward a quantitative understanding of mechanical behavior of nanocrystalline metals
-
Dao M., Lu L., Asaro R.J., De Hosson J.T.M., and Ma E. Toward a quantitative understanding of mechanical behavior of nanocrystalline metals. Acta Mater 55 (2007) 4041-4065
-
(2007)
Acta Mater
, vol.55
, pp. 4041-4065
-
-
Dao, M.1
Lu, L.2
Asaro, R.J.3
De Hosson, J.T.M.4
Ma, E.5
-
7
-
-
4043135984
-
Sample dimensions influence strength and crystal plasticity
-
Uchic M.D., Dimiduk D.M., Florando J.N., and Nix W.D. Sample dimensions influence strength and crystal plasticity. Science 305 (2004) 986-989
-
(2004)
Science
, vol.305
, pp. 986-989
-
-
Uchic, M.D.1
Dimiduk, D.M.2
Florando, J.N.3
Nix, W.D.4
-
8
-
-
33745083107
-
Nanoscale gold pillars strengthened through dislocation starvation
-
Greer J.R., and Nix W.D. Nanoscale gold pillars strengthened through dislocation starvation. Phys Rev B 73 (2006) 245410
-
(2006)
Phys Rev B
, vol.73
, pp. 245410
-
-
Greer, J.R.1
Nix, W.D.2
-
10
-
-
21844473049
-
Mechanical properties of ultrahigh-strength gold nanowires
-
Wu B., Heidelberg A., and Boland A.A. Mechanical properties of ultrahigh-strength gold nanowires. Nat Mater 4 (2005) 525-529
-
(2005)
Nat Mater
, vol.4
, pp. 525-529
-
-
Wu, B.1
Heidelberg, A.2
Boland, A.A.3
-
11
-
-
0142059242
-
Surface-stress-induced phase transformation in metal nanowires
-
Diao J., Gall K., and Dunn M.L. Surface-stress-induced phase transformation in metal nanowires. Nat Mater 2 (2003) 656-660
-
(2003)
Nat Mater
, vol.2
, pp. 656-660
-
-
Diao, J.1
Gall, K.2
Dunn, M.L.3
-
12
-
-
84871790293
-
Modeling inelasticity and failure in gold nanowires
-
Park H.S., and Zimmerman J.A. Modeling inelasticity and failure in gold nanowires. Phys Rev B 72 (2005) 054106
-
(2005)
Phys Rev B
, vol.72
, pp. 054106
-
-
Park, H.S.1
Zimmerman, J.A.2
-
15
-
-
0037210072
-
A methodology for determining mechanical properties of freestanding thin films and MEMS materials
-
Espinosa H.D., Prorok B.C., and Fischer D. A methodology for determining mechanical properties of freestanding thin films and MEMS materials. J Mech Phys Solids 51 (2003) 47-67
-
(2003)
J Mech Phys Solids
, vol.51
, pp. 47-67
-
-
Espinosa, H.D.1
Prorok, B.C.2
Fischer, D.3
-
16
-
-
29144437809
-
Plane-strain bulge test for thin films
-
Xiang Y., Chen X., and Vlassak J.J. Plane-strain bulge test for thin films. J Mater Res 9 (2005) 2360-2370
-
(2005)
J Mater Res
, vol.9
, pp. 2360-2370
-
-
Xiang, Y.1
Chen, X.2
Vlassak, J.J.3
-
17
-
-
29044432615
-
In situ tensile testing of nanoscale freestanding thin films inside a transmission electron microscope
-
Haque M.A., and Saif M.T.A. In situ tensile testing of nanoscale freestanding thin films inside a transmission electron microscope. J Mater Res 20 (2005) 1769-1777
-
(2005)
J Mater Res
, vol.20
, pp. 1769-1777
-
-
Haque, M.A.1
Saif, M.T.A.2
-
18
-
-
33847245407
-
Determination of the mechanical properties of freestanding nano-thickness gold membranes using a novel MEMS based load cell
-
Leseman Z.C., and Macking T.J. Determination of the mechanical properties of freestanding nano-thickness gold membranes using a novel MEMS based load cell. Sensor Actuator 134 (2007) 264-270
-
(2007)
Sensor Actuator
, vol.134
, pp. 264-270
-
-
Leseman, Z.C.1
Macking, T.J.2
-
19
-
-
34547785138
-
A MEMS-based evaluation of the mechanical properties of metallic thin films
-
Reddy A., Kahn H., and Heuer A.H. A MEMS-based evaluation of the mechanical properties of metallic thin films. J Microelectromech Syst 16 (2007) 650-658
-
(2007)
J Microelectromech Syst
, vol.16
, pp. 650-658
-
-
Reddy, A.1
Kahn, H.2
Heuer, A.H.3
-
22
-
-
0003457345
-
-
Macmillan Publishing Company, New York
-
Lubliner J. Plasticity theory (1990), Macmillan Publishing Company, New York
-
(1990)
Plasticity theory
-
-
Lubliner, J.1
-
25
-
-
0024767466
-
An experimental and numerical study of deformation in metal ceramic composites
-
Christman T., Needleman A., and Suresh S. An experimental and numerical study of deformation in metal ceramic composites. Acta Metall 37 (1989) 3029-3050
-
(1989)
Acta Metall
, vol.37
, pp. 3029-3050
-
-
Christman, T.1
Needleman, A.2
Suresh, S.3
-
27
-
-
0034767724
-
Stress enhancement at inclusion particles in aluminum matrix composites: computational modeling and implications to fatigue damage
-
Wilkins T., and Shen Y.-L. Stress enhancement at inclusion particles in aluminum matrix composites: computational modeling and implications to fatigue damage. Comput Mater Sci 22 (2001) 291-299
-
(2001)
Comput Mater Sci
, vol.22
, pp. 291-299
-
-
Wilkins, T.1
Shen, Y.-L.2
-
28
-
-
2342454411
-
Three-dimensional microstructure visualization and finite element modeling of the mechanical behavior of SiC particle reinforced aluminum composites
-
Chawla N., Ganesh V.V., and Wunsch B. Three-dimensional microstructure visualization and finite element modeling of the mechanical behavior of SiC particle reinforced aluminum composites. Scripta Mater 51 (2004) 161-165
-
(2004)
Scripta Mater
, vol.51
, pp. 161-165
-
-
Chawla, N.1
Ganesh, V.V.2
Wunsch, B.3
-
31
-
-
0024766321
-
Mechanical properties of thin films
-
Nix W.D. Mechanical properties of thin films. Metall Trans A 20A (1989) 2217-2245
-
(1989)
Metall Trans A
, vol.20 A
, pp. 2217-2245
-
-
Nix, W.D.1
-
32
-
-
0002618705
-
Modeling the development and relaxation of stresses in films
-
Thouless M.D. Modeling the development and relaxation of stresses in films. Annu Rev Mater Sci 25 (1995) 69-96
-
(1995)
Annu Rev Mater Sci
, vol.25
, pp. 69-96
-
-
Thouless, M.D.1
-
34
-
-
0029346335
-
The thermomechanical integrity of thin films and multilayers
-
Evans A.G., and Hutchinson J.W. The thermomechanical integrity of thin films and multilayers. Acta Metall Mater 43 (1995) 2507-2530
-
(1995)
Acta Metall Mater
, vol.43
, pp. 2507-2530
-
-
Evans, A.G.1
Hutchinson, J.W.2
-
35
-
-
0033875372
-
Mechanics of materials: top-down approaches to fracture
-
Hutchinson J.W., and Evans A.G. Mechanics of materials: top-down approaches to fracture. Acta Mater 48 (2000) 125-135
-
(2000)
Acta Mater
, vol.48
, pp. 125-135
-
-
Hutchinson, J.W.1
Evans, A.G.2
-
36
-
-
0036148480
-
Mechanisms active during fracture under constraint
-
Cook R.F., and Suo Z. Mechanisms active during fracture under constraint. MRS Bull 27 1 (2002) 45-51
-
(2002)
MRS Bull
, vol.27
, Issue.1
, pp. 45-51
-
-
Cook, R.F.1
Suo, Z.2
-
37
-
-
44749087384
-
The aging of metallic thin films: delamination, strain relaxation, and diffusion
-
Kennedy M.S., Moody N.R., and Bahr D.F. The aging of metallic thin films: delamination, strain relaxation, and diffusion. JOM 59 9 (2007) 50-53
-
(2007)
JOM
, vol.59
, Issue.9
, pp. 50-53
-
-
Kennedy, M.S.1
Moody, N.R.2
Bahr, D.F.3
-
38
-
-
0000073841
-
The tension of metallic films deposited by electrolysis
-
Stoney G.G. The tension of metallic films deposited by electrolysis. Proc Royal Soc (London) A82 (1909) 172-175
-
(1909)
Proc Royal Soc (London)
, vol.A82
, pp. 172-175
-
-
Stoney, G.G.1
-
39
-
-
36749106419
-
Elastic stiffness and thermal expansion coefficient of BN films
-
Retajczyk T.F., and Sinha A.K. Elastic stiffness and thermal expansion coefficient of BN films. Appl Phys Lett 36 (1980) 161-163
-
(1980)
Appl Phys Lett
, vol.36
, pp. 161-163
-
-
Retajczyk, T.F.1
Sinha, A.K.2
-
40
-
-
0021405876
-
In situ measurement of refractory silicides during sintering
-
Pan J.T., and Blech I.A. In situ measurement of refractory silicides during sintering. J Appl Phys 55 (1984) 2874-2880
-
(1984)
J Appl Phys
, vol.55
, pp. 2874-2880
-
-
Pan, J.T.1
Blech, I.A.2
-
41
-
-
0023312081
-
Measurement and interpretation of stress in aluminum-based metallization as a function of thermal history
-
Flinn P.A., Gardner D.S., and Nix W.D. Measurement and interpretation of stress in aluminum-based metallization as a function of thermal history. IEEE Trans Electron Dev ED34 (1987) 689-699
-
(1987)
IEEE Trans Electron Dev
, vol.ED34
, pp. 689-699
-
-
Flinn, P.A.1
Gardner, D.S.2
Nix, W.D.3
-
42
-
-
36449005943
-
Stress and plastic flow in silicon during amorphization by ion-bombardment
-
Volker C.A. Stress and plastic flow in silicon during amorphization by ion-bombardment. J Appl Phys 70 (1991) 3521-3527
-
(1991)
J Appl Phys
, vol.70
, pp. 3521-3527
-
-
Volker, C.A.1
-
43
-
-
0001132577
-
Measurements of stress during vapor deposition of copper and silver thin films and multilayers
-
Shull A.L., and Spaepen F. Measurements of stress during vapor deposition of copper and silver thin films and multilayers. J Appl Phys 80 (1996) 6243-6256
-
(1996)
J Appl Phys
, vol.80
, pp. 6243-6256
-
-
Shull, A.L.1
Spaepen, F.2
-
45
-
-
0032117941
-
Full field measurements of curvature using coherent gradient sensing - application to thin-film characterization
-
Rosakis A.J., Singh R.B., Tsuji Y., Kolawa E., and Moore N.R. Full field measurements of curvature using coherent gradient sensing - application to thin-film characterization. Thin Solid Films 325 (1998) 42-54
-
(1998)
Thin Solid Films
, vol.325
, pp. 42-54
-
-
Rosakis, A.J.1
Singh, R.B.2
Tsuji, Y.3
Kolawa, E.4
Moore, N.R.5
-
46
-
-
0035955502
-
Large deformation of layered thin films and flat panels: effects of gravity
-
Giannakopoulos A.E., Blech I.A., and Suresh S. Large deformation of layered thin films and flat panels: effects of gravity. Acta Mater 49 (2001) 3671-3688
-
(2001)
Acta Mater
, vol.49
, pp. 3671-3688
-
-
Giannakopoulos, A.E.1
Blech, I.A.2
Suresh, S.3
-
47
-
-
84945770363
-
Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques
-
Doerner M.F., Gardner D.S., and Nix W.D. Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques. J Mater Res 1 (1986) 845-851
-
(1986)
J Mater Res
, vol.1
, pp. 845-851
-
-
Doerner, M.F.1
Gardner, D.S.2
Nix, W.D.3
-
48
-
-
0018258871
-
The temperature dependence of stresses in aluminum films on oxidized silicon substrates
-
Sinha A.K., and Sheng T.T. The temperature dependence of stresses in aluminum films on oxidized silicon substrates. Thin Solid Films 48 (1978) 117-126
-
(1978)
Thin Solid Films
, vol.48
, pp. 117-126
-
-
Sinha, A.K.1
Sheng, T.T.2
-
51
-
-
36549095061
-
Stress relaxation during thermal cycling in metal/polyimide layered films
-
Chen S.T., Yang C.H., Faupel F., and Ho P.S. Stress relaxation during thermal cycling in metal/polyimide layered films. J Appl Phys 64 (1988) 6690-6698
-
(1988)
J Appl Phys
, vol.64
, pp. 6690-6698
-
-
Chen, S.T.1
Yang, C.H.2
Faupel, F.3
Ho, P.S.4
-
52
-
-
0024123113
-
Mechanical stress as a function of temperature in aluminum films
-
Gardner D.S., and Flinn P.A. Mechanical stress as a function of temperature in aluminum films. IEEE Trans Electron Dev 35 (1988) 2160-2169
-
(1988)
IEEE Trans Electron Dev
, vol.35
, pp. 2160-2169
-
-
Gardner, D.S.1
Flinn, P.A.2
-
53
-
-
0000519955
-
Mechanical stress as a function of temperature for aluminum alloy films
-
Gardner D.S., and Flinn P.A. Mechanical stress as a function of temperature for aluminum alloy films. J Appl Phys 67 (1990) 1831-1844
-
(1990)
J Appl Phys
, vol.67
, pp. 1831-1844
-
-
Gardner, D.S.1
Flinn, P.A.2
-
54
-
-
51249175501
-
Mechanical properties and microstructural characterization of Al-0.5%Cu thin films
-
Venkatraman R., Bravman J.C., Nix W.D., Davis P.W., Flinn P.A., and Fraser D.B. Mechanical properties and microstructural characterization of Al-0.5%Cu thin films. J Electron Mater 19 (1990) 1231-1237
-
(1990)
J Electron Mater
, vol.19
, pp. 1231-1237
-
-
Venkatraman, R.1
Bravman, J.C.2
Nix, W.D.3
Davis, P.W.4
Flinn, P.A.5
Fraser, D.B.6
-
55
-
-
0026186937
-
Measurement and interpretation of stress in copper films as a function of thermal history
-
Flinn P.A. Measurement and interpretation of stress in copper films as a function of thermal history. J Mater Res 6 (1991) 1498-1501
-
(1991)
J Mater Res
, vol.6
, pp. 1498-1501
-
-
Flinn, P.A.1
-
56
-
-
0026903429
-
Separation of film thickness and grain boundary strengthening effects in Al thin films on Si
-
Venkatraman R., and Bravman J.C. Separation of film thickness and grain boundary strengthening effects in Al thin films on Si. J Mater Res 7 (1992) 2040-2048
-
(1992)
J Mater Res
, vol.7
, pp. 2040-2048
-
-
Venkatraman, R.1
Bravman, J.C.2
-
57
-
-
0027642069
-
Stress development and relaxation in copper films during thermal cycling
-
Thouless M.D., Gupta J., and Harper J.M.E. Stress development and relaxation in copper films during thermal cycling. J Mater Res 8 (1993) 1845-1852
-
(1993)
J Mater Res
, vol.8
, pp. 1845-1852
-
-
Thouless, M.D.1
Gupta, J.2
Harper, J.M.E.3
-
58
-
-
0028436574
-
Deformation mechanisms of Al films on oxidized Si wafers
-
Volkert C.A., Alofs C.F., and Liefting J.R. Deformation mechanisms of Al films on oxidized Si wafers. J Mater Res 9 (1994) 1147-1155
-
(1994)
J Mater Res
, vol.9
, pp. 1147-1155
-
-
Volkert, C.A.1
Alofs, C.F.2
Liefting, J.R.3
-
59
-
-
0029343079
-
Comparison of mechanical properties and microstructure of Al(1 wt.%Si) and Al(1 wt.%Si, 0.5 wt.%Cu) thin films
-
Bader S., Kalaugher E.M., and Arzt E. Comparison of mechanical properties and microstructure of Al(1 wt.%Si) and Al(1 wt.%Si, 0.5 wt.%Cu) thin films. Thin Solid Films 263 (1995) 175-184
-
(1995)
Thin Solid Films
, vol.263
, pp. 175-184
-
-
Bader, S.1
Kalaugher, E.M.2
Arzt, E.3
-
61
-
-
0001697854
-
Thermal cycling and stress relaxation response of Si-Al and Si-Al-SiO2 layered thin films
-
Shen Y.-L., and Suresh S. Thermal cycling and stress relaxation response of Si-Al and Si-Al-SiO2 layered thin films. Acta Metall Mater 43 (1995) 3915-3926
-
(1995)
Acta Metall Mater
, vol.43
, pp. 3915-3926
-
-
Shen, Y.-L.1
Suresh, S.2
-
62
-
-
0030507877
-
Effect of a surface layer on the stress relaxation of thin films
-
Thouless M.D., Rodbell K.P., and Cabral Jr. C. Effect of a surface layer on the stress relaxation of thin films. J Vac Sci Technol A 14 (1996) 2454-2461
-
(1996)
J Vac Sci Technol A
, vol.14
, pp. 2454-2461
-
-
Thouless, M.D.1
Rodbell, K.P.2
Cabral Jr., C.3
-
63
-
-
0029721299
-
Mechanical behavior of thin films
-
Vinci R.P., and Vlassak J.J. Mechanical behavior of thin films. Annu Rev Mater Sci 26 (1996) 431-462
-
(1996)
Annu Rev Mater Sci
, vol.26
, pp. 431-462
-
-
Vinci, R.P.1
Vlassak, J.J.2
-
64
-
-
1642406258
-
Effects of oxide overlayer on thermal stress and yield behavior of Al alloy films
-
Yeo I.-S., Anderson S.G.H., Jawarani D., Ho P.S., Clark A.P., Saimoto S., et al. Effects of oxide overlayer on thermal stress and yield behavior of Al alloy films. J Vac Sci Technol B 14 (1996) 2636-2644
-
(1996)
J Vac Sci Technol B
, vol.14
, pp. 2636-2644
-
-
Yeo, I.-S.1
Anderson, S.G.H.2
Jawarani, D.3
Ho, P.S.4
Clark, A.P.5
Saimoto, S.6
-
65
-
-
0040569588
-
Stress relaxation in Al(Cu) thin films
-
Proost J., Witvrouw A., Cosemans P., Roussel Ph., and Maex K. Stress relaxation in Al(Cu) thin films. Microelectron Engng 33 (1997) 137-147
-
(1997)
Microelectron Engng
, vol.33
, pp. 137-147
-
-
Proost, J.1
Witvrouw, A.2
Cosemans, P.3
Roussel, Ph.4
Maex, K.5
-
66
-
-
0000403105
-
Quantitative analysis of strengthening mechanisms in thin Cu films: effects of film thickness, grain size, and passivation
-
Keller R.-M., Baker S.P., and Arzt E. Quantitative analysis of strengthening mechanisms in thin Cu films: effects of film thickness, grain size, and passivation. J Mater Res 13 (1998) 1307-1317
-
(1998)
J Mater Res
, vol.13
, pp. 1307-1317
-
-
Keller, R.-M.1
Baker, S.P.2
Arzt, E.3
-
67
-
-
0032124053
-
Stress evolution in passivated thin films of Cu on silica substrates
-
Shen Y.-L., Suresh S., He M.Y., Bagchi A., Kienzle O., Ruhle M., et al. Stress evolution in passivated thin films of Cu on silica substrates. J Mater Res 13 (1998) 1928-1937
-
(1998)
J Mater Res
, vol.13
, pp. 1928-1937
-
-
Shen, Y.-L.1
Suresh, S.2
He, M.Y.3
Bagchi, A.4
Kienzle, O.5
Ruhle, M.6
-
68
-
-
0032205854
-
Thermal cycling fatigue and deformation mechanism in aluminum alloy thin films on silicon
-
Koike J., Utsunomiya S., Shimoyama Y., Maruyama K., and Oikawa H. Thermal cycling fatigue and deformation mechanism in aluminum alloy thin films on silicon. J Mater Res 13 (1998) 3256-3264
-
(1998)
J Mater Res
, vol.13
, pp. 3256-3264
-
-
Koike, J.1
Utsunomiya, S.2
Shimoyama, Y.3
Maruyama, K.4
Oikawa, H.5
-
69
-
-
0032714755
-
Stress-temperature behavior of unpassivated thin copper films
-
Keller R.M., Baker S.P., and Arzt E. Stress-temperature behavior of unpassivated thin copper films. Acta Mater 47 (1999) 415-426
-
(1999)
Acta Mater
, vol.47
, pp. 415-426
-
-
Keller, R.M.1
Baker, S.P.2
Arzt, E.3
-
70
-
-
0032639633
-
Stress relaxation in Al-Cu and Al-Si-Cu thin films
-
Witvrouw A., Proost J., Roussel Ph., Cosemans P., and Maex K. Stress relaxation in Al-Cu and Al-Si-Cu thin films. J Mater Res 14 (1999) 1246-1254
-
(1999)
J Mater Res
, vol.14
, pp. 1246-1254
-
-
Witvrouw, A.1
Proost, J.2
Roussel, Ph.3
Cosemans, P.4
Maex, K.5
-
71
-
-
0033880206
-
Activation volume for inelastic deformation in polycrystalline Ag thin films
-
Kobrinsky M.J., and Thompson C.V. Activation volume for inelastic deformation in polycrystalline Ag thin films. Acta Mater 48 (2000) 625-633
-
(2000)
Acta Mater
, vol.48
, pp. 625-633
-
-
Kobrinsky, M.J.1
Thompson, C.V.2
-
72
-
-
0035426516
-
Constrained diffusional creep in UHV-produced copper thin films
-
Weiss D., Gao H., and Arzt E. Constrained diffusional creep in UHV-produced copper thin films. Acta Mater 49 (2001) 2395-2403
-
(2001)
Acta Mater
, vol.49
, pp. 2395-2403
-
-
Weiss, D.1
Gao, H.2
Arzt, E.3
-
73
-
-
0036648228
-
Effect of interface conditions on yield behavior of passivated copper thin films
-
Vinci R.P., Forrest S.A., and Bravman J.C. Effect of interface conditions on yield behavior of passivated copper thin films. J Mater Res 17 (2002) 1863-1870
-
(2002)
J Mater Res
, vol.17
, pp. 1863-1870
-
-
Vinci, R.P.1
Forrest, S.A.2
Bravman, J.C.3
-
74
-
-
0036520796
-
Plasticity and interfacial dislocation mechanisms in epitaxial and polycrystalline Al films constrained by substrates
-
Dehm G., Wagner T., Balk T.J., and Arzt E. Plasticity and interfacial dislocation mechanisms in epitaxial and polycrystalline Al films constrained by substrates. J Mater Sci Technol 18 (2002) 113-117
-
(2002)
J Mater Sci Technol
, vol.18
, pp. 113-117
-
-
Dehm, G.1
Wagner, T.2
Balk, T.J.3
Arzt, E.4
-
76
-
-
0037809826
-
Bauschinger effect and anomalous thermomechanical deformation induced by oxygen in passivated thin Cu films on substrates
-
Baker S.P., Keller-Flaig R.-M., and Shu J.B. Bauschinger effect and anomalous thermomechanical deformation induced by oxygen in passivated thin Cu films on substrates. Acta Mater 51 (2003) 3019-3036
-
(2003)
Acta Mater
, vol.51
, pp. 3019-3036
-
-
Baker, S.P.1
Keller-Flaig, R.-M.2
Shu, J.B.3
-
77
-
-
0042130340
-
Parallel glide: unexpected dislocation motion parallel to the substrate in ultrathin copper films
-
Balk T.J., Dehm G., and Arzt E. Parallel glide: unexpected dislocation motion parallel to the substrate in ultrathin copper films. Acta Mater 51 (2003) 4471-4485
-
(2003)
Acta Mater
, vol.51
, pp. 4471-4485
-
-
Balk, T.J.1
Dehm, G.2
Arzt, E.3
-
78
-
-
0037320159
-
Constitutive response of passivated copper films to thermal cycling
-
Shen Y.-L., and Ramamurty U. Constitutive response of passivated copper films to thermal cycling. J Appl Phys 93 (2003) 1806-1812
-
(2003)
J Appl Phys
, vol.93
, pp. 1806-1812
-
-
Shen, Y.-L.1
Ramamurty, U.2
-
79
-
-
0346499164
-
Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates
-
Schmidt T.K., Balk T.J., Dehm G., and Arzt E. Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Mater 50 (2004) 733-737
-
(2004)
Scripta Mater
, vol.50
, pp. 733-737
-
-
Schmidt, T.K.1
Balk, T.J.2
Dehm, G.3
Arzt, E.4
-
80
-
-
3242693296
-
Mechanical behavior of Pt and Pt-Ru solid solution alloy thin films
-
Hyun S., Kraft O., and Vinci R.P. Mechanical behavior of Pt and Pt-Ru solid solution alloy thin films. Acta Mater 52 (2004) 4199-4211
-
(2004)
Acta Mater
, vol.52
, pp. 4199-4211
-
-
Hyun, S.1
Kraft, O.2
Vinci, R.P.3
-
81
-
-
4944248918
-
Size effect in the plastic deformation of NiAl thin films
-
Wellner P., Dehm G., Kraft O., and Arzt E. Size effect in the plastic deformation of NiAl thin films. Z Metallkd 95 (2004) 769-778
-
(2004)
Z Metallkd
, vol.95
, pp. 769-778
-
-
Wellner, P.1
Dehm, G.2
Kraft, O.3
Arzt, E.4
-
82
-
-
40949113835
-
The mechanical behavior of nanoporous gold thin films
-
Sun Y., Ye J., Shan Z., Minor A.M., and Balk T.J. The mechanical behavior of nanoporous gold thin films. JOM 59 9 (2007) 54-58
-
(2007)
JOM
, vol.59
, Issue.9
, pp. 54-58
-
-
Sun, Y.1
Ye, J.2
Shan, Z.3
Minor, A.M.4
Balk, T.J.5
-
83
-
-
0002227180
-
A new X-ray diffraction design for thin-film texture, strain, and phase characterization
-
Flinn P.A., and Waychunas G.A. A new X-ray diffraction design for thin-film texture, strain, and phase characterization. J Vac Sci Technol B 6 (1988) 1749-1755
-
(1988)
J Vac Sci Technol B
, vol.6
, pp. 1749-1755
-
-
Flinn, P.A.1
Waychunas, G.A.2
-
84
-
-
36549104385
-
Strain distribution in thin aluminum films using X-ray depth profiling
-
Doerner M.F., and Brennan S. Strain distribution in thin aluminum films using X-ray depth profiling. J Appl Phys 63 (1988) 126-131
-
(1988)
J Appl Phys
, vol.63
, pp. 126-131
-
-
Doerner, M.F.1
Brennan, S.2
-
85
-
-
0025545575
-
Stress relaxation of continuous film and narrow line metallizations of aluminum on silicon substrates
-
Korhonen M.A., Paszkiet C.A., Black R.D., and Li C.-Y. Stress relaxation of continuous film and narrow line metallizations of aluminum on silicon substrates. Scripta Metall Mater 24 (1990) 2297-2302
-
(1990)
Scripta Metall Mater
, vol.24
, pp. 2297-2302
-
-
Korhonen, M.A.1
Paszkiet, C.A.2
Black, R.D.3
Li, C.-Y.4
-
86
-
-
0000853521
-
X-ray diffraction determination of the effect of various passivations on stress in metal films and patterned lines
-
Flinn P.A., and Chiang C. X-ray diffraction determination of the effect of various passivations on stress in metal films and patterned lines. J Appl Phys 67 (1990) 2927-2931
-
(1990)
J Appl Phys
, vol.67
, pp. 2927-2931
-
-
Flinn, P.A.1
Chiang, C.2
-
87
-
-
0001127313
-
Characterization of substrate/thin-film interfaces with X-ray microdiffraction
-
Noyan I.C., Jordan-Sweet J., Liniger E.G., and Kaldor S.K. Characterization of substrate/thin-film interfaces with X-ray microdiffraction. Appl Phys Lett 72 (1998) 3338-3340
-
(1998)
Appl Phys Lett
, vol.72
, pp. 3338-3340
-
-
Noyan, I.C.1
Jordan-Sweet, J.2
Liniger, E.G.3
Kaldor, S.K.4
-
88
-
-
0034285134
-
X-ray diffraction as a tool to study the mechanical behavior of thin films
-
Kraft O., Hommel M., and Arzt E. X-ray diffraction as a tool to study the mechanical behavior of thin films. Mater Sci Engng A 288 (2000) 209-216
-
(2000)
Mater Sci Engng A
, vol.288
, pp. 209-216
-
-
Kraft, O.1
Hommel, M.2
Arzt, E.3
-
89
-
-
0035902690
-
Thermomechanical behavior of different texture components in Cu thin films
-
Baker S.P., Kretschmann A., and Arzt E. Thermomechanical behavior of different texture components in Cu thin films. Acta Mater 49 (2001) 2145-2160
-
(2001)
Acta Mater
, vol.49
, pp. 2145-2160
-
-
Baker, S.P.1
Kretschmann, A.2
Arzt, E.3
-
90
-
-
2942585285
-
Residual stress and thermal stress observation in thin copper films
-
Hanabusa T., Kusaka K., and Sakata O. Residual stress and thermal stress observation in thin copper films. Thin Solid Films 459 (2004) 245-248
-
(2004)
Thin Solid Films
, vol.459
, pp. 245-248
-
-
Hanabusa, T.1
Kusaka, K.2
Sakata, O.3
-
91
-
-
33847357374
-
Size independent stresses in Al thin films thermally strained down to -100 °C
-
Eiper E., Keckes J., Martinschitz K.J., Zizak I., Cabie M., and Dehm G. Size independent stresses in Al thin films thermally strained down to -100 °C. Acta Mater 55 (2007) 1941-1946
-
(2007)
Acta Mater
, vol.55
, pp. 1941-1946
-
-
Eiper, E.1
Keckes, J.2
Martinschitz, K.J.3
Zizak, I.4
Cabie, M.5
Dehm, G.6
-
96
-
-
34247219249
-
Deformation mechanisms of face-centered-cubic metal nanowires with twin boundaries
-
Cao A.J., Wei Y.G., and Mao S.X. Deformation mechanisms of face-centered-cubic metal nanowires with twin boundaries. Appl Phys Lett 90 (2007) 151909
-
(2007)
Appl Phys Lett
, vol.90
, pp. 151909
-
-
Cao, A.J.1
Wei, Y.G.2
Mao, S.X.3
-
97
-
-
33847666430
-
Interfacial plasticity governs strain rate sensitivity and ductility in nanostructured metals
-
Zhu T., Li J., Samanta A., Kim H.G., and Suresh S. Interfacial plasticity governs strain rate sensitivity and ductility in nanostructured metals. Proc Natl Acad Sci USA 104 (2007) 3031-3036
-
(2007)
Proc Natl Acad Sci USA
, vol.104
, pp. 3031-3036
-
-
Zhu, T.1
Li, J.2
Samanta, A.3
Kim, H.G.4
Suresh, S.5
-
98
-
-
33750607762
-
Strength, strain-rate sensitivity and ductility of copper with nanoscale twins
-
Dao M., Lu L., Shen Y.F., and Suresh S. Strength, strain-rate sensitivity and ductility of copper with nanoscale twins. Acta Mater 54 (2006) 5421-5432
-
(2006)
Acta Mater
, vol.54
, pp. 5421-5432
-
-
Dao, M.1
Lu, L.2
Shen, Y.F.3
Suresh, S.4
-
99
-
-
14544288579
-
Nano-sized twins induce high rate sensitivity of flow stress in pure copper
-
Lu L., Schwaiger R., Shan Z.W., Dao M., Lu K., and Suresh S. Nano-sized twins induce high rate sensitivity of flow stress in pure copper. Acta Mater 53 (2005) 2169-2179
-
(2005)
Acta Mater
, vol.53
, pp. 2169-2179
-
-
Lu, L.1
Schwaiger, R.2
Shan, Z.W.3
Dao, M.4
Lu, K.5
Suresh, S.6
-
100
-
-
30844473113
-
The interaction mechanism of screw dislocations with coherent twin boundaries in different face-centered cubic metals
-
Jin Z.H., Gumbsch P., Ma E., Albe K., Lu K., Hahn H., et al. The interaction mechanism of screw dislocations with coherent twin boundaries in different face-centered cubic metals. Scripta Mater 54 (2006) 1163-1168
-
(2006)
Scripta Mater
, vol.54
, pp. 1163-1168
-
-
Jin, Z.H.1
Gumbsch, P.2
Ma, E.3
Albe, K.4
Lu, K.5
Hahn, H.6
-
101
-
-
33746154934
-
The mechanical properties of freestanding electroplated Cu thin films
-
Xiang Y., Tsui T.Y., and Vlassak J.J. The mechanical properties of freestanding electroplated Cu thin films. J Mater Res 21 (2006) 1607-1618
-
(2006)
J Mater Res
, vol.21
, pp. 1607-1618
-
-
Xiang, Y.1
Tsui, T.Y.2
Vlassak, J.J.3
-
102
-
-
4544358607
-
Ultrahigh strength and high electrical conductivity in copper
-
Lu L., Shen Y., Chen X., Qian L., and Lu K. Ultrahigh strength and high electrical conductivity in copper. Science 304 (2004) 422-426
-
(2004)
Science
, vol.304
, pp. 422-426
-
-
Lu, L.1
Shen, Y.2
Chen, X.3
Qian, L.4
Lu, K.5
-
103
-
-
0036148074
-
Dislocation plasticity in thin metal films
-
Kraft O., Freund L.B., Phillips R., and Arzt E. Dislocation plasticity in thin metal films. MRS Bull 27 1 (2002) 30-37
-
(2002)
MRS Bull
, vol.27
, Issue.1
, pp. 30-37
-
-
Kraft, O.1
Freund, L.B.2
Phillips, R.3
Arzt, E.4
-
104
-
-
6344258510
-
Length scale based hardening model for ultra-small volumes
-
Jungk J.M., Mook W.M., Cordill M.J., Chambers M.D., Gerberich W.W., Bahr D.F., et al. Length scale based hardening model for ultra-small volumes. J Mater Res 19 (2004) 2812-2821
-
(2004)
J Mater Res
, vol.19
, pp. 2812-2821
-
-
Jungk, J.M.1
Mook, W.M.2
Cordill, M.J.3
Chambers, M.D.4
Gerberich, W.W.5
Bahr, D.F.6
-
105
-
-
18144408375
-
Bauschinger effect in thin metal films
-
Xiang Y., and Vlassak J.J. Bauschinger effect in thin metal films. Scripta Mater 53 (2005) 177-182
-
(2005)
Scripta Mater
, vol.53
, pp. 177-182
-
-
Xiang, Y.1
Vlassak, J.J.2
-
106
-
-
33750615734
-
Bauschinger and size effects in thin-film plasticity
-
Xiang Y., and Vlassak J.J. Bauschinger and size effects in thin-film plasticity. Acta Mater 54 (2006) 5449-5460
-
(2006)
Acta Mater
, vol.54
, pp. 5449-5460
-
-
Xiang, Y.1
Vlassak, J.J.2
-
107
-
-
33847147593
-
A three-dimensional dislocation field crystal plasticity approach applied to miniaturized structures
-
Bayley C.J., Brekelmans W.A.M., and Geers M.G.D. A three-dimensional dislocation field crystal plasticity approach applied to miniaturized structures. Philos Mag 87 (2007) 1361-1378
-
(2007)
Philos Mag
, vol.87
, pp. 1361-1378
-
-
Bayley, C.J.1
Brekelmans, W.A.M.2
Geers, M.G.D.3
-
108
-
-
0020100745
-
Mechanical properties of liquid-phase-bonded copper-ceramic substrates
-
Wittmer M., Boer C.R., Gudmundson P., and Carlsson J. Mechanical properties of liquid-phase-bonded copper-ceramic substrates. J Am Ceram Soc 65 (1982) 149-153
-
(1982)
J Am Ceram Soc
, vol.65
, pp. 149-153
-
-
Wittmer, M.1
Boer, C.R.2
Gudmundson, P.3
Carlsson, J.4
-
109
-
-
0022061389
-
Residual stresses in metal/ceramic bonded strips
-
Hsueh C.H., and Evans A.G. Residual stresses in metal/ceramic bonded strips. J Am Ceram Soc 68 (1985) 241-248
-
(1985)
J Am Ceram Soc
, vol.68
, pp. 241-248
-
-
Hsueh, C.H.1
Evans, A.G.2
-
110
-
-
0027656416
-
The stress distribution and curvature of a general compositionally graded semiconductor layer
-
Freund L.B. The stress distribution and curvature of a general compositionally graded semiconductor layer. J Crystal Growth 132 (1993) 341-344
-
(1993)
J Crystal Growth
, vol.132
, pp. 341-344
-
-
Freund, L.B.1
-
111
-
-
0028442819
-
Elastoplastic analysis of thermal cycling: Layered materials with sharp interfaces
-
Suresh S., Giannakopoulos A.E., and Olsson M. Elastoplastic analysis of thermal cycling: Layered materials with sharp interfaces. J Mech Phys Solids 42 (1994) 979-1018
-
(1994)
J Mech Phys Solids
, vol.42
, pp. 979-1018
-
-
Suresh, S.1
Giannakopoulos, A.E.2
Olsson, M.3
-
112
-
-
58149208629
-
Elastoplastic analysis of thermal cycling: layered materials with compositional gradients
-
Giannakopoulos A.E., Suresh S., Finot M., and Olsson M. Elastoplastic analysis of thermal cycling: layered materials with compositional gradients. Acta Metall Mater 43 (1995) 1335-1354
-
(1995)
Acta Metall Mater
, vol.43
, pp. 1335-1354
-
-
Giannakopoulos, A.E.1
Suresh, S.2
Finot, M.3
Olsson, M.4
-
113
-
-
0029305679
-
Elastoplastic deformation of multilayered materials during thermal cycling
-
Shen Y.-L., and Suresh S. Elastoplastic deformation of multilayered materials during thermal cycling. J Mater Res 10 (1995) 1200-1215
-
(1995)
J Mater Res
, vol.10
, pp. 1200-1215
-
-
Shen, Y.-L.1
Suresh, S.2
-
114
-
-
0030141309
-
Small and large deformation of thick and thin-film multilayers: effects of layer geometry, plasticity and compositional gradients
-
Finot M., and Suresh S. Small and large deformation of thick and thin-film multilayers: effects of layer geometry, plasticity and compositional gradients. J Mech Phys Solids 44 (1996) 683-721
-
(1996)
J Mech Phys Solids
, vol.44
, pp. 683-721
-
-
Finot, M.1
Suresh, S.2
-
115
-
-
0027876248
-
Fabrication and operation of polyimide bimorph actuators for a ciliary motion system
-
Ataka M., Omodaka A., Takeshima N., and Fujita H. Fabrication and operation of polyimide bimorph actuators for a ciliary motion system. J Microelectromech Syst 2 (1993) 146-150
-
(1993)
J Microelectromech Syst
, vol.2
, pp. 146-150
-
-
Ataka, M.1
Omodaka, A.2
Takeshima, N.3
Fujita, H.4
-
116
-
-
22044458149
-
Ciliary microactuator array for scanning electron microscope positioning stage
-
Darling R.B., Suh J.W., and Kovacs T.A. Ciliary microactuator array for scanning electron microscope positioning stage. J Vac Sci Technol A 16 (1998) 1998-2002
-
(1998)
J Vac Sci Technol A
, vol.16
, pp. 1998-2002
-
-
Darling, R.B.1
Suh, J.W.2
Kovacs, T.A.3
-
117
-
-
85196481506
-
-
Mohebbi MH, Terry ML, Bohringer KF, Kovacs GT, Suh JW. Omnidirectional walking microrobot realized by thermal microactuator arrays. In: Proceedings of the 2001 ASME international mechanical engineering congress and exposition. New York: ASME; 2001 [paper no. 23824].
-
Mohebbi MH, Terry ML, Bohringer KF, Kovacs GT, Suh JW. Omnidirectional walking microrobot realized by thermal microactuator arrays. In: Proceedings of the 2001 ASME international mechanical engineering congress and exposition. New York: ASME; 2001 [paper no. 23824].
-
-
-
-
118
-
-
0024069463
-
Mechanical deflection of cantilever microbeams: a new technique for testing the mechanical properties of thin films
-
Weils T.P., Hong S., Bravman J.C., and Nix W.D. Mechanical deflection of cantilever microbeams: a new technique for testing the mechanical properties of thin films. J Mater Res 3 (1988) 931-942
-
(1988)
J Mater Res
, vol.3
, pp. 931-942
-
-
Weils, T.P.1
Hong, S.2
Bravman, J.C.3
Nix, W.D.4
-
119
-
-
0028747824
-
Mechanical properties of compositionally modulated Au-Ni thin films: nanoindentation and microcantilever deflection experiments
-
Baker S.P., and Nix W.D. Mechanical properties of compositionally modulated Au-Ni thin films: nanoindentation and microcantilever deflection experiments. J Mater Res 9 (1994) 3131-3144
-
(1994)
J Mater Res
, vol.9
, pp. 3131-3144
-
-
Baker, S.P.1
Nix, W.D.2
-
120
-
-
0037425467
-
Size effect in fatigue behavior of thin Ag films
-
Schwaiger R., and Kraft O. Size effect in fatigue behavior of thin Ag films. Acta Mater 51 (2003) 195-206
-
(2003)
Acta Mater
, vol.51
, pp. 195-206
-
-
Schwaiger, R.1
Kraft, O.2
-
121
-
-
12344282940
-
A microbeam bending method for studying stress-strain relations for metal thin films on silicon substrates
-
Florando J.N., and Nix W.D. A microbeam bending method for studying stress-strain relations for metal thin films on silicon substrates. J Mech Phys Solids 53 (2005) 619-638
-
(2005)
J Mech Phys Solids
, vol.53
, pp. 619-638
-
-
Florando, J.N.1
Nix, W.D.2
-
122
-
-
0000800786
-
On the mechanical strength of free-standing and substrate-bonded Al thin films
-
Heinen D., Bohn H.G., and Schilling W. On the mechanical strength of free-standing and substrate-bonded Al thin films. J Appl Phys 77 (1995) 3742-3745
-
(1995)
J Appl Phys
, vol.77
, pp. 3742-3745
-
-
Heinen, D.1
Bohn, H.G.2
Schilling, W.3
-
123
-
-
0018455319
-
Plastic properties of polycrystalline thin films on a substrate
-
Chaudhari P. Plastic properties of polycrystalline thin films on a substrate. Philos Mag A 39 (1979) 507-516
-
(1979)
Philos Mag A
, vol.39
, pp. 507-516
-
-
Chaudhari, P.1
-
124
-
-
84971969201
-
The yield strength of polycrystalline thin films
-
Thompson C.V. The yield strength of polycrystalline thin films. J Mater Res 8 (1993) 237-238
-
(1993)
J Mater Res
, vol.8
, pp. 237-238
-
-
Thompson, C.V.1
-
125
-
-
0032482761
-
Yielding and strain hardening of thin metal films on substrates
-
Nix W.D. Yielding and strain hardening of thin metal films on substrates. Scripta Mater 39 (1998) 545-554
-
(1998)
Scripta Mater
, vol.39
, pp. 545-554
-
-
Nix, W.D.1
-
126
-
-
0041760448
-
Elastic and plastic properties of thin films on substrates: nanoindentation techniques
-
Nix W.D. Elastic and plastic properties of thin films on substrates: nanoindentation techniques. Mater Sci Engng A 234-236 (1997) 37-44
-
(1997)
Mater Sci Engng A
, vol.234-236
, pp. 37-44
-
-
Nix, W.D.1
-
127
-
-
0037134085
-
Size effects on the mechanical properties of thin polycrystalline metal films on substrates
-
Choi Y., and Suresh S. Size effects on the mechanical properties of thin polycrystalline metal films on substrates. Acta Mater 50 (2002) 1881-1893
-
(2002)
Acta Mater
, vol.50
, pp. 1881-1893
-
-
Choi, Y.1
Suresh, S.2
-
128
-
-
0014835083
-
Accommodation of misfit across the interface between crystals of semiconducting elements or compounds
-
Matthews J.W., Mader S., and Light T.B. Accommodation of misfit across the interface between crystals of semiconducting elements or compounds. J Appl Phys 41 (1970) 3800-3804
-
(1970)
J Appl Phys
, vol.41
, pp. 3800-3804
-
-
Matthews, J.W.1
Mader, S.2
Light, T.B.3
-
129
-
-
0023406878
-
The stability of a dislocation threading a strained layer on a substrate
-
Freund L.B. The stability of a dislocation threading a strained layer on a substrate. J Appl Mech 54 (1987) 553-557
-
(1987)
J Appl Mech
, vol.54
, pp. 553-557
-
-
Freund, L.B.1
-
130
-
-
3042957491
-
The mechanics of dislocations in strained-layer semiconductor materials
-
Freund L.B. The mechanics of dislocations in strained-layer semiconductor materials. Adv Appl Mech 30 (1994) 1-66
-
(1994)
Adv Appl Mech
, vol.30
, pp. 1-66
-
-
Freund, L.B.1
-
131
-
-
0035879840
-
In situ transmission electron microscopy study of thermal stress induced dislocations in a thin Cu film constrained by a Si substrate
-
Dehm G., Weiss D., and Arzt E. In situ transmission electron microscopy study of thermal stress induced dislocations in a thin Cu film constrained by a Si substrate. Mater Sci Engng A 309 (2001) 468-472
-
(2001)
Mater Sci Engng A
, vol.309
, pp. 468-472
-
-
Dehm, G.1
Weiss, D.2
Arzt, E.3
-
132
-
-
0036681512
-
Microstructural evolution in passivated Al thin films on Si substrates during thermal cycling
-
Legros M., Hemker K.J., Gouldstone A., Suresh S., Keller-Flaig R.-M., and Arzt E. Microstructural evolution in passivated Al thin films on Si substrates during thermal cycling. Acta Mater 50 (2002) 3435-3452
-
(2002)
Acta Mater
, vol.50
, pp. 3435-3452
-
-
Legros, M.1
Hemker, K.J.2
Gouldstone, A.3
Suresh, S.4
Keller-Flaig, R.-M.5
Arzt, E.6
-
133
-
-
0035879723
-
Dynamic observations of Al thin films plastically strained in a TEM
-
Legros M., Dehm G., Keller-Flaig R.-M., Arzt E., Hemker K.J., and Suresh S. Dynamic observations of Al thin films plastically strained in a TEM. Mater Sci Engng A 309 (2001) 463-467
-
(2001)
Mater Sci Engng A
, vol.309
, pp. 463-467
-
-
Legros, M.1
Dehm, G.2
Keller-Flaig, R.-M.3
Arzt, E.4
Hemker, K.J.5
Suresh, S.6
-
134
-
-
0001103030
-
In situ transmission electron microscopy study of dislocations in a polycrystalline Cu thin film constrained by a substrate
-
Dehm G., and Arzt E. In situ transmission electron microscopy study of dislocations in a polycrystalline Cu thin film constrained by a substrate. Appl Phys Lett 77 (2000) 1126-1128
-
(2000)
Appl Phys Lett
, vol.77
, pp. 1126-1128
-
-
Dehm, G.1
Arzt, E.2
-
135
-
-
0031631541
-
Observation of dislocation disappearance in aluminum thin films and consequences for thin film properties
-
Thin films: stresses and mechanical properties VII. Cammarata R.C., Nastasi M., Busso E.P., and Oliver W.C. (Eds), Materials Research Society, Pittsburgh (PA)
-
Mullner P., and Arzt E. Observation of dislocation disappearance in aluminum thin films and consequences for thin film properties. In: Cammarata R.C., Nastasi M., Busso E.P., and Oliver W.C. (Eds). Thin films: stresses and mechanical properties VII. Materials Research Society symposium proceedings vol. 505 (1998), Materials Research Society, Pittsburgh (PA) 149-155
-
(1998)
Materials Research Society symposium proceedings
, vol.505
, pp. 149-155
-
-
Mullner, P.1
Arzt, E.2
-
136
-
-
0034744715
-
Interface controlled plasticity in metals: dispersion hardening and thin film deformation
-
Arzt E., Dehm G., Gumbsch P., Kraft O., and Weiss D. Interface controlled plasticity in metals: dispersion hardening and thin film deformation. Prog Mater Sci 46 (2001) 283-307
-
(2001)
Prog Mater Sci
, vol.46
, pp. 283-307
-
-
Arzt, E.1
Dehm, G.2
Gumbsch, P.3
Kraft, O.4
Weiss, D.5
-
137
-
-
36449000521
-
A rebound mechanism for Lomer dislocation formation in strained layer structures
-
Dregia S.A., and Hirth J.P. A rebound mechanism for Lomer dislocation formation in strained layer structures. J Appl Phys 69 (1991) 2169-2175
-
(1991)
J Appl Phys
, vol.69
, pp. 2169-2175
-
-
Dregia, S.A.1
Hirth, J.P.2
-
138
-
-
0242491768
-
Strength and interface-constrained plasticity in thin metal films
-
Shen Y.-L. Strength and interface-constrained plasticity in thin metal films. J Mater Res 18 (2003) 2281-2284
-
(2003)
J Mater Res
, vol.18
, pp. 2281-2284
-
-
Shen, Y.-L.1
-
139
-
-
33646158457
-
Parametric atomistic analysis of dislocation-interface interactions in thin metallic films
-
Shen Y.L., and Leger R.W. Parametric atomistic analysis of dislocation-interface interactions in thin metallic films. Mater Sci Engng A 423 (2006) 102-106
-
(2006)
Mater Sci Engng A
, vol.423
, pp. 102-106
-
-
Shen, Y.L.1
Leger, R.W.2
-
140
-
-
0034286525
-
Atomistic simulation of dislocation-interface interactions in Cu-Ni multilayer system
-
Rao S.I., and Hazzledine P.M. Atomistic simulation of dislocation-interface interactions in Cu-Ni multilayer system. Philos Mag A 80 (2000) 2011-2040
-
(2000)
Philos Mag A
, vol.80
, pp. 2011-2040
-
-
Rao, S.I.1
Hazzledine, P.M.2
-
141
-
-
24144497382
-
Atomic-scale modeling of plasticity at a metal film/amorphous substrate interface
-
Rodney D., Deby J.-B., and Verdier M. Atomic-scale modeling of plasticity at a metal film/amorphous substrate interface. Model Simul Mater Sci Engng 13 (2005) 427-436
-
(2005)
Model Simul Mater Sci Engng
, vol.13
, pp. 427-436
-
-
Rodney, D.1
Deby, J.-B.2
Verdier, M.3
-
142
-
-
0346724507
-
A rebound mechanism for misfit dislocation creation in metallic nanolayers
-
Henager Jr. C.H., and Hoagland R.G. A rebound mechanism for misfit dislocation creation in metallic nanolayers. Scripta Mater 50 (2004) 701-705
-
(2004)
Scripta Mater
, vol.50
, pp. 701-705
-
-
Henager Jr., C.H.1
Hoagland, R.G.2
-
143
-
-
0347759938
-
Slip resistance of interfaces and the strength of metallic multilayer composites
-
Hoagland R.G., Kurtz R.J., and Henager Jr. C.H. Slip resistance of interfaces and the strength of metallic multilayer composites. Scripta Mater 50 (2004) 775-779
-
(2004)
Scripta Mater
, vol.50
, pp. 775-779
-
-
Hoagland, R.G.1
Kurtz, R.J.2
Henager Jr., C.H.3
-
144
-
-
12444304307
-
Atomic scale simulations of the interaction between a moving dislocation and a bcc/fcc phase boundary
-
Lasko G., Saraev D., Schmauder D., and Kizler P. Atomic scale simulations of the interaction between a moving dislocation and a bcc/fcc phase boundary. Comput Mater Sci 32 (2005) 418-425
-
(2005)
Comput Mater Sci
, vol.32
, pp. 418-425
-
-
Lasko, G.1
Saraev, D.2
Schmauder, D.3
Kizler, P.4
-
145
-
-
33745008375
-
On the role of weak interfaces in blocking slip in nanoscale layered composites
-
Hoagland R.G., Hirth J.P., and Misra A. On the role of weak interfaces in blocking slip in nanoscale layered composites. Philos Mag 86 (2006) 3537-3558
-
(2006)
Philos Mag
, vol.86
, pp. 3537-3558
-
-
Hoagland, R.G.1
Hirth, J.P.2
Misra, A.3
-
146
-
-
0032260601
-
The force on a dislocation near a weakly bonded interface
-
Hurtado J., and Freund L.B. The force on a dislocation near a weakly bonded interface. J Elasticity 52 (1999) 167-180
-
(1999)
J Elasticity
, vol.52
, pp. 167-180
-
-
Hurtado, J.1
Freund, L.B.2
-
147
-
-
35248855568
-
Dissociated dislocations in confined plasticity
-
Douin J., Pettinari-Sturmel F., and Coujou A. Dissociated dislocations in confined plasticity. Acta Mater 55 (2007) 6453-6458
-
(2007)
Acta Mater
, vol.55
, pp. 6453-6458
-
-
Douin, J.1
Pettinari-Sturmel, F.2
Coujou, A.3
-
148
-
-
37349079146
-
Modeling the interfacial effect on the yield strength and flow stress of thin metal films on substrates
-
Abu Al-Rub R.K. Modeling the interfacial effect on the yield strength and flow stress of thin metal films on substrates. Mech Res Commun 35 (2008) 65-72
-
(2008)
Mech Res Commun
, vol.35
, pp. 65-72
-
-
Abu Al-Rub, R.K.1
-
149
-
-
33746811788
-
Transmission of a screw dislocation across a coherent, slipping interface
-
Shen Y., and Anderson P.M. Transmission of a screw dislocation across a coherent, slipping interface. Acta Mater 54 (2006) 3941-3951
-
(2006)
Acta Mater
, vol.54
, pp. 3941-3951
-
-
Shen, Y.1
Anderson, P.M.2
-
150
-
-
34047112229
-
Transmission of a screw dislocation across a coherent, non-slipping interface
-
Shen Y., and Anderson P.M. Transmission of a screw dislocation across a coherent, non-slipping interface. J Mech Phys Solids 55 (2007) 956-979
-
(2007)
J Mech Phys Solids
, vol.55
, pp. 956-979
-
-
Shen, Y.1
Anderson, P.M.2
-
151
-
-
28044451279
-
An interpretation of size-scale plasticity in geometrically confined systems
-
Espinosa H.D., Berbenni S., Panico M., and Schwarz. An interpretation of size-scale plasticity in geometrically confined systems. Proc Natl Acad Sci USA 47 (2005) 16933-16938
-
(2005)
Proc Natl Acad Sci USA
, vol.47
, pp. 16933-16938
-
-
Espinosa, H.D.1
Berbenni, S.2
Panico, M.3
Schwarz4
-
152
-
-
33746360914
-
Plastic deformation of freestanding thin films: experiments and modeling
-
Nicola L., Xiang Y., Vlassak J.J., Van der Giessen E., and Needleman A. Plastic deformation of freestanding thin films: experiments and modeling. J Mech Phys Solids 54 (2006) 2089-2110
-
(2006)
J Mech Phys Solids
, vol.54
, pp. 2089-2110
-
-
Nicola, L.1
Xiang, Y.2
Vlassak, J.J.3
Van der Giessen, E.4
Needleman, A.5
-
153
-
-
18444369672
-
Size-dependent yield strength of thin films
-
Fredriksson P., and Gudmundson P. Size-dependent yield strength of thin films. Int J Plasticity 21 (2005) 1834-1854
-
(2005)
Int J Plasticity
, vol.21
, pp. 1834-1854
-
-
Fredriksson, P.1
Gudmundson, P.2
-
154
-
-
0038312120
-
Discrete dislocation analysis of size effects in thin films
-
Nicola L., Van der Giessen E., and Needleman A. Discrete dislocation analysis of size effects in thin films. J Appl Phys 93 (2003) 5920-5928
-
(2003)
J Appl Phys
, vol.93
, pp. 5920-5928
-
-
Nicola, L.1
Van der Giessen, E.2
Needleman, A.3
-
156
-
-
0035426513
-
Dislocation accumulation and strengthening in Cu thin films
-
Weihnacht V., and Bruckner W. Dislocation accumulation and strengthening in Cu thin films. Acta Mater 49 (2001) 2365-2372
-
(2001)
Acta Mater
, vol.49
, pp. 2365-2372
-
-
Weihnacht, V.1
Bruckner, W.2
-
157
-
-
0037603257
-
Dislocation interactions in thin FCC metal films
-
Pant P., Schwarz K.W., and Baker S.P. Dislocation interactions in thin FCC metal films. Acta Mater 51 (2003) 3243-3258
-
(2003)
Acta Mater
, vol.51
, pp. 3243-3258
-
-
Pant, P.1
Schwarz, K.W.2
Baker, S.P.3
-
158
-
-
0035371582
-
Boundary layers in constrained plastic flow: comparison of nonlocal and discrete dislocation plasticity
-
Shu J.Y., Fleck N.A., Van der Giessen E., and Needleman A. Boundary layers in constrained plastic flow: comparison of nonlocal and discrete dislocation plasticity. J Mech Phys Solids 49 (2001) 1361-1395
-
(2001)
J Mech Phys Solids
, vol.49
, pp. 1361-1395
-
-
Shu, J.Y.1
Fleck, N.A.2
Van der Giessen, E.3
Needleman, A.4
-
159
-
-
0035338864
-
Dislocation sources in discrete dislocation simulations of thin-film plasticity and the Hall-Petch relation
-
von Blanckenhagen B., Gumbsch P., and Arzt E. Dislocation sources in discrete dislocation simulations of thin-film plasticity and the Hall-Petch relation. Model Simul Mater Sci Engng 9 (2001) 157-169
-
(2001)
Model Simul Mater Sci Engng
, vol.9
, pp. 157-169
-
-
von Blanckenhagen, B.1
Gumbsch, P.2
Arzt, E.3
-
160
-
-
1642633214
-
A unified treatment of strain gradient plasticity
-
Gudmundson P. A unified treatment of strain gradient plasticity. J Mech Phys Solids 52 (2004) 1379-1406
-
(2004)
J Mech Phys Solids
, vol.52
, pp. 1379-1406
-
-
Gudmundson, P.1
-
161
-
-
33748780902
-
Size effect in tension of thin films on substrate: a study based on the reformulation of mechanism-based strain gradient plasticity
-
Yun G., Hwang K.C., Huang Y., Wu P.D., and Liu C. Size effect in tension of thin films on substrate: a study based on the reformulation of mechanism-based strain gradient plasticity. Philos Mag 86 (2006) 5553-5566
-
(2006)
Philos Mag
, vol.86
, pp. 5553-5566
-
-
Yun, G.1
Hwang, K.C.2
Huang, Y.3
Wu, P.D.4
Liu, C.5
-
162
-
-
33847697772
-
A thermodynamic based higher order gradient theory for size dependent plasticity
-
Abu Al-Rub R.K., Voyiadjis G.Z., and Bammann D.J. A thermodynamic based higher order gradient theory for size dependent plasticity. Int J Solids Struct 44 (2007) 2888-2923
-
(2007)
Int J Solids Struct
, vol.44
, pp. 2888-2923
-
-
Abu Al-Rub, R.K.1
Voyiadjis, G.Z.2
Bammann, D.J.3
-
163
-
-
16344379922
-
Size effects in single crystal thin films: nonlocal crystal plasticity simulations
-
Yefimov S., and Van der Giessen E. Size effects in single crystal thin films: nonlocal crystal plasticity simulations. Eur J Mech A - Solids 24 (2005) 183-193
-
(2005)
Eur J Mech A - Solids
, vol.24
, pp. 183-193
-
-
Yefimov, S.1
Van der Giessen, E.2
-
164
-
-
3142530658
-
Mierarchical multi-scale modeling of plasticity of submicron thin metal films
-
Buehler M.J., Hartmaier A., and Gao H. Mierarchical multi-scale modeling of plasticity of submicron thin metal films. Modell Simul Mater Sci Engng 12 (2004) S391-S413
-
(2004)
Modell Simul Mater Sci Engng
, vol.12
-
-
Buehler, M.J.1
Hartmaier, A.2
Gao, H.3
-
165
-
-
0035701108
-
A Peierls analysis of the critical stress for transmission of a screw dislocation across a coherent, sliding interface
-
Anderson P.M., and Li Z.Y. A Peierls analysis of the critical stress for transmission of a screw dislocation across a coherent, sliding interface. Mater Sci Engng A 319 (2001) 182-187
-
(2001)
Mater Sci Engng A
, vol.319
, pp. 182-187
-
-
Anderson, P.M.1
Li, Z.Y.2
-
166
-
-
27844550377
-
Dislocation motion in anisotropic multilayer materials
-
Ghoniem N.M., and Han X. Dislocation motion in anisotropic multilayer materials. Philos Mag 85 (2005) 2809-2830
-
(2005)
Philos Mag
, vol.85
, pp. 2809-2830
-
-
Ghoniem, N.M.1
Han, X.2
-
167
-
-
27844570371
-
Stress field and interaction forces of dislocations in anisotropic multilayer thin films
-
Han X., and Ghoniem N.M. Stress field and interaction forces of dislocations in anisotropic multilayer thin films. Philos Mag 85 (2005) 1205-1225
-
(2005)
Philos Mag
, vol.85
, pp. 1205-1225
-
-
Han, X.1
Ghoniem, N.M.2
-
168
-
-
34548017194
-
Interactions between glide dislocations and parallel interfacial dislocations in nanoscale strained layers
-
Akasheh F., Zbib H.M., Hirth J.P., Hoagland R.G., and Misra A. Interactions between glide dislocations and parallel interfacial dislocations in nanoscale strained layers. J Appl Phys 102 (2007) 034314
-
(2007)
J Appl Phys
, vol.102
, pp. 034314
-
-
Akasheh, F.1
Zbib, H.M.2
Hirth, J.P.3
Hoagland, R.G.4
Misra, A.5
-
169
-
-
0035532248
-
Deformation behavior of nanostructured metallic multilayers
-
Misra A., and Kung H. Deformation behavior of nanostructured metallic multilayers. Adv Engng Mater 3 (2001) 217-222
-
(2001)
Adv Engng Mater
, vol.3
, pp. 217-222
-
-
Misra, A.1
Kung, H.2
-
170
-
-
0037058468
-
Single-dislocation-based strengthening mechanisms in nanoscale metallic multilayers
-
Misra A., Hirth J.P., and Kung H. Single-dislocation-based strengthening mechanisms in nanoscale metallic multilayers. Philos Mag A 82 (2002) 2935-2951
-
(2002)
Philos Mag A
, vol.82
, pp. 2935-2951
-
-
Misra, A.1
Hirth, J.P.2
Kung, H.3
-
171
-
-
0033074976
-
Dislocation-based deformation mechanisms in metallic nanolaminates
-
Anderson P.M., Foecke T., and Hazzledine P.M. Dislocation-based deformation mechanisms in metallic nanolaminates. MRS Bull 24 2 (1999) 27-33
-
(1999)
MRS Bull
, vol.24
, Issue.2
, pp. 27-33
-
-
Anderson, P.M.1
Foecke, T.2
Hazzledine, P.M.3
-
172
-
-
0033076264
-
Structure and strength of multilayers
-
Clemens B.M., Kung H., and Barnett S.A. Structure and strength of multilayers. MRS Bull 24 2 (1999) 20-26
-
(1999)
MRS Bull
, vol.24
, Issue.2
, pp. 20-26
-
-
Clemens, B.M.1
Kung, H.2
Barnett, S.A.3
-
173
-
-
0033075372
-
Mechanical behavior of nanostructured materials
-
Kung H., and Foecke T. Mechanical behavior of nanostructured materials. MRS Bull 24 2 (1999) 14-15
-
(1999)
MRS Bull
, vol.24
, Issue.2
, pp. 14-15
-
-
Kung, H.1
Foecke, T.2
-
174
-
-
12344334722
-
Dislocation-based modeling of the mechanical behavior of epitaxial metallic multilayer thin films
-
Li Q.Z., and Anderson P.M. Dislocation-based modeling of the mechanical behavior of epitaxial metallic multilayer thin films. Acta Mater 53 (2005) 1121-1134
-
(2005)
Acta Mater
, vol.53
, pp. 1121-1134
-
-
Li, Q.Z.1
Anderson, P.M.2
-
175
-
-
0032482795
-
Structure and mechanical properties of Cu-X (X = Nb, Cr, Ni) nanolayered composites
-
Misra A., Verdier M., Lu Y.C., Kung H., Mitchell T.E., Nastasi M., et al. Structure and mechanical properties of Cu-X (X = Nb, Cr, Ni) nanolayered composites. Scripta Mater 39 (1998) 555-560
-
(1998)
Scripta Mater
, vol.39
, pp. 555-560
-
-
Misra, A.1
Verdier, M.2
Lu, Y.C.3
Kung, H.4
Mitchell, T.E.5
Nastasi, M.6
-
176
-
-
21644454320
-
Modeling analysis of the indentation-derived yield properties of metallic multilayered composites
-
Tan X.H., and Shen Y.-L. Modeling analysis of the indentation-derived yield properties of metallic multilayered composites. Compos Sci Technol 65 (2005) 1639-1646
-
(2005)
Compos Sci Technol
, vol.65
, pp. 1639-1646
-
-
Tan, X.H.1
Shen, Y.-L.2
-
177
-
-
44349101765
-
-
Chawla N, Singh DRP, Shen Y-L, Tang G, Chawla KK. Indentation mechanics and fracture behavior of metal/ceramic nanolaminates composites. J Mater Sci 2008; doi:10.1007/s10853-008-2450-3.
-
Chawla N, Singh DRP, Shen Y-L, Tang G, Chawla KK. Indentation mechanics and fracture behavior of metal/ceramic nanolaminates composites. J Mater Sci 2008; doi:10.1007/s10853-008-2450-3.
-
-
-
-
178
-
-
25444444698
-
Length-scale-dependent deformation mechanisms in incoherent metallic multilayered composites
-
Misra A., Hirth J.P., and Hoagland R.G. Length-scale-dependent deformation mechanisms in incoherent metallic multilayered composites. Acta Mater 53 (2005) 4817-4824
-
(2005)
Acta Mater
, vol.53
, pp. 4817-4824
-
-
Misra, A.1
Hirth, J.P.2
Hoagland, R.G.3
-
179
-
-
34247599384
-
Dislocation dynamics analysis of dislocation intersections in nanoscale metallic multilayered composites
-
Akasheh F., Zbib H.M., Hirth J.P., Hoagland R.G., and Misra A. Dislocation dynamics analysis of dislocation intersections in nanoscale metallic multilayered composites. J Appl Phys 101 (2007) 084314
-
(2007)
J Appl Phys
, vol.101
, pp. 084314
-
-
Akasheh, F.1
Zbib, H.M.2
Hirth, J.P.3
Hoagland, R.G.4
Misra, A.5
-
180
-
-
0142217260
-
Structure, hardness and thermal stability of nanolayered TiN/CrN multilayer coatings
-
Barshilia H.C., Jain A., and Rajam K.S. Structure, hardness and thermal stability of nanolayered TiN/CrN multilayer coatings. Vacuum 72 (2003) 241-248
-
(2003)
Vacuum
, vol.72
, pp. 241-248
-
-
Barshilia, H.C.1
Jain, A.2
Rajam, K.S.3
-
181
-
-
33645519043
-
Experimental evidence of plastic deformation instability in nanoscale Au/Cu multilayers
-
Zhang G.P., Liu Y., Wang W., and Tan J. Experimental evidence of plastic deformation instability in nanoscale Au/Cu multilayers. Appl Phys Lett 88 (2006) 013105
-
(2006)
Appl Phys Lett
, vol.88
, pp. 013105
-
-
Zhang, G.P.1
Liu, Y.2
Wang, W.3
Tan, J.4
-
182
-
-
34247594839
-
On interface strengthening ability in metallic multilayers
-
Li Y.P., Zhang G.P., Wang W., Tan J., and Zhu S.J. On interface strengthening ability in metallic multilayers. Scripta Mater 57 (2007) 117-120
-
(2007)
Scripta Mater
, vol.57
, pp. 117-120
-
-
Li, Y.P.1
Zhang, G.P.2
Wang, W.3
Tan, J.4
Zhu, S.J.5
-
183
-
-
38749089893
-
The radiation damage tolerance of ultra-high strength nanolayered composites
-
Misra A., Demkowics M.J., Zhang X., and Hoagland R.G. The radiation damage tolerance of ultra-high strength nanolayered composites. JOM 59 9 (2007) 62-65
-
(2007)
JOM
, vol.59
, Issue.9
, pp. 62-65
-
-
Misra, A.1
Demkowics, M.J.2
Zhang, X.3
Hoagland, R.G.4
-
184
-
-
0035942286
-
Paper-like electronic displays: large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks
-
Rogers J.A., Bao Z., Baldwin K., Dodabalapur A., Crone B., Raju V.R., et al. Paper-like electronic displays: large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks. Proc Natl Acad Sci USA 98 (2001) 4835-4840
-
(2001)
Proc Natl Acad Sci USA
, vol.98
, pp. 4835-4840
-
-
Rogers, J.A.1
Bao, Z.2
Baldwin, K.3
Dodabalapur, A.4
Crone, B.5
Raju, V.R.6
-
185
-
-
2342486652
-
The path to ubiquitous and low-cost organic electronic appliances on plastic
-
Forrest S.R. The path to ubiquitous and low-cost organic electronic appliances on plastic. Nature 428 (2004) 911-918
-
(2004)
Nature
, vol.428
, pp. 911-918
-
-
Forrest, S.R.1
-
187
-
-
30444461021
-
Compliant thin film patterns of stiff materials as platforms for stretchable electronics
-
Li T., Suo Z., Lacour S.P., and Wagner S. Compliant thin film patterns of stiff materials as platforms for stretchable electronics. J Mater Res 20 (2005) 3274-3277
-
(2005)
J Mater Res
, vol.20
, pp. 3274-3277
-
-
Li, T.1
Suo, Z.2
Lacour, S.P.3
Wagner, S.4
-
188
-
-
36549092777
-
Adhesion and deformation of metal/polyimide layered structures
-
Faupel F., Yang C.H., Chen S.T., and Ho P.S. Adhesion and deformation of metal/polyimide layered structures. J Appl Phys 65 (1989) 1911-1917
-
(1989)
J Appl Phys
, vol.65
, pp. 1911-1917
-
-
Faupel, F.1
Yang, C.H.2
Chen, S.T.3
Ho, P.S.4
-
189
-
-
36448999689
-
Fracture of metal-polymer line structures I. Semiflexible polyimide
-
Chiu S.L., Leu J., and Ho P.S. Fracture of metal-polymer line structures I. Semiflexible polyimide. J Appl Phys 76 (1994) 5136-5142
-
(1994)
J Appl Phys
, vol.76
, pp. 5136-5142
-
-
Chiu, S.L.1
Leu, J.2
Ho, P.S.3
-
190
-
-
0031187098
-
Thickness dependent mechanical behavior of submicron aluminum films
-
Kang Y.-S., and Ho P.S. Thickness dependent mechanical behavior of submicron aluminum films. J Electron Mater 26 (1997) 805-813
-
(1997)
J Electron Mater
, vol.26
, pp. 805-813
-
-
Kang, Y.-S.1
Ho, P.S.2
-
191
-
-
0001622744
-
Tensile testing of AlCu thin films on polyimide foils
-
Macionczyk F., and Bruckner W. Tensile testing of AlCu thin films on polyimide foils. J Appl Phys 86 (1999) 4922-4929
-
(1999)
J Appl Phys
, vol.86
, pp. 4922-4929
-
-
Macionczyk, F.1
Bruckner, W.2
-
192
-
-
0032623850
-
A new method to study cyclic deformation of thin films in tension and compression
-
Hommel M., Kraft O., and Arzt E. A new method to study cyclic deformation of thin films in tension and compression. J Mater Res 14 (1999) 2373-2376
-
(1999)
J Mater Res
, vol.14
, pp. 2373-2376
-
-
Hommel, M.1
Kraft, O.2
Arzt, E.3
-
193
-
-
0035860885
-
Deformation behavior of thin copper films on deformable substrates
-
Hommel M., and Kraft O. Deformation behavior of thin copper films on deformable substrates. Acta Mater 49 (2001) 3935-3947
-
(2001)
Acta Mater
, vol.49
, pp. 3935-3947
-
-
Hommel, M.1
Kraft, O.2
-
194
-
-
0037075747
-
On the interface debond at the edge of a thin film on a thick substrate
-
Alaca B.E., Saif M.T.A., and Sehitoglu H. On the interface debond at the edge of a thin film on a thick substrate. Acta Mater 50 (2002) 1197-1209
-
(2002)
Acta Mater
, vol.50
, pp. 1197-1209
-
-
Alaca, B.E.1
Saif, M.T.A.2
Sehitoglu, H.3
-
195
-
-
1842584184
-
The yield strength of thin copper films on Kapton
-
Yu D.Y.W., and Spaepen F. The yield strength of thin copper films on Kapton. J Appl Phys 95 (2004) 2991-2997
-
(2004)
J Appl Phys
, vol.95
, pp. 2991-2997
-
-
Yu, D.Y.W.1
Spaepen, F.2
-
196
-
-
0242366180
-
Cyclic deformation of polycrystalline Cu films
-
Schwaiger R., Dehm G., and Kraft O. Cyclic deformation of polycrystalline Cu films. Philos Mag 83 (2003) 693-710
-
(2003)
Philos Mag
, vol.83
, pp. 693-710
-
-
Schwaiger, R.1
Dehm, G.2
Kraft, O.3
-
197
-
-
11144354429
-
Tensile testing of ultrathin polycrystalline films: a synchrotron-based technique
-
Bohm J., Gruber P., Spolenak R., Stierle A., Wanner A., and Arzt E. Tensile testing of ultrathin polycrystalline films: a synchrotron-based technique. Rev Sci Instrum 75 (2004) 1110-1119
-
(2004)
Rev Sci Instrum
, vol.75
, pp. 1110-1119
-
-
Bohm, J.1
Gruber, P.2
Spolenak, R.3
Stierle, A.4
Wanner, A.5
Arzt, E.6
-
198
-
-
32044469433
-
Mechanical behavior of multilayered nanoscale metal-ceramic composites
-
Deng X., Chawla N., Chawla K.K., Koopman M., and Chu J.P. Mechanical behavior of multilayered nanoscale metal-ceramic composites. Adv Engng Mater 7 (2005) 1099-1108
-
(2005)
Adv Engng Mater
, vol.7
, pp. 1099-1108
-
-
Deng, X.1
Chawla, N.2
Chawla, K.K.3
Koopman, M.4
Chu, J.P.5
-
199
-
-
28344439100
-
High ductility of a metal film adherent on a polymer substrate
-
Xiang Y., Li T., Suo Z., and Vlassak J.J. High ductility of a metal film adherent on a polymer substrate. Appl Phys Lett 87 (2005) 161910
-
(2005)
Appl Phys Lett
, vol.87
, pp. 161910
-
-
Xiang, Y.1
Li, T.2
Suo, Z.3
Vlassak, J.J.4
-
200
-
-
33747087818
-
Length-scale-controlled fatigue mechanisms in thin copper films
-
Zhang G.P., Volkert C.A., Schwaiger R., Wellner P., Arzt E., and Kraft O. Length-scale-controlled fatigue mechanisms in thin copper films. Acta Mater 54 (2006) 3127-3139
-
(2006)
Acta Mater
, vol.54
, pp. 3127-3139
-
-
Zhang, G.P.1
Volkert, C.A.2
Schwaiger, R.3
Wellner, P.4
Arzt, E.5
Kraft, O.6
-
201
-
-
34548130658
-
In situ TEM straining of single crystal Au films on polyimide: change of deformation mechanisms at the nanoscale
-
Oh S.H., Legros M., Kiener D., Gruber P., and Dehm G. In situ TEM straining of single crystal Au films on polyimide: change of deformation mechanisms at the nanoscale. Acta Mater 55 (2007) 5558-5571
-
(2007)
Acta Mater
, vol.55
, pp. 5558-5571
-
-
Oh, S.H.1
Legros, M.2
Kiener, D.3
Gruber, P.4
Dehm, G.5
-
202
-
-
1842431119
-
High-conductivity elastomeric electronics
-
Gray D.S., Tien J., and Chen C.S. High-conductivity elastomeric electronics. Adv Mater 16 (2004) 393-397
-
(2004)
Adv Mater
, vol.16
, pp. 393-397
-
-
Gray, D.S.1
Tien, J.2
Chen, C.S.3
-
203
-
-
9744275958
-
Stretchability of thin metal films on elastomer substrates
-
Li T., Huang Z., Suo Z., Lacour S.P., and Wagner S. Stretchability of thin metal films on elastomer substrates. Appl Phys Lett 85 (2004) 3435-3437
-
(2004)
Appl Phys Lett
, vol.85
, pp. 3435-3437
-
-
Li, T.1
Huang, Z.2
Suo, Z.3
Lacour, S.P.4
Wagner, S.5
-
204
-
-
33846542473
-
Ductility of thin metal films on polymer substrates modulated by interfacial adhesion
-
Li T., and Suo Z. Ductility of thin metal films on polymer substrates modulated by interfacial adhesion. Int J Solids Struct 44 (2007) 1696-1705
-
(2007)
Int J Solids Struct
, vol.44
, pp. 1696-1705
-
-
Li, T.1
Suo, Z.2
-
206
-
-
84996245266
-
Diffusion creep of a thin foil
-
Gibbs G.B. Diffusion creep of a thin foil. Philos Mag 13 (1966) 589-593
-
(1966)
Philos Mag
, vol.13
, pp. 589-593
-
-
Gibbs, G.B.1
-
207
-
-
0027573340
-
Effect of surface diffusion on the creep of thin films and sintered arrays of particles
-
Thouless M.D. Effect of surface diffusion on the creep of thin films and sintered arrays of particles. Acta Metall Mater 41 (1993) 1057-1064
-
(1993)
Acta Metall Mater
, vol.41
, pp. 1057-1064
-
-
Thouless, M.D.1
-
208
-
-
0032684355
-
Crack-like grain boundary diffusion wedges in thin metal films
-
Gao H., Zhang L., Nix W.D., Thompson C.V., and Arzt E. Crack-like grain boundary diffusion wedges in thin metal films. Acta Mater 47 (1999) 2865-2878
-
(1999)
Acta Mater
, vol.47
, pp. 2865-2878
-
-
Gao, H.1
Zhang, L.2
Nix, W.D.3
Thompson, C.V.4
Arzt, E.5
-
209
-
-
0016027135
-
Strain-relaxation in thin films on substrates
-
Gangulee A. Strain-relaxation in thin films on substrates. Acta Mater 22 (1974) 177-183
-
(1974)
Acta Mater
, vol.22
, pp. 177-183
-
-
Gangulee, A.1
-
210
-
-
0013227815
-
Thermal strain in lead thin films. II: Strain relaxation mechanisms
-
Murakami M. Thermal strain in lead thin films. II: Strain relaxation mechanisms. Thin Solid Films 55 (1978) 101-111
-
(1978)
Thin Solid Films
, vol.55
, pp. 101-111
-
-
Murakami, M.1
-
211
-
-
0030127538
-
Steady-state creep of metal-ceramic multilayered materials
-
Shen Y.-L., and Suresh S. Steady-state creep of metal-ceramic multilayered materials. Acta Mater 44 (1996) 1337-1348
-
(1996)
Acta Mater
, vol.44
, pp. 1337-1348
-
-
Shen, Y.-L.1
Suresh, S.2
-
212
-
-
0036145862
-
Diffusional creep: stresses and strain rates in thin films and multilayers
-
Josell D., Weihs T.P., and Gao H. Diffusional creep: stresses and strain rates in thin films and multilayers. MRS Bull 27 1 (2002) 39-44
-
(2002)
MRS Bull
, vol.27
, Issue.1
, pp. 39-44
-
-
Josell, D.1
Weihs, T.P.2
Gao, H.3
-
213
-
-
4143098330
-
Geometric and material nonlinearity during the deformation of micron-scale thin-film bilayers subject to thermal loading
-
Zhang Y.H., and Dunn M.L. Geometric and material nonlinearity during the deformation of micron-scale thin-film bilayers subject to thermal loading. J Mech Phys Solids 52 (2004) 2101-2126
-
(2004)
J Mech Phys Solids
, vol.52
, pp. 2101-2126
-
-
Zhang, Y.H.1
Dunn, M.L.2
-
214
-
-
33744938714
-
-
Lattice Press, Sunset Beach
-
Wolf S. Silicon processing for the VLSI era. Process integration vol. 2 (1990), Lattice Press, Sunset Beach
-
(1990)
Process integration
, vol.2
-
-
Wolf, S.1
-
216
-
-
84976052809
-
Stress-induced void formation in metal lines
-
Flinn P.A., Mack A.S., Besser P.R., and Marieb T.N. Stress-induced void formation in metal lines. MRS Bull 18 12 (1993) 26-35
-
(1993)
MRS Bull
, vol.18
, Issue.12
, pp. 26-35
-
-
Flinn, P.A.1
Mack, A.S.2
Besser, P.R.3
Marieb, T.N.4
-
217
-
-
0027887532
-
Stress-induced void formation in metallization for integrated circuits
-
Okabayashi H. Stress-induced void formation in metallization for integrated circuits. Mater Sci Engng R R11 (1993) 191-241
-
(1993)
Mater Sci Engng R
, vol.R11
, pp. 191-241
-
-
Okabayashi, H.1
-
218
-
-
0029406209
-
Mechanical stress in VLSI interconnects: origins, effects, measurement, and modeling
-
Flinn P.A. Mechanical stress in VLSI interconnects: origins, effects, measurement, and modeling. MRS Bull 20 11 (1995) 70-73
-
(1995)
MRS Bull
, vol.20
, Issue.11
, pp. 70-73
-
-
Flinn, P.A.1
-
219
-
-
0029327239
-
Electromigration in copper conductors
-
Lloyd J.R., and Clement J.J. Electromigration in copper conductors. Thin Solid Films 262 (1995) 135-141
-
(1995)
Thin Solid Films
, vol.262
, pp. 135-141
-
-
Lloyd, J.R.1
Clement, J.J.2
-
220
-
-
0029697286
-
Stress-induced voiding in microelectronic metallization: void growth models and refinements
-
Sullivan T.D. Stress-induced voiding in microelectronic metallization: void growth models and refinements. Annu Rev Mater Sci 26 (1996) 333-364
-
(1996)
Annu Rev Mater Sci
, vol.26
, pp. 333-364
-
-
Sullivan, T.D.1
-
221
-
-
0030289655
-
Physical metallurgy of electromigration: failure mechanisms in miniaturized conductor lines
-
Arzt E., Kraft O., Spolenak R., and Joo Y.-C. Physical metallurgy of electromigration: failure mechanisms in miniaturized conductor lines. Z Metallkd 87 (1996) 934-942
-
(1996)
Z Metallkd
, vol.87
, pp. 934-942
-
-
Arzt, E.1
Kraft, O.2
Spolenak, R.3
Joo, Y.-C.4
-
222
-
-
0030196162
-
Electromigration failure of contacts and vias in sub-micron integrated circuit metallizations
-
Oates A.S. Electromigration failure of contacts and vias in sub-micron integrated circuit metallizations. Microelectron Reliab 36 (1996) 925-953
-
(1996)
Microelectron Reliab
, vol.36
, pp. 925-953
-
-
Oates, A.S.1
-
223
-
-
0000541904
-
Electromigration in thin film conductors
-
Lloyd J.R. Electromigration in thin film conductors. Semicond Sci Technol 12 (1997) 1177-1185
-
(1997)
Semicond Sci Technol
, vol.12
, pp. 1177-1185
-
-
Lloyd, J.R.1
-
226
-
-
0011735428
-
Diffusional back flows during electromigration
-
Blech I.A. Diffusional back flows during electromigration. Acta Mater 46 (1998) 3717-3723
-
(1998)
Acta Mater
, vol.46
, pp. 3717-3723
-
-
Blech, I.A.1
-
227
-
-
0033100126
-
Metallurgical techniques for more reliable integrated circuits
-
Kang S.H., Morris Jr. J.W., and Oates A.S. Metallurgical techniques for more reliable integrated circuits. JOM 51 3 (1999) 16-18
-
(1999)
JOM
, vol.51
, Issue.3
, pp. 16-18
-
-
Kang, S.H.1
Morris Jr., J.W.2
Oates, A.S.3
-
229
-
-
33747167909
-
Microstructure and reliability of copper interconnects
-
Ryu C., Kwon K.-W., Loke A.L.S., Lee H., Nogami T., Dubin V.M., et al. Microstructure and reliability of copper interconnects. IEEE Trans Electron Dev 46 (1999) 1113-1120
-
(1999)
IEEE Trans Electron Dev
, vol.46
, pp. 1113-1120
-
-
Ryu, C.1
Kwon, K.-W.2
Loke, A.L.S.3
Lee, H.4
Nogami, T.5
Dubin, V.M.6
-
230
-
-
0035360088
-
Copper interconnects for semiconductor devices
-
Merchant S.M., Kang S.H., Sanganeria M., van Schravendijk B., and Mountsier T. Copper interconnects for semiconductor devices. JOM 53 6 (2001) 43-48
-
(2001)
JOM
, vol.53
, Issue.6
, pp. 43-48
-
-
Merchant, S.M.1
Kang, S.H.2
Sanganeria, M.3
van Schravendijk, B.4
Mountsier, T.5
-
231
-
-
0036892397
-
Electromigration reliability issues in dual-damascene Cu interconnections
-
Ogawa E.T., Lee K.D., Blaschke V.A., and Ho P.S. Electromigration reliability issues in dual-damascene Cu interconnections. IEEE Trans Reliab 51 (2002) 403-419
-
(2002)
IEEE Trans Reliab
, vol.51
, pp. 403-419
-
-
Ogawa, E.T.1
Lee, K.D.2
Blaschke, V.A.3
Ho, P.S.4
-
232
-
-
12844281545
-
Thermomechanical modeling of metal interconnects in microelectronic devices
-
Research Signpost, Trivandrum
-
Shen Y.-L. Thermomechanical modeling of metal interconnects in microelectronic devices. Recent research development in materials science VI (2003), Research Signpost, Trivandrum 125-155
-
(2003)
Recent research development in materials science VI
, pp. 125-155
-
-
Shen, Y.-L.1
-
233
-
-
0942277277
-
An introduction to Cu electromigration
-
Hau-Ridge C.S. An introduction to Cu electromigration. Microelectron Reliab 44 (2004) 195-205
-
(2004)
Microelectron Reliab
, vol.44
, pp. 195-205
-
-
Hau-Ridge, C.S.1
-
235
-
-
24144471091
-
Reliability challenges for copper low-k dielectrics and copper diffusion barriers
-
Tokei Zs., Li Y.-L., and Beyer G.P. Reliability challenges for copper low-k dielectrics and copper diffusion barriers. Microelectron Reliab 45 (2005) 1436-1442
-
(2005)
Microelectron Reliab
, vol.45
, pp. 1436-1442
-
-
Tokei, Zs.1
Li, Y.-L.2
Beyer, G.P.3
-
236
-
-
33751216199
-
Challenges in advanced metallization schemes
-
Brillouet M. Challenges in advanced metallization schemes. Microelectron Reliab 83 (2006) 2036-2041
-
(2006)
Microelectron Reliab
, vol.83
, pp. 2036-2041
-
-
Brillouet, M.1
-
237
-
-
0027639324
-
Measurement of thermal stress and stress relaxation in confined metal lines. 1. Stresses during thermal cycling
-
Moske M.A., Ho P.S., Mikalsen D.J., Cuomo J.J., and Rosenberg R. Measurement of thermal stress and stress relaxation in confined metal lines. 1. Stresses during thermal cycling. J Appl Phys 74 (1993) 1716-1724
-
(1993)
J Appl Phys
, vol.74
, pp. 1716-1724
-
-
Moske, M.A.1
Ho, P.S.2
Mikalsen, D.J.3
Cuomo, J.J.4
Rosenberg, R.5
-
238
-
-
0001106749
-
Characteristics of thermal stresses in Al(Cu) fine lines. 1. Unpassivated line structures
-
Yeo I.S., Ho P.S., and Anderson S.G.H. Characteristics of thermal stresses in Al(Cu) fine lines. 1. Unpassivated line structures. J Appl Phys 78 (1995) 945-952
-
(1995)
J Appl Phys
, vol.78
, pp. 945-952
-
-
Yeo, I.S.1
Ho, P.S.2
Anderson, S.G.H.3
-
239
-
-
3743109337
-
Stresses, curvatures, and shape changes arising from patterned lines on silicon wafers
-
Shen Y.-L., Suresh S., and Blech I.A. Stresses, curvatures, and shape changes arising from patterned lines on silicon wafers. J Appl Phys 80 (1996) 1388-1398
-
(1996)
J Appl Phys
, vol.80
, pp. 1388-1398
-
-
Shen, Y.-L.1
Suresh, S.2
Blech, I.A.3
-
241
-
-
0029239147
-
-
Burges U, Helneder H, Schneegans M, Beckers D, Hallerbach M, Schroeder H, et al. Thermal stresses in passivated AlSiCu-lines from wafer curvature measurement. In: Thin films: stresses and mechanical properties V. Materials Research Society symposium proceedings, vol. 356; 1995. p. 423-9.
-
Burges U, Helneder H, Schneegans M, Beckers D, Hallerbach M, Schroeder H, et al. Thermal stresses in passivated AlSiCu-lines from wafer curvature measurement. In: Thin films: stresses and mechanical properties V. Materials Research Society symposium proceedings, vol. 356; 1995. p. 423-9.
-
-
-
-
242
-
-
0001106750
-
Characteristics of thermal stresses in Al(Cu) fine lines. 2. Passivated line structures
-
Yeo I.S., Anderson S.G.H., Ho P.S., and Hu C.K. Characteristics of thermal stresses in Al(Cu) fine lines. 2. Passivated line structures. J Appl Phys 78 (1995) 953-961
-
(1995)
J Appl Phys
, vol.78
, pp. 953-961
-
-
Yeo, I.S.1
Anderson, S.G.H.2
Ho, P.S.3
Hu, C.K.4
-
243
-
-
19944432776
-
Numerical simulations and experimental measurements of stress relaxation by interface diffusion in a patterned copper interconnect structure
-
Singh N., Bower A.F., Gan D., Yoon S., Ho P.S., Leu J., et al. Numerical simulations and experimental measurements of stress relaxation by interface diffusion in a patterned copper interconnect structure. J Appl Phys 97 (2004) 013539
-
(2004)
J Appl Phys
, vol.97
, pp. 013539
-
-
Singh, N.1
Bower, A.F.2
Gan, D.3
Yoon, S.4
Ho, P.S.5
Leu, J.6
-
244
-
-
0000881016
-
Stress in metal lines under passivation: comparison of experiment and finite-element calculations
-
Greenebaum B., Sauter A.I., Flinn P.A., and Nix W.D. Stress in metal lines under passivation: comparison of experiment and finite-element calculations. Appl Phys Lett 58 (1991) 1845-1847
-
(1991)
Appl Phys Lett
, vol.58
, pp. 1845-1847
-
-
Greenebaum, B.1
Sauter, A.I.2
Flinn, P.A.3
Nix, W.D.4
-
245
-
-
0028715511
-
-
Marcus MA, Flood WF, Cirelli RA, Kistler RC, Ciampa NA, Mansfield WM, et al. X-ray strain measurements in fine-line patterned Al-Cu films. In: Materials reliability in microelectronics IV. Materials Research Society symposium proceedings, vol. 338; 1994. p. 203-8.
-
Marcus MA, Flood WF, Cirelli RA, Kistler RC, Ciampa NA, Mansfield WM, et al. X-ray strain measurements in fine-line patterned Al-Cu films. In: Materials reliability in microelectronics IV. Materials Research Society symposium proceedings, vol. 338; 1994. p. 203-8.
-
-
-
-
246
-
-
0028319559
-
An X-ray method for direct determination of the strain state and strain relaxation in micron-scale passivated metallization lines during thermal cycling
-
Besser P.R., Brennen S., and Bravman J.C. An X-ray method for direct determination of the strain state and strain relaxation in micron-scale passivated metallization lines during thermal cycling. J Mater Res 9 (1994) 13-24
-
(1994)
J Mater Res
, vol.9
, pp. 13-24
-
-
Besser, P.R.1
Brennen, S.2
Bravman, J.C.3
-
247
-
-
0000866428
-
Investigation of the stresses in continuous thin films and patterned lines by X-ray diffraction
-
Kuschke W.M., and Arzt E. Investigation of the stresses in continuous thin films and patterned lines by X-ray diffraction. Appl Phys Lett 64 (1994) 1097-1099
-
(1994)
Appl Phys Lett
, vol.64
, pp. 1097-1099
-
-
Kuschke, W.M.1
Arzt, E.2
-
248
-
-
0028727125
-
-
Maniguet L, Ignat M, Dupeux M, Bacmann JJ, Normandon Ph. X-ray diffraction determination of the effect of passivation on stress in patterned lines of tungsten. In: Materials reliability in microelectronics IV. Materials Research Society symposium proceedings, vol. 338; 1994. p. 241-6.
-
Maniguet L, Ignat M, Dupeux M, Bacmann JJ, Normandon Ph. X-ray diffraction determination of the effect of passivation on stress in patterned lines of tungsten. In: Materials reliability in microelectronics IV. Materials Research Society symposium proceedings, vol. 338; 1994. p. 241-6.
-
-
-
-
249
-
-
0029755274
-
Measurement and interpretation of strain relaxation in passivated Al-0.5%Cu lines
-
Besser P.R., Marieb T.N., Lee J., Flinn P.A., and Bravman J.C. Measurement and interpretation of strain relaxation in passivated Al-0.5%Cu lines. J Mater Res 11 (1996) 184-193
-
(1996)
J Mater Res
, vol.11
, pp. 184-193
-
-
Besser, P.R.1
Marieb, T.N.2
Lee, J.3
Flinn, P.A.4
Bravman, J.C.5
-
250
-
-
0001240614
-
Analysis of local mechanical stresses in and near tungsten lines on silicon substrate
-
De Wolf I., Ignat M., Pozza G., Maniguet M., and Maes H.E. Analysis of local mechanical stresses in and near tungsten lines on silicon substrate. J Appl Phys 85 (1999) 6477-6485
-
(1999)
J Appl Phys
, vol.85
, pp. 6477-6485
-
-
De Wolf, I.1
Ignat, M.2
Pozza, G.3
Maniguet, M.4
Maes, H.E.5
-
251
-
-
0029324555
-
Strain analysis in fine Al interconnections by X-ray diffraction spectrometry using micro X-ray beam
-
Yamamoto N., and Sakata S. Strain analysis in fine Al interconnections by X-ray diffraction spectrometry using micro X-ray beam. Jpn J Appl Phys Part 2 34 (1995) L664-L667
-
(1995)
Jpn J Appl Phys Part 2
, vol.34
-
-
Yamamoto, N.1
Sakata, S.2
-
252
-
-
0001127312
-
Electromigration-induced stress in aluminum conductor lines measured by X-ray microdiffraction
-
Wang P.C., Cargill III G.S., Noyan I.C., and Hu C.-K. Electromigration-induced stress in aluminum conductor lines measured by X-ray microdiffraction. Appl Phys Lett 72 (1998) 1296-1298
-
(1998)
Appl Phys Lett
, vol.72
, pp. 1296-1298
-
-
Wang, P.C.1
Cargill III, G.S.2
Noyan, I.C.3
Hu, C.-K.4
-
253
-
-
0012099646
-
Measurement of strain in Al-Cu interconnect lines with X-ray microdiffraction
-
Solak H.H., Vladimirsky Y., Cerrina F., Lai B., Yun W., Cai Z., et al. Measurement of strain in Al-Cu interconnect lines with X-ray microdiffraction. J Appl Phys 86 (1999) 884-890
-
(1999)
J Appl Phys
, vol.86
, pp. 884-890
-
-
Solak, H.H.1
Vladimirsky, Y.2
Cerrina, F.3
Lai, B.4
Yun, W.5
Cai, Z.6
-
254
-
-
0035971763
-
Real-time X-ray microbeam characterization of electromigration effects in Al(Cu) wires
-
Wang P.C., Noyan I.C., Kaldor S.K., Jordan-Sweet J., Liniger E.G., and Hu C.K. Real-time X-ray microbeam characterization of electromigration effects in Al(Cu) wires. Appl Phys Lett 78 (2001) 2712-2714
-
(2001)
Appl Phys Lett
, vol.78
, pp. 2712-2714
-
-
Wang, P.C.1
Noyan, I.C.2
Kaldor, S.K.3
Jordan-Sweet, J.4
Liniger, E.G.5
Hu, C.K.6
-
255
-
-
0036494182
-
Submicron X-ray diffraction and its applications to problems in materials and environmental science
-
Tamura N., Celestre R.S., MacDowell A.A., Padmore H.A., Spolenak R., Valek B.C., et al. Submicron X-ray diffraction and its applications to problems in materials and environmental science. Rev Sci Instrum 73 (2002) 1369-1372
-
(2002)
Rev Sci Instrum
, vol.73
, pp. 1369-1372
-
-
Tamura, N.1
Celestre, R.S.2
MacDowell, A.A.3
Padmore, H.A.4
Spolenak, R.5
Valek, B.C.6
-
256
-
-
0037390977
-
Thermal stress characteristics of Cu/oxide and Cu/low-k submicron interconnect structures
-
Rhee S.-H., Du Y., and Ho P.S. Thermal stress characteristics of Cu/oxide and Cu/low-k submicron interconnect structures. J Appl Phys 93 (2003) 3926-3933
-
(2003)
J Appl Phys
, vol.93
, pp. 3926-3933
-
-
Rhee, S.-H.1
Du, Y.2
Ho, P.S.3
-
257
-
-
0038337887
-
Thermal stress characteristics of two-level Al(Cu) interconnect structure
-
Rhee S.-H., and Ho P.S. Thermal stress characteristics of two-level Al(Cu) interconnect structure. J Mater Res 18 (2003) 848-854
-
(2003)
J Mater Res
, vol.18
, pp. 848-854
-
-
Rhee, S.-H.1
Ho, P.S.2
-
258
-
-
20944439179
-
Effect of dielectric materials on stress-induced damage modes in damascene Cu lines
-
Paik J.-M., Park H., Joo Y.-C., and Park K.-C. Effect of dielectric materials on stress-induced damage modes in damascene Cu lines. J Appl Phys 97 (2005) 104513
-
(2005)
J Appl Phys
, vol.97
, pp. 104513
-
-
Paik, J.-M.1
Park, H.2
Joo, Y.-C.3
Park, K.-C.4
-
259
-
-
33745050126
-
Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron X-ray microdiffraction
-
Budiman A.S., Nix W.D., Tamura N., Valek B.C., Gadre K., Maiz J., et al. Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron X-ray microdiffraction. Appl Phys Lett 88 (2006) 233-515
-
(2006)
Appl Phys Lett
, vol.88
, pp. 233-515
-
-
Budiman, A.S.1
Nix, W.D.2
Tamura, N.3
Valek, B.C.4
Gadre, K.5
Maiz, J.6
-
260
-
-
0000704120
-
High-resolution determination of the stress in individual interconnect lines and the variation due to electromigration
-
Ma Q., Chiras S., Clarke D.R., and Suo Z. High-resolution determination of the stress in individual interconnect lines and the variation due to electromigration. J Appl Phys 78 (1995) 1614-1622
-
(1995)
J Appl Phys
, vol.78
, pp. 1614-1622
-
-
Ma, Q.1
Chiras, S.2
Clarke, D.R.3
Suo, Z.4
-
261
-
-
0030081591
-
Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits
-
De Wolf I. Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits. Semicond Sci Technol 11 (1996) 139-154
-
(1996)
Semicond Sci Technol
, vol.11
, pp. 139-154
-
-
De Wolf, I.1
-
262
-
-
0033882177
-
IC test structures for multilayer interconnect stress determination
-
Smee S.A., Gaitan M., Novotny D.B., Joshi Y., and Blackburn D.L. IC test structures for multilayer interconnect stress determination. IEEE Electron Dev Lett 21 (2000) 12-14
-
(2000)
IEEE Electron Dev Lett
, vol.21
, pp. 12-14
-
-
Smee, S.A.1
Gaitan, M.2
Novotny, D.B.3
Joshi, Y.4
Blackburn, D.L.5
-
263
-
-
85137270685
-
Thermal stresses in a rectangular plate clamped along an edge
-
Aleck B.J. Thermal stresses in a rectangular plate clamped along an edge. J Appl Mech 16 (1949) 118-122
-
(1949)
J Appl Mech
, vol.16
, pp. 118-122
-
-
Aleck, B.J.1
-
264
-
-
0019577637
-
Comments on Aleck's stress distribution in clamped plates
-
Blech I.A., and Levi A.A. Comments on Aleck's stress distribution in clamped plates. J Appl Mech 48 (1981) 442-445
-
(1981)
J Appl Mech
, vol.48
, pp. 442-445
-
-
Blech, I.A.1
Levi, A.A.2
-
265
-
-
0000365719
-
Stress distribution in an aluminum interconnect of very large scale integration
-
Niwa H., Yagi H., Tsuchikawa H., and Kato M. Stress distribution in an aluminum interconnect of very large scale integration. J Appl Phys 68 (1990) 328-333
-
(1990)
J Appl Phys
, vol.68
, pp. 328-333
-
-
Niwa, H.1
Yagi, H.2
Tsuchikawa, H.3
Kato, M.4
-
266
-
-
36449009582
-
Stress relaxation of passivated aluminum line metallizations on silicon substrates
-
Korhonen M.A., Black R.D., and Li C.-Y. Stress relaxation of passivated aluminum line metallizations on silicon substrates. J Appl Phys 69 (1991) 1748-1755
-
(1991)
J Appl Phys
, vol.69
, pp. 1748-1755
-
-
Korhonen, M.A.1
Black, R.D.2
Li, C.-Y.3
-
267
-
-
0032644329
-
Thermoelastic analysis of periodic thin lines deposited on substrate
-
Wikstrom A., Gudmundson P., and Suresh S. Thermoelastic analysis of periodic thin lines deposited on substrate. J Mech Phys Solids 47 (1999) 1113-1130
-
(1999)
J Mech Phys Solids
, vol.47
, pp. 1113-1130
-
-
Wikstrom, A.1
Gudmundson, P.2
Suresh, S.3
-
268
-
-
3242854332
-
Analysis of average thermal stresses in passivated metal interconnects
-
Wikstrom A., Gudmundson P., and Suresh S. Analysis of average thermal stresses in passivated metal interconnects. J Appl Phys 86 (1999) 6088-6095
-
(1999)
J Appl Phys
, vol.86
, pp. 6088-6095
-
-
Wikstrom, A.1
Gudmundson, P.2
Suresh, S.3
-
269
-
-
0032629653
-
Onset of plastic yielding in thin metal lines deposited on substrates
-
Gouldstone A., Wikstrom A., Gudmundson P., and Suresh S. Onset of plastic yielding in thin metal lines deposited on substrates. Scripta Mater 41 (1999) 297-304
-
(1999)
Scripta Mater
, vol.41
, pp. 297-304
-
-
Gouldstone, A.1
Wikstrom, A.2
Gudmundson, P.3
Suresh, S.4
-
270
-
-
0033746458
-
Stresses in passivated lines from curvature measurements
-
Wikstrom A., and Gudmundson P. Stresses in passivated lines from curvature measurements. Acta Mater 48 (2000) 2429-2434
-
(2000)
Acta Mater
, vol.48
, pp. 2429-2434
-
-
Wikstrom, A.1
Gudmundson, P.2
-
271
-
-
0034225053
-
Effects of line and passivation geometry on curvature evolution during processing and thermal cycling in copper interconnect lines
-
Park T.S., and Suresh S. Effects of line and passivation geometry on curvature evolution during processing and thermal cycling in copper interconnect lines. Acta Mater 48 (2000) 3169-3175
-
(2000)
Acta Mater
, vol.48
, pp. 3169-3175
-
-
Park, T.S.1
Suresh, S.2
-
272
-
-
0035839963
-
Note on the thermal stresses in passivated metal interconnects
-
Sharma P., Ardebili H., and Loman J. Note on the thermal stresses in passivated metal interconnects. Appl Phys Lett 79 (2001) 1706-1708
-
(2001)
Appl Phys Lett
, vol.79
, pp. 1706-1708
-
-
Sharma, P.1
Ardebili, H.2
Loman, J.3
-
273
-
-
0036639656
-
Modeling of thermal stresses in passivated interconnects
-
Hsueh C.H. Modeling of thermal stresses in passivated interconnects. J Appl Phys 92 (2002) 144-153
-
(2002)
J Appl Phys
, vol.92
, pp. 144-153
-
-
Hsueh, C.H.1
-
274
-
-
0036133245
-
Stresses in thin films and interconnect lines
-
Gudmundson P., and Wikstrom A. Stresses in thin films and interconnect lines. Microelectron Engng 60 (2002) 17-29
-
(2002)
Microelectron Engng
, vol.60
, pp. 17-29
-
-
Gudmundson, P.1
Wikstrom, A.2
-
276
-
-
0000806531
-
Stresses and strains in lattice-mismatched stripes, quantum wires, quantum dots, and substrates in Si technology
-
Jain S.C., Maes H.E., Pinardi K., and De Wolf I. Stresses and strains in lattice-mismatched stripes, quantum wires, quantum dots, and substrates in Si technology. J Appl Phys 79 (1996) 8145-8165
-
(1996)
J Appl Phys
, vol.79
, pp. 8145-8165
-
-
Jain, S.C.1
Maes, H.E.2
Pinardi, K.3
De Wolf, I.4
-
277
-
-
0032124054
-
Evolution of stresses in passivated and unpassivated metal interconnects
-
Gouldstone A., Shen Y.-L., Suresh S., and Thompson C.V. Evolution of stresses in passivated and unpassivated metal interconnects. J Mater Res 13 (1998) 1956-1966
-
(1998)
J Mater Res
, vol.13
, pp. 1956-1966
-
-
Gouldstone, A.1
Shen, Y.-L.2
Suresh, S.3
Thompson, C.V.4
-
278
-
-
0024301445
-
Stress concentration along interfaces of elastic-plastic thin films
-
Lambropoulos J.C., and Wan S.M. Stress concentration along interfaces of elastic-plastic thin films. Mater Sci Engng A 107 (1989) 169-175
-
(1989)
Mater Sci Engng A
, vol.107
, pp. 169-175
-
-
Lambropoulos, J.C.1
Wan, S.M.2
-
280
-
-
0001008867
-
Stress analysis of encapsulated fine-line aluminum interconnect
-
Jones R.E., and Basehore M.L. Stress analysis of encapsulated fine-line aluminum interconnect. Appl Phys Lett 50 (1987) 725-727
-
(1987)
Appl Phys Lett
, vol.50
, pp. 725-727
-
-
Jones, R.E.1
Basehore, M.L.2
-
281
-
-
0036133312
-
Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures
-
Zhao J.-H., Qi W.-J., and Ho P.S. Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures. Microelectron Reliab 42 (2002) 27-34
-
(2002)
Microelectron Reliab
, vol.42
, pp. 27-34
-
-
Zhao, J.-H.1
Qi, W.-J.2
Ho, P.S.3
-
282
-
-
0035322588
-
Finite element modeling of microscale thermal residual stresses in Al interconnects
-
Saerens A., Van Houtte P., and Kalidindi S.R. Finite element modeling of microscale thermal residual stresses in Al interconnects. J Mater Res 16 (2001) 1112-1122
-
(2001)
J Mater Res
, vol.16
, pp. 1112-1122
-
-
Saerens, A.1
Van Houtte, P.2
Kalidindi, S.R.3
-
283
-
-
0001620550
-
Modeling of thermal stresses in metal interconnects: effects of line aspect ratio
-
Shen Y.-L. Modeling of thermal stresses in metal interconnects: effects of line aspect ratio. J Appl Phys 82 (1997) 1578-1581
-
(1997)
J Appl Phys
, vol.82
, pp. 1578-1581
-
-
Shen, Y.-L.1
-
284
-
-
0001347187
-
Crystal plasticity simulations of thermal stresses in thin-film aluminum interconnects
-
Povirk G.L., Mohan R., and Brown S.B. Crystal plasticity simulations of thermal stresses in thin-film aluminum interconnects. J Appl Phys 77 (1995) 598-606
-
(1995)
J Appl Phys
, vol.77
, pp. 598-606
-
-
Povirk, G.L.1
Mohan, R.2
Brown, S.B.3
-
285
-
-
0028715273
-
-
Chidambarrao D, Rodbell KP, Thouless MD, DeHaven PW. Line-width dependence of stress in passivated Al lines during thermal cycling. In: Materials reliability in microelectronics IV. Materials Research Society symposium proceedings, vol. 338; 1994. p. 261-8.
-
Chidambarrao D, Rodbell KP, Thouless MD, DeHaven PW. Line-width dependence of stress in passivated Al lines during thermal cycling. In: Materials reliability in microelectronics IV. Materials Research Society symposium proceedings, vol. 338; 1994. p. 261-8.
-
-
-
-
286
-
-
0031235007
-
Thermal stresses in multilevel interconnections: aluminum lines at different levels
-
Shen Y.-L. Thermal stresses in multilevel interconnections: aluminum lines at different levels. J Mater Res 12 (1997) 2219-2222
-
(1997)
J Mater Res
, vol.12
, pp. 2219-2222
-
-
Shen, Y.-L.1
-
287
-
-
0036472357
-
Analysis of thermal stresses in metal interconnects with multilevel structures
-
Kilijanski M.S., and Shen Y.-L. Analysis of thermal stresses in metal interconnects with multilevel structures. Microelectron Reliab 42 (2002) 259-264
-
(2002)
Microelectron Reliab
, vol.42
, pp. 259-264
-
-
Kilijanski, M.S.1
Shen, Y.-L.2
-
288
-
-
0242368005
-
Thermomechanical response and stress analysis of copper interconnects
-
Ege E.S., and Shen Y.-L. Thermomechanical response and stress analysis of copper interconnects. J Electron Mater 32 (2003) 1000-1011
-
(2003)
J Electron Mater
, vol.32
, pp. 1000-1011
-
-
Ege, E.S.1
Shen, Y.-L.2
-
289
-
-
0000034975
-
Electromigration path in Cu thin-film lines
-
Hu C.K., Rosenberg R., and Lee K.Y. Electromigration path in Cu thin-film lines. Appl Phys Lett 74 (1999) 2945-2947
-
(1999)
Appl Phys Lett
, vol.74
, pp. 2945-2947
-
-
Hu, C.K.1
Rosenberg, R.2
Lee, K.Y.3
-
290
-
-
0035926879
-
Electromigration in Cu interconnects with very different grain structures
-
Hau-Riege C.S., and Thompson C.V. Electromigration in Cu interconnects with very different grain structures. Appl Phys Lett 78 (2001) 3451-3453
-
(2001)
Appl Phys Lett
, vol.78
, pp. 3451-3453
-
-
Hau-Riege, C.S.1
Thompson, C.V.2
-
291
-
-
33747307274
-
Electromigration in damascence copper interconnects of line width down to 100 nm
-
Roy A., Kumar R., Tan C.M., Wong T.K.S., and Tung C.H. Electromigration in damascence copper interconnects of line width down to 100 nm. Semicond Sci Technol 21 (2006) 1369-1372
-
(2006)
Semicond Sci Technol
, vol.21
, pp. 1369-1372
-
-
Roy, A.1
Kumar, R.2
Tan, C.M.3
Wong, T.K.S.4
Tung, C.H.5
-
292
-
-
20444459119
-
Electromigration and adhesion
-
Lloyd J.R., Lane M.W., Liniger E.G., Hu C.K., Shaw T.M., and Rosenberg R. Electromigration and adhesion. IEEE Trans Dev Mater Reliab 5 (2005) 113-118
-
(2005)
IEEE Trans Dev Mater Reliab
, vol.5
, pp. 113-118
-
-
Lloyd, J.R.1
Lane, M.W.2
Liniger, E.G.3
Hu, C.K.4
Shaw, T.M.5
Rosenberg, R.6
-
293
-
-
4043122543
-
Interface reliability assessment for copper/low-k products
-
Hartfield C.D., Ogawa E.T., Park Y.J., Chiu T.C., and Guo H.L. Interface reliability assessment for copper/low-k products. IEEE Trans Dev Mater Reliab 4 (2004) 129-141
-
(2004)
IEEE Trans Dev Mater Reliab
, vol.4
, pp. 129-141
-
-
Hartfield, C.D.1
Ogawa, E.T.2
Park, Y.J.3
Chiu, T.C.4
Guo, H.L.5
-
294
-
-
0033283597
-
-
Besser PR, Joo Y-C, Winter D, Ngo MV, Ortega R. Mechanical stresses in aluminum and copper interconnect lines for 0.18 μm logic technologies. In: Materials reliability in microelectronics IX. Materials Research Society symposium proceedings, vol. 563; 1999. p. 189-99.
-
Besser PR, Joo Y-C, Winter D, Ngo MV, Ortega R. Mechanical stresses in aluminum and copper interconnect lines for 0.18 μm logic technologies. In: Materials reliability in microelectronics IX. Materials Research Society symposium proceedings, vol. 563; 1999. p. 189-99.
-
-
-
-
295
-
-
44749083414
-
-
Spolenak R, Tamura N, Valek BC, MacDowell AA, Celestre RS, Padmore HA, et al. High resolution microdiffraction studies using synchrotron radiation. In: Baker SP, Korhonen MA, Arzt E, Ho PS, editors. Stress-induced phenomena in metallization: sixth international workshop; 2002. p. 217-28.
-
Spolenak R, Tamura N, Valek BC, MacDowell AA, Celestre RS, Padmore HA, et al. High resolution microdiffraction studies using synchrotron radiation. In: Baker SP, Korhonen MA, Arzt E, Ho PS, editors. Stress-induced phenomena in metallization: sixth international workshop; 2002. p. 217-28.
-
-
-
-
296
-
-
0141569935
-
Temperature-dependent inelastic response of passivated copper films: experiments, analyses, and implications
-
Shen Y.-L., and Ramamurty U. Temperature-dependent inelastic response of passivated copper films: experiments, analyses, and implications. J Vac Sci Technol B 21 (2003) 1258-1264
-
(2003)
J Vac Sci Technol B
, vol.21
, pp. 1258-1264
-
-
Shen, Y.-L.1
Ramamurty, U.2
-
297
-
-
0034256167
-
The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects
-
Hau-Riege S.P., and Thompson C.V. The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects. J Mater Res 15 (2000) 1797-1802
-
(2000)
J Mater Res
, vol.15
, pp. 1797-1802
-
-
Hau-Riege, S.P.1
Thompson, C.V.2
-
298
-
-
0035479172
-
Finite element modeling of a microelectronic structure under uniform thermal loading
-
Okyar A.F., and Gosz M. Finite element modeling of a microelectronic structure under uniform thermal loading. Finite Elements Anal Des 37 (2001) 961-977
-
(2001)
Finite Elements Anal Des
, vol.37
, pp. 961-977
-
-
Okyar, A.F.1
Gosz, M.2
-
299
-
-
0032685399
-
-
Shen Y-L. Thermal stresses in L and T shaped metal interconnects: a three dimensional analysis. In: Proceedings of the IEEE 37th international reliab phys symposium; 1999. p. 283-90.
-
Shen Y-L. Thermal stresses in L and T shaped metal interconnects: a three dimensional analysis. In: Proceedings of the IEEE 37th international reliab phys symposium; 1999. p. 283-90.
-
-
-
-
301
-
-
22644448375
-
Designing test interconnect structures for micro-scale stress measurement: an analytical guidance
-
Shen Y.-L., and Guo Y.L. Designing test interconnect structures for micro-scale stress measurement: an analytical guidance. J Vac Sci Technol B 17 (1999) 448-454
-
(1999)
J Vac Sci Technol B
, vol.17
, pp. 448-454
-
-
Shen, Y.-L.1
Guo, Y.L.2
-
302
-
-
0003179472
-
Influence of W via on the mechanism of electromigration failure in Al-0. 5Cu interconnects
-
Le H.A., Tso N.C., Rost T.A., and Kim C.-U. Influence of W via on the mechanism of electromigration failure in Al-0. 5Cu interconnects. Appl Phys Lett 72 (1998) 2814-2816
-
(1998)
Appl Phys Lett
, vol.72
, pp. 2814-2816
-
-
Le, H.A.1
Tso, N.C.2
Rost, T.A.3
Kim, C.-U.4
-
303
-
-
0032137584
-
Finite element simulation of a stress history during the manufacturing process of thin film stacks in VLSI structures
-
Lee J., and Mack A.S. Finite element simulation of a stress history during the manufacturing process of thin film stacks in VLSI structures. IEEE Trans Semicond Manuf 11 (1998) 458-464
-
(1998)
IEEE Trans Semicond Manuf
, vol.11
, pp. 458-464
-
-
Lee, J.1
Mack, A.S.2
-
304
-
-
0033896994
-
Investigation of the thermal stress field in a multilevel aluminum metallization in VLSI systems
-
Igic P.M., and Mawby P.A. Investigation of the thermal stress field in a multilevel aluminum metallization in VLSI systems. Microelectron Reliab 40 (2000) 443-450
-
(2000)
Microelectron Reliab
, vol.40
, pp. 443-450
-
-
Igic, P.M.1
Mawby, P.A.2
-
305
-
-
0001486246
-
Finite-element modeling of stress distribution and migration in interconnecting studs of a three-dimensional multilevel device structure
-
Shi L.T., and Tu K.N. Finite-element modeling of stress distribution and migration in interconnecting studs of a three-dimensional multilevel device structure. Appl Phys Lett 65 (1994) 1516-1518
-
(1994)
Appl Phys Lett
, vol.65
, pp. 1516-1518
-
-
Shi, L.T.1
Tu, K.N.2
-
306
-
-
0001514838
-
Finite-element stress analysis of failure mechanisms in a multilevel metallization structure
-
Shi L.T., and Tu K.N. Finite-element stress analysis of failure mechanisms in a multilevel metallization structure. J Appl Phys 77 (1995) 3037-3041
-
(1995)
J Appl Phys
, vol.77
, pp. 3037-3041
-
-
Shi, L.T.1
Tu, K.N.2
-
307
-
-
18044379130
-
Thermomechanical stress analysis of Cu/low-k dielectric interconnect schemes
-
Mathewson A., De Oca C.G.M., and Foley S. Thermomechanical stress analysis of Cu/low-k dielectric interconnect schemes. Microelectron Reliab 41 (2001) 1637-1641
-
(2001)
Microelectron Reliab
, vol.41
, pp. 1637-1641
-
-
Mathewson, A.1
De Oca, C.G.M.2
Foley, S.3
-
308
-
-
0038651066
-
Mechanical analysis of interconnected structures using process simulation
-
Senez V., Hoffmann T., Le Duc P., and Murray F. Mechanical analysis of interconnected structures using process simulation. J Appl Phys 93 (2003) 6039-6049
-
(2003)
J Appl Phys
, vol.93
, pp. 6039-6049
-
-
Senez, V.1
Hoffmann, T.2
Le Duc, P.3
Murray, F.4
-
309
-
-
1842740245
-
Effect of low-k dielectric on stress and stress-induced damage in Cu interconnects
-
Paik J.-M., Park H., and Joo Y.-C. Effect of low-k dielectric on stress and stress-induced damage in Cu interconnects. Microelectron Engng 71 (2004) 348-357
-
(2004)
Microelectron Engng
, vol.71
, pp. 348-357
-
-
Paik, J.-M.1
Park, H.2
Joo, Y.-C.3
-
310
-
-
11144236528
-
Simulation and experiments of stress migration for Cu/low-l BEoL
-
Zhai C.J., Yao H.W., Marathe A.P., Besser P.R., and Blish II R.C. Simulation and experiments of stress migration for Cu/low-l BEoL. IEEE Trans Dev Mater Reliab 4 (2004) 523-529
-
(2004)
IEEE Trans Dev Mater Reliab
, vol.4
, pp. 523-529
-
-
Zhai, C.J.1
Yao, H.W.2
Marathe, A.P.3
Besser, P.R.4
Blish II, R.C.5
-
311
-
-
20344365577
-
Analysis of thermal stresses in copper interconnects/low-k dielectric structures
-
Shen Y.-L. Analysis of thermal stresses in copper interconnects/low-k dielectric structures. J Electron Mater 34 (2005) 497-505
-
(2005)
J Electron Mater
, vol.34
, pp. 497-505
-
-
Shen, Y.-L.1
-
312
-
-
33644921204
-
The effect of line width on stress-induced voiding in Cu dual damascene interconnects
-
Shao W., Gan Z.H., Mhaisalkar S.G., Chen Z., and Li H. The effect of line width on stress-induced voiding in Cu dual damascene interconnects. Thin Solid Films 504 (2006) 298-301
-
(2006)
Thin Solid Films
, vol.504
, pp. 298-301
-
-
Shao, W.1
Gan, Z.H.2
Mhaisalkar, S.G.3
Chen, Z.4
Li, H.5
-
313
-
-
33644893600
-
-
Gan Z., Shao W., Mhaisalkar S.G., Chen Z., and Li H. Thin Solid Films 504 (2006) 161-165
-
(2006)
Thin Solid Films
, vol.504
, pp. 161-165
-
-
Gan, Z.1
Shao, W.2
Mhaisalkar, S.G.3
Chen, Z.4
Li, H.5
-
314
-
-
33244479400
-
Thermo-mechanical stresses in copper interconnects - a modeling analysis
-
Shen Y.-L. Thermo-mechanical stresses in copper interconnects - a modeling analysis. Microelectron Engng 83 (2006) 446-459
-
(2006)
Microelectron Engng
, vol.83
, pp. 446-459
-
-
Shen, Y.-L.1
-
315
-
-
33751226629
-
Reliability issues in Cu/low-k structures regarding the initiation of stress-voiding or crack failure
-
Orain S., Fuchsmann A., Fiori V., and Federspiel X. Reliability issues in Cu/low-k structures regarding the initiation of stress-voiding or crack failure. Microelectron Engng 83 (2006) 2402-2406
-
(2006)
Microelectron Engng
, vol.83
, pp. 2402-2406
-
-
Orain, S.1
Fuchsmann, A.2
Fiori, V.3
Federspiel, X.4
-
316
-
-
33846598911
-
FEM-based method to determine mechanical stress evolution during process flow in microelectronics, application to stress-voiding
-
Orain S., Barbe J.-C., Federspiel X., Legallo P., and Jaouen H. FEM-based method to determine mechanical stress evolution during process flow in microelectronics, application to stress-voiding. Microelectron Reliab 47 (2007) 295-301
-
(2007)
Microelectron Reliab
, vol.47
, pp. 295-301
-
-
Orain, S.1
Barbe, J.-C.2
Federspiel, X.3
Legallo, P.4
Jaouen, H.5
-
317
-
-
44749089087
-
-
The Dow Chemical Company. . [accessed January 18, 2008].
-
The Dow Chemical Company. . [accessed January 18, 2008].
-
-
-
-
318
-
-
0036132760
-
Integration of copper with an organic low-k dielectric in 0.12 μm node interconnect
-
Fayolle M., Passemard G., Assous M., Louis D., Beverina A., Gobil Y., et al. Integration of copper with an organic low-k dielectric in 0.12 μm node interconnect. Microelectron Engng 60 (2002) 119-124
-
(2002)
Microelectron Engng
, vol.60
, pp. 119-124
-
-
Fayolle, M.1
Passemard, G.2
Assous, M.3
Louis, D.4
Beverina, A.5
Gobil, Y.6
-
319
-
-
44749086542
-
-
Shaw TM, Liu X-H, Murray C, Wisniewski MY, Fiorenza G, Lane M, et al. The mechanical behavior of low-k/copper interconnect structures. Presentation at the 2003 Materials Research Society fall meeting, Boston (MA), U9.1.
-
Shaw TM, Liu X-H, Murray C, Wisniewski MY, Fiorenza G, Lane M, et al. The mechanical behavior of low-k/copper interconnect structures. Presentation at the 2003 Materials Research Society fall meeting, Boston (MA), U9.1.
-
-
-
-
320
-
-
3042557819
-
-
Filippi RG, McGrath JF, Shaw TM, Murray CE, Rathore HS, McLaughlin PS, et al. Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric. In: Proceedings of the 42nd IEEE international reliab phys symposium; 2004. p. 61-7.
-
Filippi RG, McGrath JF, Shaw TM, Murray CE, Rathore HS, McLaughlin PS, et al. Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric. In: Proceedings of the 42nd IEEE international reliab phys symposium; 2004. p. 61-7.
-
-
-
-
321
-
-
0036630640
-
Formation of slit-like voids at trench corners of damascene Cu interconnects
-
Sekiguchi A., Koike J., and Maruyama K. Formation of slit-like voids at trench corners of damascene Cu interconnects. Mater Tran JIM 43 (2002) 1633-1637
-
(2002)
Mater Tran JIM
, vol.43
, pp. 1633-1637
-
-
Sekiguchi, A.1
Koike, J.2
Maruyama, K.3
-
322
-
-
0031207626
-
Void nucleation in passivated interconnect lines: effects of site geometries, interfaces, and interface flaws
-
Gleixner R.J., Clemens B.M., and Nix W.D. Void nucleation in passivated interconnect lines: effects of site geometries, interfaces, and interface flaws. J Mater Res 12 (1997) 2081-2090
-
(1997)
J Mater Res
, vol.12
, pp. 2081-2090
-
-
Gleixner, R.J.1
Clemens, B.M.2
Nix, W.D.3
-
323
-
-
44749087512
-
-
Flinn PA, Lee S, Doan J, Marieb TN, Bravman JC, Madden M. Void phenomena in passivated metal lines: recent observations and interpretation. In: Stress induced phenomenon in metallization, Fourth international workshop. AIP Conference Procedure, vol. 418; 1998. p. 250-61.
-
Flinn PA, Lee S, Doan J, Marieb TN, Bravman JC, Madden M. Void phenomena in passivated metal lines: recent observations and interpretation. In: Stress induced phenomenon in metallization, Fourth international workshop. AIP Conference Procedure, vol. 418; 1998. p. 250-61.
-
-
-
-
324
-
-
0024925589
-
Effects of surface treatment on electromigration in aluminum films
-
Wada T., Sugimoto M., and Ajiki T. Effects of surface treatment on electromigration in aluminum films. IEEE Trans Reliab 38 (1989) 565-570
-
(1989)
IEEE Trans Reliab
, vol.38
, pp. 565-570
-
-
Wada, T.1
Sugimoto, M.2
Ajiki, T.3
-
325
-
-
44749083343
-
-
Abe H, Tanabe S, Kondo Y, Ikubo M. The influence of adhesion between passivation and aluminum films on stress induced voiding. In: Extended abstract in Japan Society of Applied Physics 39th spring meeting; 1992. p. 658.
-
Abe H, Tanabe S, Kondo Y, Ikubo M. The influence of adhesion between passivation and aluminum films on stress induced voiding. In: Extended abstract in Japan Society of Applied Physics 39th spring meeting; 1992. p. 658.
-
-
-
-
326
-
-
0000413294
-
Stresses, deformation, and void nucleation in locally debonded metal interconnects
-
Shen Y.-L. Stresses, deformation, and void nucleation in locally debonded metal interconnects. J Appl Phys 84 (1998) 5525-5530
-
(1998)
J Appl Phys
, vol.84
, pp. 5525-5530
-
-
Shen, Y.-L.1
-
327
-
-
0032024850
-
Effects of pre-existing interfacial defects on the stress profile in aluminum interconnection lines
-
Shen Y.-L. Effects of pre-existing interfacial defects on the stress profile in aluminum interconnection lines. IEEE Trans Comp Packag Manuf Technol Part A 21 (1998) 127-131
-
(1998)
IEEE Trans Comp Packag Manuf Technol Part A
, vol.21
, pp. 127-131
-
-
Shen, Y.-L.1
-
329
-
-
0026868335
-
A study of stress-driven diffusive growth of voids in encapsulated interconnect lines
-
Nix W.D., and Sauter A.I. A study of stress-driven diffusive growth of voids in encapsulated interconnect lines. J Mater Res 7 (1992) 1133-1143
-
(1992)
J Mater Res
, vol.7
, pp. 1133-1143
-
-
Nix, W.D.1
Sauter, A.I.2
-
330
-
-
0038035318
-
Stress evolution due to electromigration in confined metal lines
-
Korhonen M.A., Borgensen P., Tu K.-N., and Li C.-Y. Stress evolution due to electromigration in confined metal lines. J Appl Phys 73 (1993) 3790-3799
-
(1993)
J Appl Phys
, vol.73
, pp. 3790-3799
-
-
Korhonen, M.A.1
Borgensen, P.2
Tu, K.-N.3
Li, C.-Y.4
-
331
-
-
0001560409
-
Simulation of the effects of grain structure and grain growth on electromigration and the reliability of interconnects
-
Knowlton B.D., Clement J.J., and Thompson C.V. Simulation of the effects of grain structure and grain growth on electromigration and the reliability of interconnects. J Appl Phys 81 (1997) 6073-6080
-
(1997)
J Appl Phys
, vol.81
, pp. 6073-6080
-
-
Knowlton, B.D.1
Clement, J.J.2
Thompson, C.V.3
-
332
-
-
0000506572
-
The effects of the stress dependence of atomic diffusivity on stress evolution due to electromigration
-
Park Y.J., and Thompson C.V. The effects of the stress dependence of atomic diffusivity on stress evolution due to electromigration. J Appl Phys 82 (1997) 4277-4281
-
(1997)
J Appl Phys
, vol.82
, pp. 4277-4281
-
-
Park, Y.J.1
Thompson, C.V.2
-
333
-
-
0004716172
-
Finite element analysis of the effects of geometry and microstructure on electromigration in confined metal lines
-
Liu Y.K., Cox C.L., and Diefendorf R.J. Finite element analysis of the effects of geometry and microstructure on electromigration in confined metal lines. J Appl Phys 83 (1998) 3600-3608
-
(1998)
J Appl Phys
, vol.83
, pp. 3600-3608
-
-
Liu, Y.K.1
Cox, C.L.2
Diefendorf, R.J.3
-
334
-
-
0000898275
-
On the prediction of electromigration voiding using stress-based modeling
-
Duan Q.F., and Shen Y.-L. On the prediction of electromigration voiding using stress-based modeling. J Appl Phys 87 (2000) 4039-4041
-
(2000)
J Appl Phys
, vol.87
, pp. 4039-4041
-
-
Duan, Q.F.1
Shen, Y.-L.2
-
335
-
-
0343777268
-
Voiding induced stress redistribution and its reliability implications in metal interconnects
-
Shen Y.-L., Guo Y.L., and Minor C.A. Voiding induced stress redistribution and its reliability implications in metal interconnects. Acta Mater 48 (2000) 1667-1678
-
(2000)
Acta Mater
, vol.48
, pp. 1667-1678
-
-
Shen, Y.-L.1
Guo, Y.L.2
Minor, C.A.3
-
336
-
-
0032626599
-
On the propensity of electromigration void growth from preexisting stress-voids in metal interconnects
-
Minor C.A., Guo Y.L., and Shen Y.-L. On the propensity of electromigration void growth from preexisting stress-voids in metal interconnects. Scripta Mater 41 (1999) 347-352
-
(1999)
Scripta Mater
, vol.41
, pp. 347-352
-
-
Minor, C.A.1
Guo, Y.L.2
Shen, Y.-L.3
-
337
-
-
0031381892
-
On the formation of voids in thin-film metal interconnects
-
Shen Y.-L. On the formation of voids in thin-film metal interconnects. Scripta Mater 37 (1997) 1805-1810
-
(1997)
Scripta Mater
, vol.37
, pp. 1805-1810
-
-
Shen, Y.-L.1
-
338
-
-
0033077276
-
Void nucleation in metal interconnects: combined effects of interface flaws and crystallographic slip
-
Shen Y.-L. Void nucleation in metal interconnects: combined effects of interface flaws and crystallographic slip. J Mater Res 14 (1999) 584-591
-
(1999)
J Mater Res
, vol.14
, pp. 584-591
-
-
Shen, Y.-L.1
-
339
-
-
0030413343
-
-
Shen Y-L, Suresh S. Steady-state creep of thick and thin-film multilayers. In: Polycrystalline thin films - structure, texture, properties, and applications II. Materials Research Society symposium proceedings, vol. 403; 1996. p. 133-8.
-
Shen Y-L, Suresh S. Steady-state creep of thick and thin-film multilayers. In: Polycrystalline thin films - structure, texture, properties, and applications II. Materials Research Society symposium proceedings, vol. 403; 1996. p. 133-8.
-
-
-
-
340
-
-
0000594331
-
Stable state of interconnect under temperature change and electric current
-
Suo Z. Stable state of interconnect under temperature change and electric current. Acta Mater 46 (1998) 3725-3732
-
(1998)
Acta Mater
, vol.46
, pp. 3725-3732
-
-
Suo, Z.1
-
341
-
-
27144502407
-
Saturated voids in interconnect lines due to thermal strains and electromigration
-
Zhang Z., Suo Z., and He J. Saturated voids in interconnect lines due to thermal strains and electromigration. J Appl Phys 98 (2005) 074501
-
(2005)
J Appl Phys
, vol.98
, pp. 074501
-
-
Zhang, Z.1
Suo, Z.2
He, J.3
-
342
-
-
33646474272
-
Hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects
-
Ang D., and Ramanujan R.V. Hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects. Mater Sci Engng A 423 (2006) 157-165
-
(2006)
Mater Sci Engng A
, vol.423
, pp. 157-165
-
-
Ang, D.1
Ramanujan, R.V.2
-
343
-
-
33644891008
-
Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI
-
Paik J.-M., Park I.-M., and Joo Y.-C. Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI. Thin Solid Films 504 (2006) 284-287
-
(2006)
Thin Solid Films
, vol.504
, pp. 284-287
-
-
Paik, J.-M.1
Park, I.-M.2
Joo, Y.-C.3
-
344
-
-
29044434140
-
Local strains measured in Al lines during thermal cycling and electromigration using convergent-beam electron diffraction
-
Nucci J., Kramer S., Arzt E., and Volkert C.A. Local strains measured in Al lines during thermal cycling and electromigration using convergent-beam electron diffraction. J Mater Res 20 (2005) 1851-1859
-
(2005)
J Mater Res
, vol.20
, pp. 1851-1859
-
-
Nucci, J.1
Kramer, S.2
Arzt, E.3
Volkert, C.A.4
-
345
-
-
34548723894
-
Strain-induced grain growth during rapid thermal cycling of aluminum interconnects
-
Keller R.R., Geiss R.H., Barbosa N., Slifka A.J., and Read D.T. Strain-induced grain growth during rapid thermal cycling of aluminum interconnects. Metall Mater Trans A 38A (2007) 2263-2272
-
(2007)
Metall Mater Trans A
, vol.38 A
, pp. 2263-2272
-
-
Keller, R.R.1
Geiss, R.H.2
Barbosa, N.3
Slifka, A.J.4
Read, D.T.5
-
346
-
-
37049023185
-
Defect behavior in aluminum interconnect lines deformed thermomechanically by cyclic joule heating
-
Geiss R.H., and Read D.T. Defect behavior in aluminum interconnect lines deformed thermomechanically by cyclic joule heating. Acta Mater 56 (2008) 274-281
-
(2008)
Acta Mater
, vol.56
, pp. 274-281
-
-
Geiss, R.H.1
Read, D.T.2
-
347
-
-
0000979505
-
Atomic force microscopy study of plastic deformation and interfacial sliding in Al thin film: Si substrate systems due to thermal cycling
-
Chen M.W., and Dutta I. Atomic force microscopy study of plastic deformation and interfacial sliding in Al thin film: Si substrate systems due to thermal cycling. Appl Phys Lett 77 (2000) 4298-4300
-
(2000)
Appl Phys Lett
, vol.77
, pp. 4298-4300
-
-
Chen, M.W.1
Dutta, I.2
-
348
-
-
0035737142
-
Plastic deformation and interfacial sliding in Al and Cu thin film: Si substrate systems due to thermal cycling
-
Dutta I., Chen M.W., Peterson K., and Shultz T. Plastic deformation and interfacial sliding in Al and Cu thin film: Si substrate systems due to thermal cycling. J Electron Mater 30 (2001) 1537-1548
-
(2001)
J Electron Mater
, vol.30
, pp. 1537-1548
-
-
Dutta, I.1
Chen, M.W.2
Peterson, K.3
Shultz, T.4
-
349
-
-
0035801936
-
Metal film crawling in interconnect structures caused by cyclic temperatures
-
Huang M., Suo Z., and Ma Q. Metal film crawling in interconnect structures caused by cyclic temperatures. Acta Mater 49 (2001) 3039-3049
-
(2001)
Acta Mater
, vol.49
, pp. 3039-3049
-
-
Huang, M.1
Suo, Z.2
Ma, Q.3
-
350
-
-
0040675419
-
Finite element predictions of the effect of diffusion-accommodated interfacial sliding on thermal stresses in Cu/polymer dielectric and Cu/oxide dielectric single level damascene interconnect structures
-
Kamsah N., Gross T.S., and Tsukrov I.I. Finite element predictions of the effect of diffusion-accommodated interfacial sliding on thermal stresses in Cu/polymer dielectric and Cu/oxide dielectric single level damascene interconnect structures. J Electron Packag 124 (2002) 12-21
-
(2002)
J Electron Packag
, vol.124
, pp. 12-21
-
-
Kamsah, N.1
Gross, T.S.2
Tsukrov, I.I.3
-
351
-
-
0030145765
-
Solders in electronics
-
Plumbridge W.J. Solders in electronics. J Mater Sci 31 (1996) 2501-2514
-
(1996)
J Mater Sci
, vol.31
, pp. 2501-2514
-
-
Plumbridge, W.J.1
-
352
-
-
0033747819
-
Lead-free solders in microelectronics
-
Abtew M., and Selvaduray G. Lead-free solders in microelectronics. Mater Sci Engng R 27 (2000) 95-141
-
(2000)
Mater Sci Engng R
, vol.27
, pp. 95-141
-
-
Abtew, M.1
Selvaduray, G.2
-
353
-
-
0035047957
-
Advances in lead-free electronics soldering
-
Suganuma K. Advances in lead-free electronics soldering. Curr Opin Solid State Mater Sci 5 (2001) 55-64
-
(2001)
Curr Opin Solid State Mater Sci
, vol.5
, pp. 55-64
-
-
Suganuma, K.1
-
354
-
-
0037076832
-
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
-
Zeng K., and Tu K.N. Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater Sci Engng R 38 (2002) 55-105
-
(2002)
Mater Sci Engng R
, vol.38
, pp. 55-105
-
-
Zeng, K.1
Tu, K.N.2
-
355
-
-
0038818002
-
Physical metallurgy in lead-free electronic solder development
-
Subramanian K.N., and Lee J.G. Physical metallurgy in lead-free electronic solder development. JOM 55 5 (2003) 26-32
-
(2003)
JOM
, vol.55
, Issue.5
, pp. 26-32
-
-
Subramanian, K.N.1
Lee, J.G.2
-
356
-
-
0037323121
-
Physics and materials challenges for lead-free solders
-
Tu K.N., Gusak A.M., and Li M. Physics and materials challenges for lead-free solders. J Appl Phys 93 (2003) 1335-1353
-
(2003)
J Appl Phys
, vol.93
, pp. 1335-1353
-
-
Tu, K.N.1
Gusak, A.M.2
Li, M.3
-
357
-
-
0032653790
-
Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder
-
Stephens J.J., and Frear D.R. Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder. Metall Mater Trans A 30A (1999) 1301-1313
-
(1999)
Metall Mater Trans A
, vol.30 A
, pp. 1301-1313
-
-
Stephens, J.J.1
Frear, D.R.2
-
358
-
-
0017532617
-
Effect of solid-state reactions upon solder lap shear strength
-
Wright C. Effect of solid-state reactions upon solder lap shear strength. IEEE Trans Parts Hyb Packag 13 (1977) 202-207
-
(1977)
IEEE Trans Parts Hyb Packag
, vol.13
, pp. 202-207
-
-
Wright, C.1
-
359
-
-
0023416087
-
The mechanisms and kinetics of solder joint degradation
-
Wolverton W.M. The mechanisms and kinetics of solder joint degradation. Braz Solder 13 (1987) 33-38
-
(1987)
Braz Solder
, vol.13
, pp. 33-38
-
-
Wolverton, W.M.1
-
360
-
-
44749091700
-
-
Tribula D, Grivas D, Frear DR, Morris Jr JW. Microstructural observations of thermomechanically deformed solder joints. Welding Res Suppl 1989;October:404s-9s.
-
Tribula D, Grivas D, Frear DR, Morris Jr JW. Microstructural observations of thermomechanically deformed solder joints. Welding Res Suppl 1989;October:404s-9s.
-
-
-
-
361
-
-
51249173665
-
Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder joints
-
Frear D., Grivas D., and Morris J.W. Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder joints. J Electron Mater 18 (1989) 671-680
-
(1989)
J Electron Mater
, vol.18
, pp. 671-680
-
-
Frear, D.1
Grivas, D.2
Morris, J.W.3
-
363
-
-
0000030526
-
Strength of tin-based soldered joints
-
Tomlinson W.J., and Fullylove A. Strength of tin-based soldered joints. J Mater Sci 27 (1992) 5777-5782
-
(1992)
J Mater Sci
, vol.27
, pp. 5777-5782
-
-
Tomlinson, W.J.1
Fullylove, A.2
-
364
-
-
51649133717
-
The effect of aging on microstructure, room-temperature deformation, and fracture of Sn-Bi/Cu solder joints
-
Raeder C.H., Felton L.E., Tanzi V.A., and Knorr D.B. The effect of aging on microstructure, room-temperature deformation, and fracture of Sn-Bi/Cu solder joints. J Electron Mater 23 (1994) 611-617
-
(1994)
J Electron Mater
, vol.23
, pp. 611-617
-
-
Raeder, C.H.1
Felton, L.E.2
Tanzi, V.A.3
Knorr, D.B.4
-
365
-
-
0029389911
-
Plastic constraint of large aspect ratio solder joints
-
Ranieri J.P., Lauten F.S., and Avery D.H. Plastic constraint of large aspect ratio solder joints. J Electron Mater 24 (1995) 1419-1423
-
(1995)
J Electron Mater
, vol.24
, pp. 1419-1423
-
-
Ranieri, J.P.1
Lauten, F.S.2
Avery, D.H.3
-
366
-
-
0030150381
-
The mechanical behavior of interconnect materials for electronic packaging
-
Frear D.R. The mechanical behavior of interconnect materials for electronic packaging. JOM 48 (1996) 49-53
-
(1996)
JOM
, vol.48
, pp. 49-53
-
-
Frear, D.R.1
-
367
-
-
0030167811
-
Effect of microstructure size on deformation kinetics and thermo-mechanical fatigue of 63Sn37Pb solder joints
-
Guo Z., and Conrad H. Effect of microstructure size on deformation kinetics and thermo-mechanical fatigue of 63Sn37Pb solder joints. J Electron Packag 118 (1996) 49-54
-
(1996)
J Electron Packag
, vol.118
, pp. 49-54
-
-
Guo, Z.1
Conrad, H.2
-
368
-
-
0031185951
-
Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints
-
Hacke P.L., Sprecher A.F., and Conrad H. Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints. J Electron Mater 26 (1997) 774-782
-
(1997)
J Electron Mater
, vol.26
, pp. 774-782
-
-
Hacke, P.L.1
Sprecher, A.F.2
Conrad, H.3
-
369
-
-
0000207456
-
Fatigue-creep crack propagation path in solder joints under thermal cycling
-
Liu D.R., and Pao Y.-H. Fatigue-creep crack propagation path in solder joints under thermal cycling. J Electron Mater 26 (1997) 1058-1064
-
(1997)
J Electron Mater
, vol.26
, pp. 1058-1064
-
-
Liu, D.R.1
Pao, Y.-H.2
-
370
-
-
0001665435
-
Phase coarsening and crack growth rate during thermo-mechanical cycling of 63Sn-37Pb solder joints
-
Hacke P.L., Fahmy Y., and Conrad H. Phase coarsening and crack growth rate during thermo-mechanical cycling of 63Sn-37Pb solder joints. J Electron Mater 27 (1998) 941-947
-
(1998)
J Electron Mater
, vol.27
, pp. 941-947
-
-
Hacke, P.L.1
Fahmy, Y.2
Conrad, H.3
-
371
-
-
0032022812
-
A finite-element and experimental analysis of stress distribution in various shear tests for solder joints
-
Reinikainen T., Poech M., Krumm M., and Kivilahti J. A finite-element and experimental analysis of stress distribution in various shear tests for solder joints. J Electron Packag 120 (1998) 106-113
-
(1998)
J Electron Packag
, vol.120
, pp. 106-113
-
-
Reinikainen, T.1
Poech, M.2
Krumm, M.3
Kivilahti, J.4
-
372
-
-
0033221660
-
Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal-mechanical fatigue
-
Vianco P.T., Burchett S.N., Neilsen M.K., Rejent J.A., and Frear D.R. Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal-mechanical fatigue. J Electron Mater 28 (1999) 1290-1298
-
(1999)
J Electron Mater
, vol.28
, pp. 1290-1298
-
-
Vianco, P.T.1
Burchett, S.N.2
Neilsen, M.K.3
Rejent, J.A.4
Frear, D.R.5
-
373
-
-
0034318047
-
Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock
-
Poon N.M., Wu C.M.L., Lai J.K.L., and Chan Y.C. Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock. IEEE Trans Adv Packag 23 (2000) 708-714
-
(2000)
IEEE Trans Adv Packag
, vol.23
, pp. 708-714
-
-
Poon, N.M.1
Wu, C.M.L.2
Lai, J.K.L.3
Chan, Y.C.4
-
375
-
-
0033904050
-
Solder joint fatigue models: review and applicability to chip scale packages
-
Lee W.W., Nguyen L.T., and Selvaduray G.S. Solder joint fatigue models: review and applicability to chip scale packages. Microelectron Reliab 40 (2000) 231-244
-
(2000)
Microelectron Reliab
, vol.40
, pp. 231-244
-
-
Lee, W.W.1
Nguyen, L.T.2
Selvaduray, G.S.3
-
376
-
-
0035973424
-
Microstructural changes in eutectic tin-lead alloy due to severe bending
-
Shen Y.-L., Abeyta M.C., and Fang H.E. Microstructural changes in eutectic tin-lead alloy due to severe bending. Mater Sci Engng A 308 (2001) 288-291
-
(2001)
Mater Sci Engng A
, vol.308
, pp. 288-291
-
-
Shen, Y.-L.1
Abeyta, M.C.2
Fang, H.E.3
-
377
-
-
0035521191
-
Mechanical deflection system (MDS) test and methodology for PBGA solder joint reliability
-
Pang J.H.L., Ang K.H., Shi X.Q., and Wang Z.P. Mechanical deflection system (MDS) test and methodology for PBGA solder joint reliability. IEEE Trans Adv Packag 24 (2001) 507-514
-
(2001)
IEEE Trans Adv Packag
, vol.24
, pp. 507-514
-
-
Pang, J.H.L.1
Ang, K.H.2
Shi, X.Q.3
Wang, Z.P.4
-
378
-
-
0035278818
-
Thermal cycling aging effects on microstructural and mechanical properties of a single PBGA solder joint specimen
-
Pang J.H.L., Tan K.H., Shi X., and Wang Z.P. Thermal cycling aging effects on microstructural and mechanical properties of a single PBGA solder joint specimen. IEEE Trans Comp Packag Technol 24 (2001) 10-15
-
(2001)
IEEE Trans Comp Packag Technol
, vol.24
, pp. 10-15
-
-
Pang, J.H.L.1
Tan, K.H.2
Shi, X.3
Wang, Z.P.4
-
379
-
-
0035328910
-
Effect of intermetallic compounds on vibration fatigue of μBGA solder joint
-
Tu P.L., Chan Y.C., and Lai K.L. Effect of intermetallic compounds on vibration fatigue of μBGA solder joint. IEEE Trans Adv Packag 24 (2001) 197-205
-
(2001)
IEEE Trans Adv Packag
, vol.24
, pp. 197-205
-
-
Tu, P.L.1
Chan, Y.C.2
Lai, K.L.3
-
380
-
-
0035501302
-
Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints
-
Stam F.A., and Davitt E. Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints. Microelectron Reliab 41 (2001) 1815-1822
-
(2001)
Microelectron Reliab
, vol.41
, pp. 1815-1822
-
-
Stam, F.A.1
Davitt, E.2
-
381
-
-
0035877138
-
Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
-
Pang J.H.L., Tan K.H., Shi X.Q., and Wang Z.P. Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging. Mater Sci Engng A 307 (2001) 42-50
-
(2001)
Mater Sci Engng A
, vol.307
, pp. 42-50
-
-
Pang, J.H.L.1
Tan, K.H.2
Shi, X.Q.3
Wang, Z.P.4
-
382
-
-
0037125212
-
Deformation induced phase rearrangement in near eutectic tin-lead alloy
-
Abell K.C.R., and Shen Y.-L. Deformation induced phase rearrangement in near eutectic tin-lead alloy. Acta Mater 50 (2002) 3191-3202
-
(2002)
Acta Mater
, vol.50
, pp. 3191-3202
-
-
Abell, K.C.R.1
Shen, Y.-L.2
-
383
-
-
0036739119
-
Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints
-
Lee J.G., Guo F., Choi S., Subramanian K.N., Bieler T.R., and Lucas J.P. Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints. J Electron Mater 31 (2002) 946-952
-
(2002)
J Electron Mater
, vol.31
, pp. 946-952
-
-
Lee, J.G.1
Guo, F.2
Choi, S.3
Subramanian, K.N.4
Bieler, T.R.5
Lucas, J.P.6
-
384
-
-
0036867034
-
Modeling thermomechanical fatigue behavior of Sn-Ag solder joints
-
Lee J.G., Telang A., Subramanian K.N., and Bieler T.R. Modeling thermomechanical fatigue behavior of Sn-Ag solder joints. J Electron Mater 31 (2002) 1152-1159
-
(2002)
J Electron Mater
, vol.31
, pp. 1152-1159
-
-
Lee, J.G.1
Telang, A.2
Subramanian, K.N.3
Bieler, T.R.4
-
385
-
-
0036603885
-
Mechanical characterization of Sn-Ag-based lead-free solders
-
Amagai M., Watanabe M., Omiya M., Kishimoto K., and Shibuya T. Mechanical characterization of Sn-Ag-based lead-free solders. Microelectron Reliab 42 (2002) 951-966
-
(2002)
Microelectron Reliab
, vol.42
, pp. 951-966
-
-
Amagai, M.1
Watanabe, M.2
Omiya, M.3
Kishimoto, K.4
Shibuya, T.5
-
386
-
-
0037408678
-
Effect of aging treatment on fatigue crack growth in eutectic Sn-Pb alloy
-
Zhao J. Effect of aging treatment on fatigue crack growth in eutectic Sn-Pb alloy. Scripta Mater (2003) 1277-1281
-
(2003)
Scripta Mater
, pp. 1277-1281
-
-
Zhao, J.1
-
387
-
-
0242576012
-
Deformation characteristics of tin-based solder joints
-
Antoniou A., and Bastawros A.F. Deformation characteristics of tin-based solder joints. J Mater Res 18 (2003) 2304-2309
-
(2003)
J Mater Res
, vol.18
, pp. 2304-2309
-
-
Antoniou, A.1
Bastawros, A.F.2
-
388
-
-
0037395610
-
Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling
-
Liu X.W., and Plumbridge W.J. Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling. J Electron Mater 32 (2003) 278-286
-
(2003)
J Electron Mater
, vol.32
, pp. 278-286
-
-
Liu, X.W.1
Plumbridge, W.J.2
-
389
-
-
0037465953
-
Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn-3.5Ag
-
Kanchanomai C., Miyashita Y., Mutoh Y., and Mannan S.L. Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn-3.5Ag. Mater Sci Engng A 345 (2003) 90-98
-
(2003)
Mater Sci Engng A
, vol.345
, pp. 90-98
-
-
Kanchanomai, C.1
Miyashita, Y.2
Mutoh, Y.3
Mannan, S.L.4
-
390
-
-
11344278908
-
An evaluation of the lap-shear test for Sn-rich solder/Cu couples: experiments and simulation
-
Chawla N., Shen Y.-L., Deng X., and Ege E.S. An evaluation of the lap-shear test for Sn-rich solder/Cu couples: experiments and simulation. J Electron Mater 33 (2004) 1589-1595
-
(2004)
J Electron Mater
, vol.33
, pp. 1589-1595
-
-
Chawla, N.1
Shen, Y.-L.2
Deng, X.3
Ege, E.S.4
-
391
-
-
4043115547
-
Creep deformation behavior of Sn-3.5Ag solder/Cu couple at small length scales
-
Kerr M., and Chawla N. Creep deformation behavior of Sn-3.5Ag solder/Cu couple at small length scales. Acta Mater 52 (2004) 4527-4535
-
(2004)
Acta Mater
, vol.52
, pp. 4527-4535
-
-
Kerr, M.1
Chawla, N.2
-
392
-
-
3342960798
-
Effects of grain boundary sliding on microstructural evolution and damage accumulation in tin-lead alloy
-
Shen Y.-L., Abell K.C.R., and Garrett S.E. Effects of grain boundary sliding on microstructural evolution and damage accumulation in tin-lead alloy. Int J Damage Mech 13 (2004) 225-240
-
(2004)
Int J Damage Mech
, vol.13
, pp. 225-240
-
-
Shen, Y.-L.1
Abell, K.C.R.2
Garrett, S.E.3
-
394
-
-
33745309521
-
Novel rare-earth-containing lead-free solders with enhanced ductility
-
Dudek M.A., Sidhu R.S., and Chawla N. Novel rare-earth-containing lead-free solders with enhanced ductility. JOM 58 6 (2006) 57-62
-
(2006)
JOM
, vol.58
, Issue.6
, pp. 57-62
-
-
Dudek, M.A.1
Sidhu, R.S.2
Chawla, N.3
-
395
-
-
33846565378
-
Micromechanical modeling of SnAgCu solder joint under cyclic loading: effect of grain orientation
-
Gong J., Liu C., Conway P.P., and Silberschmidt V.V. Micromechanical modeling of SnAgCu solder joint under cyclic loading: effect of grain orientation. Comput Mater Sci 39 (2007) 187-197
-
(2007)
Comput Mater Sci
, vol.39
, pp. 187-197
-
-
Gong, J.1
Liu, C.2
Conway, P.P.3
Silberschmidt, V.V.4
-
396
-
-
34248211764
-
Numerical analysis of plastic encapsulated electronic package reliability: viscoelastic properties of underfill resin
-
Sham M.-L., Kim J.-K., and Park J.-H. Numerical analysis of plastic encapsulated electronic package reliability: viscoelastic properties of underfill resin. Cumput Mater Sci 40 (2007) 81-89
-
(2007)
Cumput Mater Sci
, vol.40
, pp. 81-89
-
-
Sham, M.-L.1
Kim, J.-K.2
Park, J.-H.3
-
397
-
-
17644401701
-
Deformation analysis of lap-shear testing of solder joints
-
Shen Y.-L., Chawla N., Ege E.S., and Deng X. Deformation analysis of lap-shear testing of solder joints. Acta Mater 53 (2005) 2633-2642
-
(2005)
Acta Mater
, vol.53
, pp. 2633-2642
-
-
Shen, Y.-L.1
Chawla, N.2
Ege, E.S.3
Deng, X.4
-
398
-
-
0141670982
-
Microstructural influences on the mechanical properties of solder
-
Frear D., Morgan H., Burchett S., and Lau J. (Eds), Van Nostrand Reinhold, New York
-
Morris Jr. J.W., Freer Goldstein J.L., and Mei Z. Microstructural influences on the mechanical properties of solder. In: Frear D., Morgan H., Burchett S., and Lau J. (Eds). The mechanics of solder alloy interconnects (1994), Van Nostrand Reinhold, New York 7-41
-
(1994)
The mechanics of solder alloy interconnects
, pp. 7-41
-
-
Morris Jr., J.W.1
Freer Goldstein, J.L.2
Mei, Z.3
-
399
-
-
34547192333
-
On the failure path in shear tested solder joints
-
Moy W.H., and Shen Y.-L. On the failure path in shear tested solder joints. Microelectron Reliab 47 (2007) 1300-1305
-
(2007)
Microelectron Reliab
, vol.47
, pp. 1300-1305
-
-
Moy, W.H.1
Shen, Y.-L.2
-
400
-
-
0141959802
-
Cavity mediated strain localization and overall ductility in eutectic tin-lead alloy
-
Mulholland M.M., Ege E.S., Khraishi T.A., Horstemeyer M.F., and Shen Y.-L. Cavity mediated strain localization and overall ductility in eutectic tin-lead alloy. Mater Sci Engng A 360 (2003) 160-168
-
(2003)
Mater Sci Engng A
, vol.360
, pp. 160-168
-
-
Mulholland, M.M.1
Ege, E.S.2
Khraishi, T.A.3
Horstemeyer, M.F.4
Shen, Y.-L.5
-
401
-
-
34047106690
-
Failure morphology after drop impact test of ball grid array (BGA) package with lead-free Sn-3.8Ag-0.7Cu and eutectic SnPb solders
-
Jang J.-W., De Silva A.P., Drye J.E., Post S.L., Owens N.L., Lin J.-K., et al. Failure morphology after drop impact test of ball grid array (BGA) package with lead-free Sn-3.8Ag-0.7Cu and eutectic SnPb solders. IEEE Trans Electron Packag Manuf 30 (2007) 49-53
-
(2007)
IEEE Trans Electron Packag Manuf
, vol.30
, pp. 49-53
-
-
Jang, J.-W.1
De Silva, A.P.2
Drye, J.E.3
Post, S.L.4
Owens, N.L.5
Lin, J.-K.6
-
402
-
-
23244448289
-
Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading
-
Mattila T.T., and Kivilahti J.K. Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading. J Electron Mater 34 (2005) 969-976
-
(2005)
J Electron Mater
, vol.34
, pp. 969-976
-
-
Mattila, T.T.1
Kivilahti, J.K.2
-
403
-
-
33749627043
-
-
Rhee S-H, Murray CE, Besser PR. Effects of BEOL stack on thermal mechanical stresses of Cu lines. In: Materials, technology, and reliability of low-k dielectrics and copper interconnects. Materials Research Society symposium proceedings, vol. 914; 2006. p. F08-01.
-
Rhee S-H, Murray CE, Besser PR. Effects of BEOL stack on thermal mechanical stresses of Cu lines. In: Materials, technology, and reliability of low-k dielectrics and copper interconnects. Materials Research Society symposium proceedings, vol. 914; 2006. p. F08-01.
-
-
-
-
404
-
-
32844465374
-
-
Rahim MK, Suhling JC, Jaeger RC, Islam MS, Ma H, Lin C, et al. Measurement of electronic packaging material behavior and flip chip die stresses at extreme low temperatures. In: Proceedings of IPACK 2005. ASME; 2005, IPACK2005-73349.
-
Rahim MK, Suhling JC, Jaeger RC, Islam MS, Ma H, Lin C, et al. Measurement of electronic packaging material behavior and flip chip die stresses at extreme low temperatures. In: Proceedings of IPACK 2005. ASME; 2005, IPACK2005-73349.
-
-
-
-
405
-
-
0032500424
-
Size effects in materials due to microstructural and dimensional constraints: a comparative review
-
Arzt E. Size effects in materials due to microstructural and dimensional constraints: a comparative review. Acta Mater 46 (1998) 5611-5626
-
(1998)
Acta Mater
, vol.46
, pp. 5611-5626
-
-
Arzt, E.1
|