Strain-induced grain growth during rapid thermal cycling of aluminum interconnects

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 38 A, Issue 13, 2007, Pages 2263-2272

  Keller, R R ^a   Geiss, R H ^a   Barbosa, N ^a   Slifka, A J ^a   Read, D T ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GRAIN BOUNDARIES; GRAIN GROWTH; PLASTICITY; STRAIN ENERGY; THERMAL CYCLING; TOPOGRAPHY;

ELECTRON BACKSCATTER DIFFRACTION; STRAIN-INDUCED BOUNDARY MIGRATION MECHANISM;

ALUMINUM;

EID: 34548723894     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-006-9017-1     Document Type: Conference Paper

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