Fatigue-creep crack propagation path in solder joints under thermal cycling

Journal of Electronic Materials

Volumn 26, Issue 9, 1997, Pages 1058-1064

  Liu, D R ^a   Pao, Yi Hsin ^a  

^a FORD RESEARCH LABORATORY   (United States)

Author keywords

Crack propagation; Scanning electron microscopy; Solder joint; Thermal fatigue creep

Indexed keywords

EID: 0000207456     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-997-0244-z     Document Type: Article

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