Modeling of thermal stresses in passivated interconnects

Journal of Applied Physics

Volumn 92, Issue 1, 2002, Pages 144-153

  Hsueh, Chun Hway ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL MODELING; CLOSED FORM SOLUTIONS; CROSS SECTION; FINITE ELEMENT CALCULATIONS; GEOMETRICAL PARAMETERS; INTERCONNECT LINES; LIMITING VALUES; MICRO-ELECTRONIC DEVICES; MODIFIED SHEAR LAG MODEL; SI SUBSTRATES; UNIT CELLS;

ASPECT RATIO; MICROELECTRONICS; PASSIVATION; STRESS CONCENTRATION;

THERMAL STRESS;

EID: 0036639656     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1483382     Document Type: Article

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