On the propensity of electromigration void growth from preexisting stress-voids in metal interconnects

Scripta Materialia

Volumn 41, Issue 4, 1999, Pages 347-352

  Minor, C A ^a   Guo, Y L ^a   Shen, Y L ^a  

^a University of New Mexico   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COMPUTATIONAL METHODS; COMPUTER SIMULATION; CORRELATION METHODS; ELECTROMIGRATION; FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; STRESS ANALYSIS;

ATOMIC FLUX DIVERGENCE; HYDROSTATIC STRESS; METAL INTERCONNECTS;

THIN FILM CIRCUITS;

EID: 0032626599     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(99)00189-X     Document Type: Article

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