Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling

Journal of Electronic Materials

Volumn 32, Issue 4, 2003, Pages 278-286

  Liu, X W ^a   Plumbridge, W J ^a  

^a OPEN UNIVERSITY   (United Kingdom)

Author keywords

Microstructure; Model joint; Sn Pb solder; Thermomechanical cycling

Indexed keywords

CRACK PROPAGATION; INTERFACES (MATERIALS); MICROSTRUCTURE; SHEAR DEFORMATION; THERMOMECHANICAL TREATMENT;

THERMOMECHANICAL CYCLING;

SOLDERED JOINTS;

EID: 0037395610     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0222-z     Document Type: Article

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