Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging

Materials Science and Engineering: A

Volumn 307, Issue 1-2, 2001, Pages 42-50

  Pang, H L J ^a   Tan, K H ^a   Shi, X Q ^b   Wang, Z P ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Eutectic solder; Fatigue; Intermetallic; Microstructure; Solder joint; Thermal cycling

Indexed keywords

FATIGUE OF MATERIALS; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; SHEAR STRENGTH; SUBSTRATES; THERMAL CYCLING;

INTERMETALLIC GROWTH EFFECTS; REFLOW PROCESS;

SOLDERED JOINTS;

EUTECTIC ALLOY; FATIGUE; INTERMETALLIC ALLOY; MICROSTRUCTURE;

EID: 0035877138     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(00)01958-4     Document Type: Article

References (9)

1. Lau J., Pao Y.H. Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies. 1997;McGraw Hill, New York.
2. Shi X.Q., Zhou W., Pang H.L.J., Wang Z.P., Wang Y.P. J. Electron. Pack. 121:1999;179-185.
3. Darveaux R., Banerji K. IEEE Trans. Comp. Hybrids Manufact. Technol. 15:(6):1992;1013-1024.
4. Shi X.Q., Pang H.L.J., Zhou W., Wang Z.P. Scr. Mater. 41:(3):1999;289-296.
5. Morris J.W. Jr, Tribula D., Summers T.S.E., Grivas D. John Lau H. The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joint, Solder Joint Reliability: Theory and Applications. 1991;Van Nostrand Reinhold, New York. Chapter 7.
6. Marshall J.L., Foster A., Sees J.A. Frear D., Morgan H., Burchett S., Lau J. Interfaces and Intermetallics, The Mechanics of Solder Alloy Interconnects. 1994;Van Nostrand Reinhold, New York. Chapter 3.
7. Morris J.W. Jr, Freer Goldstein J.L., Mei Z. Frear D., Morgan H., Burchett S., Lau J. Microstructural Influences on the Mechanical Properties of Solder, The Mechanics of Solder Alloy Interconnects. 1994;Van Nostrand Reinhold, New York. Chapter 2.
8. Tu P.L., Chan Y.C., Lai J.K.L. IEEE Trans. Comp. Pack. Manufact. Technol. B. 20:(1):1997;87-93.
9. Hwang J.S. Modern Solder Technology for Competitive Electronics Manufacturing. 1996;McGraw-Hill, New York.