X-ray diffraction as a tool to study the mechanical behaviour of thin films

Materials Science and Engineering: A

Volumn 288, Issue 2, 2000, Pages 209-216

  Kraft, O ^a   Hommel, M ^a   Arzt, E ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

Flow stress; Strain hardening; Tensile test; Thermal cycling; Thin film; X ray diffraction

Indexed keywords

ALUMINUM; ANISOTROPY; COPPER; PLASTIC FLOW; STRAIN HARDENING; STRAIN MEASUREMENT; SUBSTRATES; TENSILE TESTING; THERMAL CYCLING; THIN FILMS; X RAY CRYSTALLOGRAPHY;

X-RAY STRAIN MEASUREMENTS;

SEMICONDUCTING FILMS;

DEFORMATION; DIFFRACTION; FILM; MECHANICAL TESTING; TENSILE STRESS; X-RAY TECHNIQUE;

EID: 0034285134     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(00)00876-5     Document Type: Conference Paper

References (32)

1. Thin films: Stresses and mechanical properties I-VIII
2. Thin films: Stresses and mechanical properties VII