Length-scale-based hardening model for ultra-small volumes

Journal of Materials Research

Volumn 19, Issue 10, 2004, Pages 2812-2821

  Jungk, J M ^a   Mook, W M ^a   Cordill, M J ^a   Chambers, M D ^a   Gerberich, W W ^a   Bahr, D F ^b   Moody, N R ^c   Hoehn, J W ^d  

^a UNIVERSITY OF MINNESOTA   (United States)

^b Washington State University   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

^d SEAGATE TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DEFORMATION; GOLD; HARDNESS; INDENTATION; MATHEMATICAL MODELS; NANOSTRUCTURED MATERIALS; SILICON; THIN FILMS;

COPPER FILMS; GOLD FILMS; HARDENING MODEL; SILICON NANOSPHERES;

HARDENING;

EID: 6344258510     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2004.0384     Document Type: Article

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