Finite element modeling of a microelectronic structure under uniform thermal loading

Finite Elements in Analysis and Design

Volumn 37, Issue 11, 2001, Pages 961-977

  Okyar, A F ^a   Gosz, M ^a  

^a Illinois Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FINITE ELEMENT METHOD; SUBSTRATES; THERMAL LOAD; THERMAL STRESS; TRACTION (FRICTION);

HIGH DENSITY INTERCONNECTS;

MICROELECTRONICS;

EID: 0035479172     PISSN: 0168874X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-874X(01)00077-4     Document Type: Article

References (12)

1. Stress development and relaxation in copper films during thermal cycling
2. Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling
3. Creep strength of fiber and particulate composite materials: The effect of interface slip and diffusion
4. Effect of diffusionally accommodated sliding on the stress and deformation in copper/polyimide high density interconnects
5. Experimental determination of the two dimensional state of stress and the orthotropic elasticity coefficients for coatings
6. On grain boundary sliding and diffusional creep
7. Rate effects in metal-ceramic interface sliding from the periodic film cracking technique
8. The effect of grain-boundary deformation of copper on the creep micro-deformation of copper
9. The non-uniform flow of polycrystals by grain-boundary sliding accommodated by power-law creep
10. Effect of a viscoelastic interface on the transverse behavior of fiber-reinforced composites
11. Thermomechanical deformation of 1 μm thick Cu-Polyimide line arrays studied by the scanning probe microscopy