The yield strength of thin copper films on Kapton

Journal of Applied Physics

Volumn 95, Issue 6, 2004, Pages 2991-2997

  Yu, Denis Y W ^a   Spaepen, Frans ^a  

^a HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILM THICKNESS; MICROTENSILE TESTING;

DIFFRACTION; ELECTRON BEAMS; EVAPORATION; GRAIN SIZE AND SHAPE; LIGHT REFLECTION; LIGHT TRANSMISSION; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; PLASTICITY; POLYIMIDES; STRAIN MEASUREMENT; TENSILE TESTING; THIN FILMS; VAPOR DEPOSITION;

METALLIC FILMS;

EID: 1842584184     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1644634     Document Type: Article

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