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Volumn 50, Issue 12, 2002, Pages 3193-3204
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Deformation induced phase rearrangement in near eutectic tin-lead alloy
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Author keywords
Grain boundaries; Microstructure; Optical microscopy; Scanning electron microscopy; Tin lead solder
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Indexed keywords
BENDING (DEFORMATION);
COMPACTION;
DIFFUSION;
EUTECTICS;
GRAIN BOUNDARIES;
INDENTATION;
MICROELECTRONICS;
MICROHARDNESS;
MICROSTRUCTURE;
OPTICAL MICROSCOPY;
SCANNING ELECTRON MICROSCOPY;
SOLDERING;
STRESS ANALYSIS;
TENSILE TESTING;
THERMOMECHANICAL TREATMENT;
INTERPHASE BOUNDARIES;
PHASE REARRANGEMENTS;
SOLDERING ALLOYS;
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EID: 0037125212
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/s1359-6454(02)00135-0 Document Type: Article |
Times cited : (23)
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References (28)
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