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Volumn 50, Issue 12, 2002, Pages 3193-3204

Deformation induced phase rearrangement in near eutectic tin-lead alloy

Author keywords

Grain boundaries; Microstructure; Optical microscopy; Scanning electron microscopy; Tin lead solder

Indexed keywords

BENDING (DEFORMATION); COMPACTION; DIFFUSION; EUTECTICS; GRAIN BOUNDARIES; INDENTATION; MICROELECTRONICS; MICROHARDNESS; MICROSTRUCTURE; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SOLDERING; STRESS ANALYSIS; TENSILE TESTING; THERMOMECHANICAL TREATMENT;

EID: 0037125212     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/s1359-6454(02)00135-0     Document Type: Article
Times cited : (23)

References (28)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.