A microbeam bending method for studying stress-strain relations for metal thin films on silicon substrates

Journal of the Mechanics and Physics of Solids

Volumn 53, Issue 3, 2005, Pages 619-638

  Florando, J N ^a,b   Nix, W D ^a,b  

^a Stanford University   (United States)

^b LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

MEMS; Plasticity; Small scale yielding; Strain hardening; Thin films

Indexed keywords

BENDING (DEFORMATION); CRYSTALLOGRAPHY; ELASTOPLASTICITY; METALLIC FILMS; SILICON; STRAIN; STRAIN HARDENING; STRESSES; SUBSTRATES; YIELD STRESS;

MICROBEAM BENDING; MICROTENSILE TESTING; SMALL-SCALE YIELDING; X RAY MEASUREMENT;

THIN FILMS;

EID: 12344282940     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmps.2004.08.007     Document Type: Article

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