X-ray strain measurements in fine-line patterned Al-Cu films

Materials Research Society Symposium - Proceedings

Volumn 338, Issue , 1994, Pages 203-208

  Marcus, M A ^a   Flood, W F ^a   Cirelli, R A ^a   Kistler, R C ^a   Ciampa, N A ^a   Mansfield, W M ^a   Barr, D L ^a   Volkert, C A ^a   Steiner, K G ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; COMPRESSION TESTING; HYSTERESIS; METALLIZING; PASSIVATION; SPUTTER DEPOSITION; STRAIN MEASUREMENT; STRESS ANALYSIS; TENSILE TESTING; THERMAL EFFECTS; X RAY ANALYSIS;

ELECTROMIGRATION; FINE LINE PATTERNED ALUMINUM COPPER FILMS; STRESS VOIDING; X RAY DIFFRACTION;

METALLIC FILMS;

EID: 0028715511     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-338-203     Document Type: Conference Paper

References (8)