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Volumn 9781461495482, Issue , 2013, Pages 1-370

Metal matrix composites

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HIGH TEMPERATURE APPLICATIONS; HIGH TEMPERATURE SUPERCONDUCTORS; SUBSTRATES; THERMAL CONDUCTIVITY;

EID: 84929868997     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4614-9548-2     Document Type: Book
Times cited : (622)

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