SCOPUS 정보 검색 플랫폼

JOM

Volumn 53, Issue 6, 2001, Pages 43-48

Copper interconnects for semiconductor devices

(5) Merchant, Sailesh M a Kang, Seung H a Sanganeria, Mahesh b Van Schravendijk, Bart b Mountsier, Tom b

a AGERE SYSTEMS (United States)

b Novellus Systems (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; COPPER; HARDNESS; PERMITTIVITY; SEMICONDUCTOR DEVICES; SILICA;

COPPER INTERCONNECTS; DIELECTRIC FILM DEPOSITION;

DIELECTRIC FILMS;

EID: 0035360088 PISSN: 10474838 EISSN: None Source Type: Journal
DOI: 10.1007/s11837-001-0103-y Document Type: Article

Times cited : (44)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.