Thickness dependent mechanical behavior of submicron aluminum films

Journal of Electronic Materials

Volumn 26, Issue 7, 1997, Pages 805-813

  Kang, Young Seok ^a   Ho, Paul S ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

Dislocations; Mechanical properties; Thin films; Yield strength

Indexed keywords

ALUMINUM; CRYSTALLOGRAPHY; DISLOCATIONS (CRYSTALS); GRAIN SIZE AND SHAPE; METALLOGRAPHIC MICROSTRUCTURE; POLYIMIDES; SUBSTRATES; SURFACE PROPERTIES; TENSILE STRENGTH; THIN FILMS; VOLUME FRACTION; YIELD STRESS;

COLUMNAR GRAINS; SUBMICRON FILMS;

METALLIC FILMS;

EID: 0031187098     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-997-0255-9     Document Type: Article

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