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Acta Materialia

Volumn 49, Issue 15, 2001, Pages 3039-3049

Metal film crawling in interconnect structures caused by cyclic temperatures

(3) Huang, M a Suo, Z a Ma, Q b

a Princeton University (United States)

b INTEL CORPORATION (United States)

Author keywords

Thermal cycling

Indexed keywords

PLASTIC DEFORMATION; SHEAR STRESS; SILICON; STRAIN HARDENING; THERMAL CYCLING; THERMAL EFFECTS; THERMAL EXPANSION; YIELD STRESS;

THERMAL EXPANSION MISMATCH;

METALLIC FILMS;

EID: 0035801936 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/S1359-6454(01)00196-3 Document Type: Article

Times cited : (54)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.