메뉴 건너뛰기




Volumn 78, Issue 18, 2001, Pages 2712-2714

Real-time x-ray microbeam characterization of electromigration effects in Al(Cu) wires

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0035971763     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1368189     Document Type: Article
Times cited : (25)

References (21)
  • 15
    • 0040708877 scopus 로고    scopus 로고
    • note
    • The maximum tensile stress near the cathode is on the order of 200 MPa, as previously reported for a passivated pure Al conductor line with similar configuration (see Ref. 16). A more accurate stress calibration will be reported in a separate paper.
  • 17
    • 0040115101 scopus 로고    scopus 로고
    • note
    • The Si intensity scales with the magnitude of interfacial shear strain that results from the stress transfer between thin films and the underlying Si substrate. Therefore, the enhanced diffraction from Si can be due to either tensile stress or compressive stress in the films.
  • 18
    • 0038930907 scopus 로고    scopus 로고
    • note
    • The specimens were annealed at 300 °C for about an hour prior to the experiment, and the control sample stayed at 302 °C during the entire measurement. Therefore, the control sample is expected to be nearly stress free at the measurement due to stress relaxation.
  • 20
    • 0038930906 scopus 로고    scopus 로고
    • note
    • 2 precipitates at the anode end were expected to dissolve during relaxation at 302 °C to maintain the equilibrium Cu concentration in the solution over the entire wire.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.