Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction

Applied Physics Letters

Volumn 72, Issue 11, 1998, Pages 1296-1298

  Wang, P C ^a   Cargill, G S ^a   Noyan, I C ^b   Hu, C K ^b  

^a Columbia University ^*  (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001127312     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.120604     Document Type: Article

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