Modeling of thermal stresses in metal interconnects: Effects of line aspect ratio

Journal of Applied Physics

Volumn 82, Issue 4, 1997, Pages 1578-1581

  Shen, Y L ^a  

^a University of New Mexico   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001620550     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.365944     Document Type: Article

References (13)

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8. No deformable substrate material is included in the present model. The purpose here is to explore the general trend on how the interconnect geometry affects the stress evolution in Al lines. Calculations, however, were also made on systems of passivated Al lines on a Si substrate (with the Si thickness at least two orders of magnitude greater than any of the dimensions in Fig. 1). Similar stress magnitudes in Al lines were found, and their variations with the line geometry were consistent with the numerical results presented here.
9. ABAQUS, Version 5.4, general purpose finite element program, Hibbit, Karlson and Sorensen, Inc., Pawtucket, RI (1995).
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