Thermal stresses in L and T shaped metal interconnects: a three dimensional analysis

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1999, Pages 283-290

  Shen, Y L ^a  

^a UNIVERSITY OF NEW MEXICO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; DEFORMATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; PASSIVATION; STRAIN; THERMAL STRESS;

ALUMINUM INTERCONNECTS; SPATIALLY RESOLVED STRESS MEASUREMENTS; TEST INTERCONNECT STRUCTURES;

ALUMINUM;

EID: 0032685399     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (29)