Analysis of thermal stresses in copper interconnect/low-k dielectric structures

Journal of Electronic Materials

Volumn 34, Issue 5, 2005, Pages 497-505

  Shen, Y L ^a  

^a University of New Mexico   (United States)

Author keywords

Copper (Cu); Interconnect; Low k dielectric; Numerical modeling; Thermal stress

Indexed keywords

COPPER; DIELECTRIC MATERIALS; ETCHING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PLASTIC DEFORMATION; STRESS ANALYSIS; THERMAL EXPANSION; THERMAL STRESS; THREE DIMENSIONAL;

COPPER (CU); INTERCONNECT; LOW-K DIELECTRIC; NUMERICAL MODELING;

OPTICAL INTERCONNECTS;

EID: 20344365577     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0057-x     Document Type: Conference Paper

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