Thermo-mechanical stresses in copper interconnects - A modeling analysis

Microelectronic Engineering

Volumn 83, Issue 3, 2006, Pages 446-459

  Shen, Y L ^a  

^a University of New Mexico   (United States)

Author keywords

Computer simulation; Copper interconnect; Low k dielectric; Thermo mechanical stress

Indexed keywords

COMPUTER SIMULATION; COPPER; DIELECTRIC MATERIALS; PLASTIC DEFORMATION; STRESS ANALYSIS; THERMOMECHANICAL TREATMENT;

COPPER INTERCONNECT; INTERFACE REGIONS; LOW-K DIELECTRIC; THERMO-MECHANICAL STRESS;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 33244479400     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.11.009     Document Type: Article

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