A methodology for determining mechanical properties of freestanding thin films and MEMS materials

Journal of the Mechanics and Physics of Solids

Volumn 51, Issue 1, 2003, Pages 47-67

  Espinosa, H D ^a   Prorok, B C ^a   Fischer, M ^a  

^a Northwestern University   (United States)

Author keywords

Mechanical properties; MEMS materials; Micro tensile test; Thin films

Indexed keywords

CAMERAS; CHARGE COUPLED DEVICES; DATA ACQUISITION; ELASTIC MODULI; INTERFEROMETERS; STRAIN; STRESSES; TENSILE STRENGTH; THIN FILMS;

DIGITAL MONOCHROMATIC IMAGES;

MICROELECTROMECHANICAL DEVICES;

EID: 0037210072     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-5096(02)00062-5     Document Type: Article

References (25)

1. Chasiotis I., Knauss W. Mechanical properties of thin polysilicon films by means of probe microscopy. Proc. SPIE - Int. Soc. Opt. Eng. 3512:1998;66-75.
2. Courtney, T.H., 1990. Mechanical Behavior of Materials. McGraw-Hill, New York, p. 60.
3. Drory, M., Hutchinson, J., 1995. An indentation test for measuring adhesion toughness of thin films under high residual compression with application to diamond films. Mater. Res. Soc. Symp. Proc. 383, 173-182.
4. Espinosa, H.D., Fischer, M., Zhu, Y., Lee, S., 2001a. 3-D Computational modeling of RF MEMS switches. In: Laudon, M., Romanowicz, B. (Eds.), Proceedings of the Fourth International Conference on Modeling and Simulation of Microsystems, pp. 402-405.
5. Espinosa, H.D., Prorok, B.C., Zhu, Y., Fischer, M., 2001b. An investigation of plasticity in MEMS materials. Proceedings of InterPACK '01, July 8-13, Kauai, HI, USA.
6. Espinosa, H.D., Prorok, B.C., Fischer, M., 2001c. A novel experimental technique for testing thin films and MEMS materials. Proceedings of the SEM Annual Conference on Experimental and Applied Mechanics, June 4-6, Portland, OR, pp. 446-449.
7. Evans A.G., He M.Y., Hutchinson J.W. Effect of interface undulations on the thermal fatigue of thin films and scales on metal substrates. Acta Mater. 45:1997;3543-3554.
8. Fischer M. MEMS materials testing. Master Thesis. 1999;Purdue University, West Lafayette, IN.
9. Harris K.E., King A.H. Localized texture formation and its detection in polycrystalline thin films of gold. Mater. Res. Soc. Symp. Proc. 317:1994;425-430.
10. Harris K.E., King A.H. Direct observation of diffusional creep via TEM in polycrystalline thin films of gold. Acta Mater. 46:1998;6195-6203.
11. Huang H., Spaepen F. Measurement of Young's modulus and Poisson's ratio of free standing Au/Cu multilayered thin films. Mater. Res. Soc. Symp. Proc. 405:1996;501-505.
12. Kiesewetter L., Zhang J., Houdeau D., Stecborn A. Determination of Young's modulus of micromechanical thin films using the resonance method. Sensors Actuators A. 35:1992;153-159.
13. Manceau J., Robert L., Bastien F., Oytana C., Biwersi S. Measurement of residual stresses in a plate using a vibrational technique-application to electrolytic nickel coatings. J. Microelectromech. Syst. 5:1996;243-249.
14. Nix W. Mechanical properties of thin films. Metall. Trans. A. 20:1989;2217-2245.
15. Oliver W., Pharr G. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J. Mater. Res. 7:1992;1564-1583.
16. Osterberg P., Senturia S. A test chip for MEMS material property measurement using electrostatically actuated test structures. J. Microelectromech. Syst. 6:1997;107-118.
17. Sharpe W. Jr. Elastoplastic stress and strain concentrations. J. Eng. Mater. Technol. 117:1995;1-7.
18. Sharpe W. Jr. A new technique for measuring poisson's ratio of MEMS materials. Mater. Res. Soc. Symp. Proc. 444:1996;185-190.
19. Sharpe W.N. Jr., Brown S., Johnson G.C., Knauss W.G. Round robin tests of modulus and strength of polysilicon. Mater. Res. Soc. Symp. Proc. 518:1998;57-65.
20. Small M., Nix W. Analysis of the accuracy of the bulge test in determining the mechanical properties of thin films. J. Mater. Res. 7:1992;326-335.
21. Small M., Daniels B., Clemens B., Nix W. The elastic biaxial modulus of Ag-Pd multilayered thin films using the bulge test. J. Mater. Res. 9:1994;126-133.
22. Thompson C. The yield stress of polycrystalline thin films. J. Mater. Res. 8:1993;237-238.
23. Vlassak J., Nix W. A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin films. J. Mater. Res. 7:1992;401-413.
24. Yuan, B., Sharpe Jr., W., 1997. Mechanical testing of polysilicon thin films with the ISDG. Exp. Tech. 21, 32-35.
25. Zeng, H., Sharpe Jr., W., 1996. A system for measuring biaxial creep strains over short gage lengths. Exp. Mech. 36, 84-90.