SCOPUS 정보 검색 플랫폼

Volumn 17, Issue 7, 2002, Pages 1863-1870

Effect of interface conditions on yield behavior of passivated copper thin films

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; FILM GROWTH; GRAIN BOUNDARIES; INTERFACES (MATERIALS); METALLIC FILMS; METALLIZING; PASSIVATION; SOLUTIONS; STRESS ANALYSIS;

INTRINSIC OXIDE COATINGS;

THIN FILMS;

EID: 0036648228 PISSN: 08842914 EISSN: None Source Type: Journal
DOI: 10.1557/JMR.2002.0275 Document Type: Article

Times cited : (16)

References (17)

4
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- Baker, S.P.¹ Keller, R.-M.² Arzt, E.³

5
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- Thin-Films: Stresses and Mechanical Properties V, edited by S.P. Baker, C.A. Ross, P.H. Townsend, C.A. Volkert, and P. Borgesen, Pittsburgh, PA
- (1995) Mater. Res. Soc. Symp. Proc. , vol.356 , pp. 453
- Keller, R.-M.¹ Bader, S.² Vinci, R.P.³ Arzt, E.⁴

9
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- Thin-Films: Stresses and Mechanical Properties VII, edited by R.C. Cammarata, E.P. Busso, M. Nastasi, and W.C. Oliver, Pittsburgh, PA
- (1998) Mater. Res. Soc. Symp. Proc. , vol.505 , pp. 149
- Müllner, P.A.¹ Arzt, E.²

13
- 0029502626
- Materials Reliability in Microelectronics V, edited by A.S. Oates, W.F. Filter, R. Rosenberg, A.L. Greer, and K. Gadepally, Pittsburgh, PA
- (1995) Mater. Res. Soc. Symp. Proc. , vol.391 , pp. 91
- Ma, Q.¹ Fujimoto, H.² Flinn, P.³ Jain, V.⁴ Adibi-Rizi, F.⁵ Moghadam, F.⁶ Dauskardt, R.H.⁷

15
- 0033880206
- (2000) Acta Mater. , vol.48 , pp. 625
- Kobrinski, M.J.¹ Thompson, C.V.²

17
- 0022680442
- (1986) Scr. Met. , vol.20 , pp. 371
- Li, J.C.M.¹ Park, C.G.² Ohr, S.M.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.