Dynamic observation of Al thin films plastically strained in a TEM

Materials Science and Engineering: A

Volumn 309-310, Issue , 2001, Pages 463-467

  Legros, M ^a,b   Dehm, G ^c   Keller Flaig, R M ^c   Arzt, E ^c   Hemker, K J ^a   Suresh, S ^d  

^a Johns Hopkins University   (United States)

^b CNRS   (France)

^c UNIVERSITY OF STUTTGART   (Germany)

^d Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

Al; Cross section; Dislocations; In situ; Interface; Thin film

Indexed keywords

ALUMINUM; GRAIN BOUNDARIES; SILICON; STRESS ANALYSIS; THERMAL EXPANSION; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

WAFER CURVATURE;

MATERIALS SCIENCE;

PLASTIC DEFORMATION;

EID: 0035879723     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(00)01702-0     Document Type: Article

References (19)