Ultrahigh Strength and High Electrical Conductivity in Copper

Science

Volumn 304, Issue 5669, 2004, Pages 422-426

  Lu, Lei ^a   Shen, Yongfeng ^a   Chen, Xianhua ^a   Qian, Lihua ^a   Lu, K ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; GRAIN BOUNDARIES; GROWTH (MATERIALS); STRENGTH OF MATERIALS; SYNTHESIS (CHEMICAL); TENSILE STRENGTH;

COARSE GRAINED COPPER; DISLOCATION MOTION; ULTRAHIGH STRENGTH;

COPPER;

COPPER;

COPPER; SUPERCONDUCTIVITY;

ARTICLE; DENSITY; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; MOTION; PRIORITY JOURNAL; TENSILE STRENGTH; TRANSMISSION ELECTRON MICROSCOPY;

EID: 4544358607     PISSN: 00368075     EISSN: None     Source Type: Journal    
DOI: 10.1126/science.1092905     Document Type: Article

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21. The authors thank the National Natural Science Foundation (grants 50021101 and 50201017), the Ministry of Science and Technology of China (grant G1999064505), and the Max-Planck Society of Germany for financial support; X. Si and H. B. Ma for sample preparation; Z. H. Jin and B. Wu for discussions and TEM experiments; and X. N. Jing for electrical resistivity measurements.