An evaluation of the lap-shear test for sn-rich solder/Cu couples: Experiments and simulation

Journal of Electronic Materials

Volumn 33, Issue 12, 2004, Pages 1589-1595

  Crawla, N ^a   Shen, Y L ^b   Deng, X ^a   Ege, E S ^b  

^a Arizona State University   (United States)

^b University of New Mexico   (United States)

Author keywords

Finite element modeling (FEM); Lap shear; Pb free solder

Indexed keywords

CREEP; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); LEAD ALLOYS; SHEAR STRESS; SOLDERING ALLOYS; STRAIN MEASUREMENT; STRESS CONCENTRATION; SUBSTRATES; THERMAL EFFECTS;

LAP-SHEAR; PB-FREE SOLDER; SHEAR LOADING; THERMAL FATIGUE;

SOLDERED JOINTS;

EID: 11344278908     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0102-1     Document Type: Conference Paper

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