Physical metallurgy of electromigration: Failure mechanisms in miniaturized conductor lines

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Volumn 87, Issue 11, 1996, Pages 934-942

  Arzt, Eduard ^a   Kraft, Oliver ^a,b   Spolenak, Ralph ^a   Joo, Young Chang ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^b Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL MICROSTRUCTURE; ELECTRIC CONDUCTORS; FAILURE (MECHANICAL); GRAIN GROWTH; GRAIN SIZE AND SHAPE; MATERIALS SCIENCE; MATHEMATICAL MODELS; METALLURGY; MICROPROCESSOR CHIPS; NUCLEATION;

MINIATURIZED CONDUCTOR LINES;

ELECTROMIGRATION;

EID: 0030289655     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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