Stress-temperature behavior of unpassivated thin copper films

Acta Materialia

Volumn 47, Issue 2, 1999, Pages 415-426

  Keller, R M ^a   Baker, S P ^a,b   Arzt, E ^a  

^a UNIVERSITY OF STUTTGART   (Germany)

^b Department of Materials Science and Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; CREEP; DIFFUSION; DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; STRESSES; SUBSTRATES; X RAYS;

UNPASSIVATED THIN FILMS;

THIN FILMS;

EID: 0032714755     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(98)00387-5     Document Type: Article

References (9)

1. Nix, W. D., Metall. Trans., 1989, 20A, 2217.
2. Flinn, P. A., Gardner, D. S. and Nix, W. D., IEEE Trans. Electron Devices, 1987, 34(3), 689.
3. Volkert, C. A., Alofs, C. F. and Liefting, J. R., J. Mater. Res., 1994, 9(5), 1147.
4. Flinn, P. A., J. Mater. Res., 1991, 6, 1498.
5. Thouless, M. D., Gupta, J. and Harper, J. M. E., J. Mater. Res., 1993, 8(8), 1845.
6. Vinci, R. P., Zielinski, E. M. and Bravman, J. C., Thin Solid Films, 1995, 262, 142.
7. Keller, R.-M., Baker, S. P. and Arzt, E., J. Mater. Res., 1998, 13(5), 1307.
8. Flinn, P. A., MRS Symp. Proc., 1988, 130, 41.
9. Venkatraman, R. and Bravman, J. C., J. Mater. Res., 1992, 7(8), 2040.