Stress-temperature behavior of unpassivated thin copper films

Acta Materialia

Volumn 47, Issue 2, 1999, Pages 415-426

  Keller, R M ^a   Baker, S P ^a,b   Arzt, E ^a  

^a UNIVERSITY OF STUTTGART   (Germany)

^b School of Operations Research and Industrial Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; CREEP; DIFFUSION; DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; STRESSES; SUBSTRATES; X RAYS;

UNPASSIVATED THIN FILMS;

THIN FILMS;

EID: 0032714755     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(98)00387-5     Document Type: Article

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