Thermomechanical behavior of different texture components in Cu thin films

Acta Materialia

Volumn 49, Issue 12, 2001, Pages 2145-2160

  Baker, S P ^a,b   Kretschmann, A ^a   Arzt, E ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^b School of Civil and Environmental Engineering   (United States)

Author keywords

Copper; Stress distribution; Texture; Thin films; X ray diffraction (XRD)

Indexed keywords

ANISOTROPY; COOLING; COPPER; DEPOSITION; PASSIVATION; POLYCRYSTALLINE MATERIALS; RELAXATION PROCESSES; SILICON NITRIDE; STRESS CONCENTRATION; TEXTURES; THERMAL CYCLING; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

GRAIN ORIENTATIONS;

METALLIC FILMS;

EID: 0035902690     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(01)00127-6     Document Type: Article

References (30)