Thermal stress characteristics of two-level Al(Cu) interconnect structure

Journal of Materials Research

Volumn 18, Issue 4, 2003, Pages 848-854

  Rhee, Seung Hyun ^a,b   Ho, Paul S ^a  

^a The University of Texas at Austin   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; SHEAR STRESS; THERMAL STRESS; X RAY DIFFRACTION;

INTERCONNECT STRUCTURES;

ALUMINUM;

EID: 0038337887     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0116     Document Type: Article

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