Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue

Journal of Electronic Materials

Volumn 28, Issue 11, 1999, Pages 1290-1298

  Vianco, P T ^a   Burchett, S N ^a   Neilsen, M K ^a   Rejent, J A ^a   Frear, D R ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; DIFFUSION IN SOLIDS; FATIGUE OF MATERIALS; MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; REACTION KINETICS; SOLDERED JOINTS; STRAIN RATE; THERMAL EFFECTS; TIN ALLOYS; VISCOPLASTICITY;

SOLDER JOINT THERMAL MECHANICAL FATIGUE;

SOLDERING ALLOYS;

EID: 0033221660     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0170-3     Document Type: Article

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