Full field measurements of curvature using coherent gradient sensing: Application to thin film characterization

Thin Solid Films

Volumn 325, Issue 1-2, 1998, Pages 42-54

  Rosakis, A J ^a   Singh, R P ^a   Tsuji, Y ^b   Kolawa, E ^b,c   Moore Jr , N R ^c  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b California Institute of Technology   (United States)

^c CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Stress; Surface defects; Surface morphology; X ray diffraction

Indexed keywords

CRYSTAL DEFECTS; MORPHOLOGY; SILICON WAFERS; SURFACE MEASUREMENT; X RAY DIFFRACTION ANALYSIS;

COHERENT GRADIENT SENSING (CGS);

THIN FILMS;

EID: 0032117941     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)00432-5     Document Type: Article

References (41)

1. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, 1994.
2. T. Seidel, B. Zhao, Mater. Res. Soc. Proc. 427 (1996) 3.
3. W.D. Nix, Metall. Trans. 20A (1989) 2217.
4. C.-Y. Li, P. Totta, P. Ho (eds.), Stress Induced Phenomena in Metallization: First International Workshop, AIP Conference Proceedings, 1992, p. 263.
5. P.S. Ho, C.-Y. Li, P. Totta, (eds.), Stress Induced Phenomena in Metallization, AIP Conference Proceedings, 1993, p. 305.
6. F.M. d'Heurle, Int. Mater. Rev. 34 (1989) 53.
7. J. Klema, R. Pyle, E. Domangue, Proc. 22nd Annual EEE Int. Reliability Physics Symp., 1984, p. 1.
8. K. Tokunaga, K. Sugawara, J. Electrochem. Soc. 138 (1) (1991) 176.
9. J.W. McPherson, C.F. Dunn, J. Vac. Sci. Technol. B5 (5) (1987) 1321.
10. F.G. Yost, Scripta Metall. 23 (1989) 1323.
11. A.I. Sauter, W.D. Nix, Mater. Res. Soc. Proc. 188 (1990) 153.
12. C.A. Paszkiet, M.A. Korhonen, C.-Y. Li, Mater. Res. Soc. Proc. 203 (1990) 381.
13. J.G. Ryan, J.B. Riendeau, S.E. Shore, G.J. Slusser, D.C. Beyar, D.P. Bouldin, T.D. Sullivan, J. Vac. Sci. Technol. B9 (1990) 1474.
14. S. Mayumi, T. Umemoto, M. Shishino, H. Nanatsue, S. Ueda, M. Inoue, Proc. 25th Annual EEE Int. Reliability Physics Symp., 1987, p. 15.
15. A. Tanikawa, H. Okabayashi, Proc. 28th Annual EEE Int. Reliability Physics Symp., 1990, p. 194.
16. A. Tezaki, T. Mineta, H. Egawa, Proc. 28th Annual IEEE Int. Reliability Physics Symp., 1990, p. 221.
17. M.A. Moske, P.S. Ho, C.K. Hu, M.B. Small, Proc. 1st Int. Workshop on Stress Induced Phenomena in Metallization, Ithaca, NY, 1992, p. 195.
18. P. Borgesen, M.A. Korhonen, D.D. Brown, C.-Y. Li, Proc. 1st Int. Workshop on Stress Induced Phenomena in Metallization, Ithaca, NY, 1992, p. 219.
19. J.E. Sanchez, Jr., O. Kraft, E. Arzt, Proc. 1st Int. Workshop on Stress Induced Phenomena in Metallization, Ithaca, NY, 1992, p. 251.
20. M.A. Korhonen, P. Borgese, C.-Y. Li, Proc. 1st Int. Workshop on Stress Induced Phenomena in Metallization, Ithaca, NY, 1992, p. 29.
21. T.D. Sulliva, L. Miller, G. Endicott, Proc. 1st Int. Workshop on Stress Induced Phenomena in Metallization, Ithaca, NY, 1992, p. 136.
22. I.A. Blech, IEEE Int. Reliability Physics Symp. Tutorials, 1986.
23. P.B. Guste, Solid State Technol. 20 (1983) 113.
24. P.S. Ho, T. Kwok, Rep. Prog. Phys. 52 (1989) 301.
25. H.H. Hoang, J.M. McDavid, Solid State Technol. 11 (1988) 5.
26. G. Vaidya, D.B. Fraser, W.S. Lindenberger, J. Appl. Phys. 51 (1980) 4475.
27. J.R. Lloyd, P.M. Smith, G.S. Prokop, Thin Solid Films 93 (1982) 385.
28. D.S. Gardner, J.D. Meindl, K.C. Saraswat, EEE Trans. Electron. Devices 34 (3) (1987) 633.
29. K.A. Danso, L. Tullos, Microelectron. Reliab. 21 (1981) 513.
30. B.D. Cullity, Elements of X-ray Diffraction, Addison-Wesley, Reading, MA, 1978.
31. T. Vreeland, A. Dommann, C.-J. Tsai, M.-A. Nicolet, Mater. Res. Soc. Proc. 30 (1988) 3.
32. P.A. Flinn, D.S. Gardner, W.D. Nix, EEE Trans. Electron. Devices 34 (1987) 689.
33. G.G. Stoney, Proc. R. Soc. Lond. A 82 (1909) 172.
34. M. Finot, S. Suresh, J. Mech. Phys. Solids 44 (5) (1996) 683.
35. L.B. Freund, J. Cryst. Growth 132 (1993) 341.
36. L.B. Freund, J. Mech. Phys. Solids 44 (5) (1996) 723.
37. M. Born, E. Wolf, Principles of Optics, Pergamon Press, New York, 1986.
38. S. Park, M.S. Dadkhah, E. Motamedi, Abstract Proc. VIIth Int. Congr. on Experimental Mechanics and Experimental/Numerical Mechanics in Electronic Packaging, 1996, p. 7.
39. B. Han, Y. Guo, Experimental/Numerical Mechanics in Electronic Packaging, 1(1), 1996, pp. 1-14.
40. Y.J. Lee, J. Lambros, A.J. Rosakis, Optics Lasers Eng. 25 (1) (1996) 25.
41. T.M. Weller, L.P. Katehi, M.I. Herman, P.D. Wamhof, EEE Trans. Microwave Theory Tech. 2 (1994) 911.