Residual stress and thermal stress observation in thin copper films

Thin Solid Films

Volumn 459, Issue 1-2, 2004, Pages 245-248

  Hanabusa, Takao ^a   Kusaka, Kazuya ^a   Sakata, Osami ^b  

^a UNIVERSITY OF TOKUSHIMA   (Japan)

^b JAPAN SYNCHROTRON RADIATION RESEARCH INSTITUTE   (Japan)

Author keywords

Cu film; In situ measurement; Residual stress; Synchrotron radiation; Thermal stress; Thin film; X Ray stress measurement

Indexed keywords

COOLING; COPPER; CRYSTAL ORIENTATION; DIFFRACTION; ELECTRIC RESISTANCE; HEATING; HYSTERESIS; MAGNETRON SPUTTERING; PASSIVATION; RESIDUAL STRESSES; SYNCHROTRON RADIATION; THERMAL CYCLING; THERMAL STRESS;

CU FILMS; IN-SITU MEASUREMENTS; INTERNAL STRESS; X-RAY STRESS MEASUREMENTS;

THIN FILMS;

EID: 2942585285     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2003.12.102     Document Type: Conference Paper

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