Electromigration path in Cu thin-film lines

Applied Physics Letters

Volumn 74, Issue 20, 1999, Pages 2945-2947

  Hu, C K ^a   Rosenberg, R ^a   Lee, K Y ^a,b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b Etec Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000034975     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.123974     Document Type: Article

References (21)

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