Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin

Computational Materials Science

Volumn 40, Issue 1, 2007, Pages 81-89

  Sham, Man Lung ^a   Kim, Jang Kyo ^a   Park, Joo Hyuk ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b Sejong University   (South Korea)

Author keywords

Finite element analysis; Flexible substrate; Flip chip on board; Reliability; Underfill resin; Viscoelastic properties

Indexed keywords

ENCAPSULATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; RELIABILITY; SOLDERED JOINTS; STRAIN; THERMAL STRESS; VISCOELASTICITY;

FLEXIBLE SUBSTRATE; FLIP CHIP ON BOARD; MECHANICAL PERFORMANCE; UNDERFILL RESIN; VISCOELASTIC PROPERTIES;

ELECTRONICS PACKAGING;

EID: 34248211764     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2006.11.004     Document Type: Article

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