Effects of BEOL stack on thermal mechanical stress of Cu lines

Materials Research Society Symposium Proceedings

Volumn 914, Issue , 2006, Pages 317-323

  Rhee, Seung Hyun ^a   Murray, Conal E ^b   Besser, Paul R ^a,b  

^a ADVANCED MICRO DEVICES   (United States)

^b IBM RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; INTEGRATED CIRCUITS; MECHANICAL PROPERTIES; STRESS ANALYSIS; X RAY DIFFRACTION;

BEOL INTERCONNECTS; DIELECTRIC STACK; SUBSTRATE CONFINEMENT; THERMALMECHANICAL PROPERTIES;

OPTICAL INTERCONNECTS;

EID: 33749627043     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0914-f08-01     Document Type: Conference Paper

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