SCOPUS 정보 검색 플랫폼

Volumn 24, Issue 2, 2001, Pages 197-205

Effect of intermetallic compounds on vibration fatigue of μBGA solder joint

a IEEE (Hong Kong)

Author keywords

BGA; Intermetallic; Reliability; Solder joint; Vibration fatigue

Indexed keywords

VIBRATION FATIGUES;

FAILURE ANALYSIS; RELIABILITY THEORY; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; VIBRATION CONTROL;

INTERMETALLICS;

EID: 0035328910 PISSN: 15213323 EISSN: None Source Type: Journal
DOI: 10.1109/6040.928755 Document Type: Article

Times cited : (56)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.