Phase coarsening and crack growth rate during thermo-mechanical cycling of 63Sn37Pb solder joints

Journal of Electronic Materials

Volumn 27, Issue 8, 1998, Pages 941-947

  Hacke, P L ^a   Fahmy, Y ^a   Conrad, H ^a  

^a North Carolina State University   (United States)

Author keywords

Annealing; Coarsening; Fatigue crack growth rate; Interphase diffusion; Phase size; Thermo mechanical fatigue

Indexed keywords

EID: 0001665435     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0125-0     Document Type: Article

References (14)

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