Simulation and experiments of stress migration for Cu/low-k BEoL

IEEE Transactions on Device and Materials Reliability

Volumn 4, Issue 3, 2004, Pages 523-528

  Zhai, Charlie Jun ^a   Yao, H Walter ^a   Marathe, Amit P ^a   Besser, Paul R ^a   Blish II, Richard C ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACKS; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; OPTICAL INTERCONNECTS; THERMAL STRESS; X RAY DIFFRACTION ANALYSIS;

BACK-END-OF-LINE (BEOL); INTERLAYER DIELECTRICS (ILD); STRESS MIGRATION; STRESS MODELING;

STRESS CONCENTRATION;

EID: 11144236528     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2004.833225     Document Type: Article

References (11)

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