Finite element predictions of the effect of diffusion-accommodated interfacial sliding on thermal stresses in Cu/polymer dielectric and Cu/oxide dielectric single level damascene interconnect structures

Journal of Electronic Packaging

Volumn 124, Issue 1, 2002, Pages 12-21

  Kamsah, Nazri ^a   Gross, Todd S ^a   Tsukrov, Igor I ^a  

^a University of New Hampshire   (United States)

Author keywords

Copper; Damascene Interconnect Structure; Finite Element Analysis; Interfacial Sliding; Thermal Stresses

Indexed keywords

EID: 0040675419     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1402629     Document Type: Article

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