-
1
-
-
0032484975
-
Softening of nanocrystalline metals at very small grain sizes
-
Schiotz J., Tolla F.D.D., and Jacobsen K.W. Softening of nanocrystalline metals at very small grain sizes. Nature 391 5 (1998) 561-563
-
(1998)
Nature
, vol.391
, Issue.5
, pp. 561-563
-
-
Schiotz, J.1
Tolla, F.D.D.2
Jacobsen, K.W.3
-
3
-
-
0026875935
-
An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments
-
Oliver W.C., and Pharr G.M. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J. Mat. Res. 7 6 (1992) 1564-1583
-
(1992)
J. Mat. Res.
, vol.7
, Issue.6
, pp. 1564-1583
-
-
Oliver, W.C.1
Pharr, G.M.2
-
4
-
-
0036544276
-
Application of MEMS force sensors for in situ mechanical characterization of nano-scale thin films in SEM and TEM
-
Haque M.A., and Saif M.T.A. Application of MEMS force sensors for in situ mechanical characterization of nano-scale thin films in SEM and TEM. Sens. Actuators A 97-98 (2002) 239-245
-
(2002)
Sens. Actuators A
, vol.97-98
, pp. 239-245
-
-
Haque, M.A.1
Saif, M.T.A.2
-
5
-
-
0024069463
-
Mechnical deflection of cantilevered microbeams
-
Weihs T.P., Hong S., Bravman J.C., and Nix W.D. Mechnical deflection of cantilevered microbeams. J. Mat. Res. 3 5 (1988) 931-942
-
(1988)
J. Mat. Res.
, vol.3
, Issue.5
, pp. 931-942
-
-
Weihs, T.P.1
Hong, S.2
Bravman, J.C.3
Nix, W.D.4
-
6
-
-
0026875270
-
Analysis of the accuracy of the bulge test in determining the mechanical properties of thin films
-
Small M.K., and Nix W.D. Analysis of the accuracy of the bulge test in determining the mechanical properties of thin films. J. Mat. Res. 7 (1990) 1553-1563
-
(1990)
J. Mat. Res.
, vol.7
, pp. 1553-1563
-
-
Small, M.K.1
Nix, W.D.2
-
7
-
-
0026960770
-
A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin films
-
Vlassak J.J., and Nix W.D. A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin films. J. Mat. Res. 7 (1992) 3242-3249
-
(1992)
J. Mat. Res.
, vol.7
, pp. 3242-3249
-
-
Vlassak, J.J.1
Nix, W.D.2
-
8
-
-
4143060521
-
Spherical indentation of freestanding circular thin films in the membrane regime
-
Begley M.R., and Mackin T.J. Spherical indentation of freestanding circular thin films in the membrane regime. J. Mech. Phys. Solids 52 9 (2004) 2005-2023
-
(2004)
J. Mech. Phys. Solids
, vol.52
, Issue.9
, pp. 2005-2023
-
-
Begley, M.R.1
Mackin, T.J.2
-
9
-
-
32844460209
-
Mechanical testing of freestanding nano-films using a novel finite diameter tip MEMS-based testing machine
-
2005 ASME International Mechanical Engineering Congress and Exposition, no. 80987
-
Leseman Z.C., Sheikh Z., Mackin T.J., and Begley M. Mechanical testing of freestanding nano-films using a novel finite diameter tip MEMS-based testing machine. 2005 ASME International Mechanical Engineering Congress and Exposition, no. 80987. ASME (2005)
-
(2005)
ASME
-
-
Leseman, Z.C.1
Sheikh, Z.2
Mackin, T.J.3
Begley, M.4
-
10
-
-
33847292774
-
-
F. Lärmer, A. Schilp, Method for anisotropically etching silicon, Patents DE4241045, US 5501893, and EP 625285, 1992.
-
-
-
-
11
-
-
0028425011
-
Stiction of surface microstructures after rinsing and drying: Model and investigation of adhesion mechanisms
-
Legtenberg R., Tilmans A.C., Elders J., and Elwenspoek M. Stiction of surface microstructures after rinsing and drying: Model and investigation of adhesion mechanisms. Sens. Actuators Phys. A 43 (1993) 230-238
-
(1993)
Sens. Actuators Phys. A
, vol.43
, pp. 230-238
-
-
Legtenberg, R.1
Tilmans, A.C.2
Elders, J.3
Elwenspoek, M.4
-
12
-
-
0031674883
-
2 sacrificial layer for large-area surface-micromachined membranes
-
2 sacrificial layer for large-area surface-micromachined membranes. Sens. Actuators A 64 (1998) 247-251
-
(1998)
Sens. Actuators A
, vol.64
, pp. 247-251
-
-
Anguita, J.1
Briones, F.2
-
13
-
-
3042823621
-
A clean wafer-scale chip-release process without dicing based on vapor phase etching
-
Maastricht MEMS 2004 Technical Digest
-
Overstolz T., Clerc P.A., Noell W., Zickar M., and de Rooij N.F. A clean wafer-scale chip-release process without dicing based on vapor phase etching. Proceedings of the IEEE International Conference on MEMS, 17th IEEE International Conference on MEMS. Maastricht MEMS 2004 Technical Digest (2004) 717-720
-
(2004)
Proceedings of the IEEE International Conference on MEMS, 17th IEEE International Conference on MEMS
, pp. 717-720
-
-
Overstolz, T.1
Clerc, P.A.2
Noell, W.3
Zickar, M.4
de Rooij, N.F.5
-
14
-
-
33847304906
-
-
Z.C. Leseman, T.J. Mackin, A method for the calibration of MEMS load cells, to be submitted.
-
-
-
-
15
-
-
0026898739
-
Anistropic etching of silicon in TMAH solutions
-
Tabata O., Asahi R., Funabashi H., Shimaoka K., and Sugiyama S. Anistropic etching of silicon in TMAH solutions. Sens. Actuators A 34 (1992) 51-57
-
(1992)
Sens. Actuators A
, vol.34
, pp. 51-57
-
-
Tabata, O.1
Asahi, R.2
Funabashi, H.3
Shimaoka, K.4
Sugiyama, S.5
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