Plastic deformation and interfacial sliding in Al and Cu thin film: Si substrate systems due to thermal cycling

Journal of Electronic Materials

Volumn 30, Issue 12, 2001, Pages 1537-1548

  Dutta, I ^a   Chen, M W ^a,b   Peterson, K ^a   Shultz, T ^a  

^a Naval Postgraduate School ^*  (United States)

^b Johns Hopkins University   (United States)

Author keywords

Al; Cu; Interfacial sliding; Plastic deformation; Si; Thin films

Indexed keywords

ALUMINUM; ATOMIC FORCE MICROSCOPY; COPPER; INTERFACES (MATERIALS); METALLIC FILMS; PLASTIC DEFORMATION; SEMICONDUCTING SILICON; STATISTICAL METHODS; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION;

INTERFACIAL SLIDING;

THIN FILMS;

EID: 0035737142     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0171-3     Document Type: Article

References (13)