Mechanical behavior of thin films

Annual Review of Materials Science

Volumn 26, Issue 1, 1996, Pages 431-462

  Vinci, Richard P ^a   Vlassak, Joost J ^a  

^a Stanford University   (United States)

Author keywords

Mechanical properties; Mechanical testing; Strain; Stress

Indexed keywords

ELECTRON DIFFRACTION; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; MECHANICAL TESTING; MICROSTRUCTURE; MORPHOLOGY; PLASTIC FLOW; RAMAN SPECTROSCOPY; STRAIN; STRESSES; SUBSTRATES; X RAY DIFFRACTION;

BULGE TESTING; ELECTRON DIFFRACTION CONTRAST IMAGING; FREE STANDING FILMS; NANOINDENTATION; STRAIN ENERGY EFFECTS;

THIN FILMS;

EID: 0029721299     PISSN: 00846600     EISSN: None     Source Type: Journal    
DOI: 10.1146/annurev.ms.26.080196.002243     Document Type: Article

References (152)

1. Huffman RW. 1966. In Physics of Thin Films, ed. G Mass, RE Thun. pp. 211-73. New York: Academic
2. Campbell DS. 1970. In Handbook of Thin Films, ed. LI Maissel, R Glang, pp. 22-25. New York: McGraw Hill
3. Nix WD. 1989. Metall. Trans. A 20A:2217-45
4. Alexopoulos PS, O'Sullivan TC. 1990. In Annual Review of Materials Science, ed. RA Huggins, JA Giordmaine, JB Wachtman Jr. pp. 391-420. Palo Alto: Annual Reviews
5. Pharr GM, Oliver WC. 1992. MRS Bull. 17(7):28-33
6. Schweitz J-A. 1992. MRS Bull. 17(7):34-45
7. Clemens BM, Bain JA. 1992. MRS Bull. 17(7):46-51
8. Hardwick DA. 1987. Thin Solid Films 154:109-24
9. Rosenmayer CT, Brotzen FR, Gale RJ. 1989. In Thin Films: Stresses and Mechanical Properties, 130:77-86. Boston: Mater. Res. Soc.
10. Flinn PA. 1989. In Thin Films: Stresses and Mechanical Properties, 130:41-51. Boston: Mater. Res. Soc.
11. Newey D, Wilkins MA, Pollock HM. 1982. J. Phys. E 15:119-22
12. Pethica JB, Hutchings R, Oliver WC. 1983. Philos. Mag. A 48(4):593-606
13. Loubet JL, Georges JM, Marchesini JM, Meille G. 1984. J. Tribol. 106: 43-48
14. Sneddon IN. 1965. Int. J. Eng. Sci. 3:47-57
15. Pharr GM, Oliver WC, Brotzen FR. 1992. J. Mater. Res. 7:613-17
16. King RB. 1987. Int. J. Solids Struct. 23(12): 1657-64
17. Vlassak JJ, Nix WD. 1994. J. Mech. Phys. Solids 42(8): 1223-45
18. Doerner MF, Nix WD. 1986. J. Mater. Res. 1:601-9
19. Oliver WC, Pharr GM. 1992. J. Mater. Res. 7(6): 1564-83
20. Vlassak JJ, Nix WD. 1993. Philos. Mag. A 67(5): 1045-56
21. Vlassak JJ. 1994. New techniques and analysis methods for the study of the mechanical properties of materials in small volumes. PhD thesis. Stanford Univ. 156 pp.
22. Yu HY, Sanday SC, Rath BB. 1990. J. Mech. Phys. Solids 38(6):745-64
23. Gao H, Chiu C-H, Lee J. 1992. Int. J. Solids Struct. 29(20):2471-92
24. Bhattacharya AK, Nix WD. 1988. Int. J. Solids Struct. 24(12): 1287-98
25. Johnson KL. 1985. Contact Mechanics, Cambridge: Cambridge Univ. Press
26. Krai ER, Komvopoulos K, Bogy DB. 1993. J. Appl. Mech. 60:829-41
27. Bolshakov A, Oliver WC, Pharr GM. 1994. In Thin Films: Stresses and Mechanical Properties V, 356: 675-80. Boston: Mater. Res. Soc.
28. Syed Asif SA, Derby B, Roberts SG. 1994. In Thim Films: Stresses and Mechanical Properties V, 356: 681-86. Boston: Mater. Res. Soc.
29. Tabor D. 1951. Hardness of Solids, Oxford: Oxford Univ. Press
30. Bell TJ, Field JS, Swain MV. 1991. In Thin Films: Stresses and Mechanical Properties III, 239:331-36. Boston: Mater. Res. Soc.
31. Field JS, Swain MV. 1993. J. Mater. Res. 8(2):297-306
32. Field JS, Swain MV. 1995. J. Mater. Res. 10(1):101-12
33. Beams JW. 1959. In Structure and Properties of Thin Films, ed. CA Neugebauer, JB Newkirk, DA Vermilyea. pp. 183-92. New York: Wiley & Sons
34. Vlassak JJ, Nix WD. 1992. J. Mater. Res. 7(12):3242-49
35. Itozaki H. 1982. Mechanical properties of composition modulated copper-palladium. PhD thesis. Northwestern Univ. 126 pp.
36. Small MK, Nix WD. 1992. J. Mater. Res. 7(6): 1553-63
37. Allen MG, Mehreeani M, Howe RT, Senturia SD. 1987. Appl. Phys. Lett. 51(4):241-43
38. Tabata O, Kawahata K, Sugiyama S, Igarashi I. 1989. Sensors Actuators 20:135-41
39. Maseeh F, Senturia SD. 1990. Sensors Actuators 861:A21-23
40. Cardinale GF, Tustison RW. 1992. Thin Solid Films 207:126
41. Maier-Schneider D, Maibach J, Obermeier E. 1992. J. Micromech. Microeng. 2:173-75
42. Maier-Schneider D, Maibach J, Obermeier E. 1995. J. Micromech. Microeng. 5:121-24
43. Small MK, Daniels BJ, Clemens BM, Nix WD. 1994. J. Mater. Res. 9(1): 25-30
44. Paviot VM, Vlassak JJ, Nix WD. 1995. In Thin Films: Stresses and Mechanical Properties V, 356: 579-84. Boston: Mater. Res. Soc.
45. Pan JY, Lin P, Maseeh F, Senturia SD. 1990. In IEEE Solid-State Sensor and Actuator Workshop, p. 70. Hilton Head, NC: IEEE
46. Hencky H. 1915. Z. Math. Phys. 63: 311-17
47. Tsakalakos T. 1981. Thin Solid Films 75:293-305
48. Pan JT, Blech I. 1984. J. Appl. Phys. 55(8):2874-80
49. Flinn PA, Gardner DS, Nix WD. 1987. IEEE Trans. Electron Devices ED-34(3):689-99
50. Stoney GG. 1909. Proc. R. Soc. London Ser. A 82:172
51. von Preissig FJ. 1989. J. Appl. Phys. 66(9):4262-68
52. Townsend PH, Barnett DM, Brunner TA. 1987. J. Appl. Phys. 62(11): 4438-44
53. Romero JD, Khan M, Fatemi H, Turlo J. 1991. J. Mater. Res. 6(9): 1996-2003
54. Gillard VT, Nix WD. 1993. Z. Metallkd. 84(12):874-80
55. Zielinski EM, Vinci RP, Bravman JC. 1995. In Materials Reliability in Microelectronics V, 391:103-8. San Francisco: Mater. Res. Soc.
56. Burses U, Helneder H, Korner H, Schroeder H, Schilling W. 1994. In Materials Reliability in Microelectronics IV, 338:247-52. San Francisco: Mater. Res. Soc.
57. Yeo I-S, Ho PS, Anderson SGH. 1995. J. Appl Phys. 78(2):945-52
58. Surges U, Helneder H, Schneegans M, Beckers D, Hallerbach M, et al. 1995. In Thin Films: Stresses and Mechanical Properties V, 356: 423-28. Boston: Mater. Res. Soc.
59. Yeo I-S, Anderson SGH, Ho PS, Hu CK. 1995. J. Appl. Phys. 78(2): 953-61
60. James MR, Cohen JB. 1980. In Treatise on Materials Science and Technology, ed. H Herben, pp. 1-62. New York: Academic
61. Noyan IC, Cohen JB. 1987. Residual Stress: Measurement by Diffraction and Interpretation, ed. B Ilschner, NJ Grant. New York: Springer-Verlag
62. Segmüller A, Murakami M. 1988. In Treatise on Materials Science and Technology, ed. KN Tu, R Rosenberg, pp. 143-200. San Diego: Academic
63. Nye JF. 1957. Physical Properties of Crystals, Oxford: Oxford Univ. Press
64. Murakami M. 1978. Acta Metall. 26: 175-83
65. Brennan S. 1985. Surf. Sci. 152/153: 1-9
66. Noyan IC, Nguyen LT. 1989. In Advances in X-Ray Analysis, pp. 355-64
67. Shute CJ, Cohen JB. 1991. J. Mater. Res. 6(5):950-56
68. Bain JA, Chyung LJ, Brennan S, Clemens BM. 1991. Phys. Rev. B 44(3): 1184-92
69. Vinci RP, Zielinski EM, Bravman JC. 1995. Thin Solid Films 262(1-2): 142-53
70. Noyan IC, Huang TC, York BR. 1995. Crit. Rev. Solid State Mater. Sci. 20(2): 125-77
71. Flinn PA, Waychunas GA. 1988. J. Vac. Sci Technol. B 6(6): 1749-55
72. Tezaki A, Mineta T, Egawa H, Noguchi T. 1990. In Proc. 28th Annu. Int. Reliability Symp., ed. pp. 221-29. New York: IEEE
73. Flinn PA. 1990. In Thin Films: Stresses and Mechanical Properties II, 188:3-13. San Francisco: Mater. Res. Soc.
74. Hosoda T, Niwa H, Yagi H, Tsuchikawa H. 1991. In 1991 Int. Reliability Phys. Symp. Proc., ed. pp. 77-83. New York: IEEE
75. Besser PR, Brennan S, Bravman JC. 1994. J. Mater. Res. 9(1):13
76. Dehaven P, Goldsmith C, Kamath S. 1993. In Materials Reliability in Microelectronics III, 309:275-80. San Francisco: Mater. Res. Soc.
77. Yamamoto N, Hosokawa Y. 1988. Jpn. J. Appl. Phys. 2 27(11):2203-6
78. Yamamoto N, Sakata S. 1989. Jpn. J. Appl. Phys. 2. 28(11):L2065-68
79. Yamamoto N, Homma Y, Sakata S, Hosokawa Y. 1994. In Materials Reliability in Microelectronics IV, 338: 209-14. San Francisco: Mater. Res. Soc.
80. Yamamoto N, Sakata S. 1995. Jpn. J. Appl. Phys. 2 34(6a):L664-67
81. Wang P-C, Cargill GS, Noyan IC. 1994. In Applications of Synchrotron Radiation Techniques to Materials Science, 375: Boston: Mater. Res. Soc.
82. Brundle CR, Evans CA Jr, Wilson S. 1992. Encyclopedia of materials characterization: surfaces, interfaces, thin films. In Materials Characterization Series, ed CR Brundle, CA Evans, Jr. Boston: ButterworthHeinemann
83. Ma Q, Chiras S, Clarke DR, Suo Z. 1995. J. Appl. Phys. 78(3): 1614-22
84. De Wolf I, Maes HE, Moffet J, Ignat M. 1995. In Materials Reliability in Microelectronics V, 391:109-14. San Francisco: Mater. Res. Soc.
85. Molis SE, Clarke DR. 1990. J. Am. Ceram. Soc. 73(11):3189-94
86. Ma Q, Clarke DR. 1993. J. Am. Ceram. Soc. 76(6): 1433-40
87. De Wolf I, Vanhellemont J, RomanoRodriguez A, Norstrom H. 1992. J. Appl. Phys. 71(2):898-906
88. Sugano S, Tanabe Y. 1958. J. Phys. Soc. Jpn. 13(8):880-910
89. Schawlow AL. 1961. In Advances in Quantum Electronics, ed. JR Singer, pp. 50-64. New York: Columbia Univ. Press
90. Grabner L. 1978. J. Appl. Phys. 49(2):580-83
91. Ma Q, Clarke DR. 1993. Acta Metall. Mater. 41(6): 1811-16
92. Ma Q, Clarke DR. 1993. Acta Metall. Mater. 41(6):1817-23
93. Ma Q, Shaw MC, He MY, Dalgleish BJ, Clarke DR, Evans AG. 1995. Acta Metall. Mater. 43(6):2137-42
94. Dauskardt RH, Veirs DK, Ritchie RO. 1989. J. Am. Ceram. Soc. 72(7): 1124-30
95. Spence JCH, Zuo JM. 1992. Electron Microdiffraction. New York: Plenum
96. Janssens KGF, Vanhellemont J, De Graef M, Van der Biest O. 1992. Ultramicroscopy 45(3-4):323-35
97. Janssens KGF, Van der Biest O, Vanhellemont J, Maes HE. 1993. In Defect Recognition and Image Processing in Semiconductors and Devices, 21-24. Santander: Institute of Physics
98. Janssens KGF, Vanhellemont J, Maes HE, Van der Biest O. 1993. In Microscopy of Semiconducting Materials 1993, pp. 225-28. Oxford, UK: IOP
99. Armigliato A, Balboni R, De Wolf I, Frabboni S, Janssens KGF, Vanhellemont J. 1993. In Microscopy of Semiconducting Materials 1993, 229-34. Oxford, UK: IOP
100. Freund LB. 1987. J. Appl. Mech. 54: 553-57
101. Freund LB. 1992. MRS Bull. 17(7): 52-60
102. Griffin AJ, Brotzen FR, Dunn C. 1986. Scripta Metall. 20(9):1271-72
103. Venkatraman R, Bravman JC. 1992. J. Mater. Res. 7(8):2040-48
104. Thompson CV. 1993. J. Mater. Res. 8(2):237-38
105. Venkatraman R, Bravman JC, Nix WD, Davies PW, Flinn PA, Fraser DB. 1990. J. Electron. Mater. 19(11):1231-37
106. Venkatraman R, Chen S, Bravman JC. 1991. J. Vac. Sci. Technol. A 9(4):2536-42
107. Venkatraman R. 1992. Plasticity and flow stresses in aluminum thin films on silicon. PhD thesis. Stanford Univ. 181 pp.
108. Vinci RP, Zielinski EZ, Bravman JC. 1994. In Thin Films: Stresses and Mechanical Properties V, 356: 459-64. Boston: Mater. Res. Soc.
109. Flinn PA. 1991. J. Mater. Res. 6(7): 1498
110. Thouless MD, Gupta J, Harper JME. 1993. J. Mater. Res. 8(8):1845-52
111. Frost HJ, Ashby MF. 1982. Deformation-Mechanism Maps: The Plasticity and Creep of Metals and Ceramics, New York: Pergamon
112. Keller R-M, Bader S, Vinci RP, Arzt E. 1994. In Thin Films: Stresses and Mechanical Properties V, 356: 453-58. Boston: Mater. Res. Soc.
113. Keller R-M, Kuschke W-M, Kretschmann A, Bader S, Vinci RP, Arzt E. 1995. In Materials Reliability in Microelectronics V, 391:309-14. San Francisco: Mater. Res. Soc.
114. Chidambarrao D, Rodbell KP, Thouless MD, DeHaven PW. 1994. In Materials Reliability in Microelectronics IV, 338:261-68. San Francisco: Mater. Res. Soc.
115. Besser PR, Sanchez JE Jr, Brennan S, Bravman JC, Takaoka G, Yamada I. 1994. In Polycrystalline Thin Films: Structure, Texture, Properties and Applications, 343:659-64. San Francisco: Mater. Res. Soc.
116. Thompson CV. 1990. In Annual Review of Materials Science, ed. RA Huggins, JA Giordmaine, JB Wachtman, Jr. pp. 245-68. Palo Alto: Annual Reviews
117. Thompson CV, Smith HI. 1987. Proc. Mater. Res. Soc. Symp. 57: 499-512
118. Sanchez JE Jr, Arzt E. 1992. Scripta Metall. Mater. 27(3):285-90
119. Sanchez JE Jr. 1994. In Polycrystalline Thin Films: Structure, Texture, Properties and Applications, 343: 641-52. San Francisco: Mater. Res. Soc.
120. Thompson CV. 1993. Scripta Metall. Mater. 28:167-72
121. Zielinski EM, Vinci RP, Bravman JC. 1994. In Thin Films: Stresses and Mechanical Properties V, 356: 429-34. Boston: Mater. Res. Soc.
122. Zielinski EM, Vinci RP, Bravman JC. 1994. J. Appl. Phys. 76(8): 4516-22
123. Zielinski EM, Vinci RP, Bravman JC. 1995. Appl. Phys. Lett. 67(8): 1078-80
124. Flora JA, Carel R, Thompson CV. 1993. In Mechanisms of Thin Film Evolution, 317:419-24. Boston: Mater. Res. Soc.
125. Carel R, Thompson CV, Frost HJ. 1994. In Polycrystalline Thin Films: Structure, Texture, Properties and Applications, 343:49-54. San Francisco: Mater. Res. Soc.
126. Zielinski EM. 1995. The influence of strain energy on abnormal grain growth in copper thin films. PhD thesis. Stanford Univ. 134 pp.
127. Baker SP, Nix WD. 1994. J. Mater. Res. 9(12):3145-52
128. Baker SP, Nix WD. 1994. J. Mater. Res. 9(12):3131-44
129. Barnett SA, Shinn M. 1994. In Annual Review of Materials Science, ed. MC Flemings, JB Wachtman Jr, EN Kaufmann, J Giordmaine, pp. 481-511. Palo Alto: Annual Reviews
130. Shinn M, Hultman L, Barnett SA. 1992. J. Mater. Res. 7(4):901-11
131. Shinn M, Barnett SA. 1994. Appl. Phys. Lett. 64(1):61-63
132. Mirkarimi PB, Barnett SA, Hubbard KM, Jervis TR, Hultman L. 1994. J. Mater. Res. 9(6): 1456-67
133. Koehler JS. 1970. Phys. Rev. B 2:547
134. Lehoczky SL. 1987. J. Appl. Phys. 49:5479
135. Doerner MF. 1987. Mechanical properties of metallic thin films on substrates using sub-micron indentation methods and thin film stress measurement techniques. PhD thesis. Stanford Univ. 195 pp.
136. Daniels BJ. 1995. The effect of structure on the mechanical and magnetotransport properties of thin films and superlattices. PhD thesis. Stanford Univ. 225 pp.
137. Cammarata RC, Schlesinger TE, Kim C, Qadri SB, Edelstein AS. 1990. Appl. Phys. Lett. 56(19): 1862-64
138. Li D, Chu X, Cheng S-C, Lin X-W, Dravid VP, Chung Y-W, et al. 1995. Appl. Phys. Lett. 67(2):203-5
139. LIU AY, Cohen ML. 1989. Science 245(25):841-42
140. Barnett SA. 1993. In Physics of Thin Films, ed. MH Francombe, JL Vossen, p. 1. San Diego: Academic
141. Cammarata RC. 1994. Thin Solid Films 240(1-2):82-87
142. Flinn PA, Chiang C. 1990. J. Appl. Phys. 67:2927-31
143. Greenebaum B, Sauter AI, Flinn PA, Nix WD. 1991. Appl. Phys. Lett. 58: 1845-47
144. Sauter AI, Nix WD. 1990. In Thin Films: Stresses and Mechanical Properties II, 188:15-20. San Francisco: Mater. Res. Soc.
145. Sauter AI, Nix WD. 1992. IEEE Trans. Comp. Hybrids, Manuf. Technol. 15:594-600
146. Hinode K, Asano I, Ishiba T, Homma Y. 1990. J. Vac. Sci. Technol B 8(3): 495-98
147. Mack AS, Flinn P. 1994. In Thin Films: Stresses and Mechanical Properties V, 356:465-70. Boston: Mater. Res. Soc.
148. Besser PR, Mack AS, Fraser DB, Bravman JC. 1993. J. Electrochem. Soc. 140:1769-72
149. Besser PR, Marieb TM, Bravman JC, Flinn PA. 1994. In Materials Reliability in Microelectronics IV, 338: 275-80. San Francisco: Mater. Res.
150. Vinci RP, Zielinski EM, Bravman JC. 1994. In Materials Reliability in Microelectronics IV, 338:289-94. San Francisco: Mater. Res. Soc.
151. Radier MJ, Crowder CE, Shaffer EO, Townsend PH. 1992. In Electronic Packaging Materials Science VI, 264:243-49. San Francisco: Mater. Res. Soc.
152. Korhonen MA, Borgesen P, Li C-Y. 1992. MRS Bull. 17(7):61-68