Formation of slit-like voids at trench corners of damascene Cu interconnects

Materials Transactions

Volumn 43, Issue 7, 2002, Pages 1633-1637

  Sekiguchi, Atsuko ^a   Koike, Junichi ^a   Maruyama, Kouichi ^a  

^a NONE

Author keywords

Copper; Interconnect; Interface; Stress; Void

Indexed keywords

CRYSTAL MICROSTRUCTURE; DELAMINATION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); ION BEAMS; SHEAR STRESS; STRESS ANALYSIS; STRESS CONCENTRATION; THERMAL STRESS;

FOCUSED ION BEAMS (FIB);

ALUMINUM COPPER ALLOYS;

EID: 0036630640     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.1633     Document Type: Article

References (18)