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Acta Materialia

Volumn 49, Issue 13, 2001, Pages 2395-2403

Constrained diffusional creep in UHV-produced copper thin films

(3) Weiss, D a Gao, H a Arzt, E a

a UNIVERSITY OF STUTTGART (Germany)

Author keywords

Aluminum; Copper; Creep; Mechanical properties; Thin films

Indexed keywords

ALUMINUM COPPER ALLOYS; ANNEALING; COPPER; CREEP; DIFFUSION IN SOLIDS; DISLOCATIONS (CRYSTALS); OXIDATION; PASSIVATION; SEGREGATION (METALLOGRAPHY); SILICON; SPUTTERING; STRESS RELAXATION; THIN FILMS; ULTRAHIGH VACUUM;

DIFFUSIONAL CREEP;

METALLIC FILMS;

EID: 0035426516 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/S1359-6454(01)00168-9 Document Type: Article

Times cited : (141)

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