|
|
Volumn 49, Issue 13, 2001, Pages 2365-2372
|
|
Dislocation accumulation and strengthening in Cu thin films
a
a
IFW DRESDEN
(Germany)
|
|
Author keywords
Copper; Dislocations; Mechanical properties; Stress; Thin films
|
|
Indexed keywords
COOLING;
COPPER;
DISLOCATIONS (CRYSTALS);
INTERFACES (MATERIALS);
NITROGEN;
QUENCHING;
SILICON;
STRAIN HARDENING;
STRENGTHENING (METAL);
STRESS ANALYSIS;
STRESS RELAXATION;
THERMAL CYCLING;
THIN FILMS;
PEACH-KOEHLER DISLOCATION-INTERACTION FORCES;
METALLIC FILMS;
|
|
EID: 0035426513
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/S1359-6454(01)00170-7 Document Type: Article |
|
Times cited : (39)
|
|
References (22)
|
