Copper metallization reliability

Microelectronics Reliability

Volumn 39, Issue 11, 1999, Pages 1595-1602

  Lloyd, J R ^a   Clemens, J ^b   Snede, R ^b  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b Aetrium Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROMIGRATION; METALLIZING;

METALLIZATION OVERSTRESSING; SUBMICRON LINES;

MICROELECTRONICS;

EID: 0033222020     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(99)00177-8     Document Type: Article

References (21)

1. Lloyd J.R., Clement J.J. Thin Solid Films. 262:1995;125.
2. Park C.W., Vook R.W. Appl. Phys. Lett. 59:1991;175.
3. Hu C-K., Small M.B., Ho P.S. MRS Proceedings Volume. 265:1992;171.
4. Yamada H, Hosji T, Takewaki T, Shibata T, Ohmi T, Nittam T. International Electron Devices Meeting, Technical Digest, 1993. p. 269.
5. Ohmi T, Hoshi T, Yoshie T, Takewaki T, Otsuki M, Shibata T, Nitta T. Proceedings of International Electron Devices Meeting, IEEE New York, 1991. p. 285.
6. Luther et al. Proceedings of IEEE VMIC Conference, 1993. p. 15.
7. Kang H-K, Cho JSH, Asano I, Wong SS. Proceedings of IEEE VMIC Conference, 1992. p. 337.
8. Kang H-K, Asano I, Ryu C, Wong SS. Proceedings of IEEE VMIC Conference, 1993. p. 223.
9. Cho JSH, Kang H-K, Ryu C, Wong SS. Proceedings of the International Electron. Devices Meeting, Technical Digest, 1993. p. 265.
10. Shingobura S., Nakasaki Y. Appl. Phys. Lett. 58:1991;42.
11. Igarashi Y, Yamanobe T, Jinbo H, Ito T. Proceedings of the 1994 Symposium on VLSI Technology, Digest Technical Papers, 1994. p. 57.
12. Arnoud L., Gonella R., Tartavel G., Torres J., Gounelle C., Gobil Y., Morand Y. Microelectron. Reliab. 38:1998;1029.
13. Foley S., Scorzoni A., Balboni R., Impronta M., De Munari I., Mathewson A., Fantini F. Microlectron. Reliab. 38:1998;1021.
14. Filippi R.G., Levine E.N., Rodbell K.P. J. Vac. Sci. Technol. B15:1997;750.
15. Onoda H, Narita T, Touchi K, Hashimoto K. Proceedings of 34th Annual IRPS, 1996. p. 139.
16. Shih D-Y, Ficalora P. Proceedings of 16th Annual International Reliab. Phys. Symposium, IEEE New York, 1978. p. 268.
17. Lloyd JR. Proceedings of Mat. Res. Society Symposium Proc. "Materials Reliability in Microelectronics III", vol. 265, Materials Research Society, Pittsburgh, PA, 1993. p. 177.
18. Nitta T., Ohmi T., Otsuki M., Takewaki T., Shibata T. J. Electrochem. Soc. 139:1992;922.
19. Takewaki T., Hosji T., Shibata T., Ohmi T., Nitta T. Proc. Soc. Photo-Opt. Instrum. Eng. 1805:1992;3.
20. Nitta T., Ohmi T., Hoshi T., Takewaki T., Shibata T. IEICE Trans. Electron. Dev. E76-C:1993;626.
21. Nitta T., Ohmi T., Hoshi T., Sakai S., Sakaibara K., Imai S., Shibata T. J. Electrochem. Soc. 140:1993;1131.